DE3629054A1 - Vorrichtung zum plasmaaetzen von leiterplatten od. dgl. - Google Patents
Vorrichtung zum plasmaaetzen von leiterplatten od. dgl.Info
- Publication number
- DE3629054A1 DE3629054A1 DE19863629054 DE3629054A DE3629054A1 DE 3629054 A1 DE3629054 A1 DE 3629054A1 DE 19863629054 DE19863629054 DE 19863629054 DE 3629054 A DE3629054 A DE 3629054A DE 3629054 A1 DE3629054 A1 DE 3629054A1
- Authority
- DE
- Germany
- Prior art keywords
- chamber
- rails
- circuit boards
- printed circuit
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001020 plasma etching Methods 0.000 title claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 9
- 239000000112 cooling gas Substances 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 238000010276 construction Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT251785A AT383147B (de) | 1985-08-28 | 1985-08-28 | Vorrichtung zum plasmaaetzen von leiterplatten od.dgl. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3629054A1 true DE3629054A1 (de) | 1987-03-12 |
Family
ID=3535699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863629054 Withdrawn DE3629054A1 (de) | 1985-08-28 | 1986-08-27 | Vorrichtung zum plasmaaetzen von leiterplatten od. dgl. |
Country Status (4)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3731444A1 (de) * | 1987-09-18 | 1989-03-30 | Leybold Ag | Vorrichtung zum beschichten von substraten |
| DE3935002A1 (de) * | 1989-10-20 | 1991-04-25 | Plasonic Oberflaechentechnik G | Verfahren und vorrichtung zur kontinuierlichen bearbeitung von substraten |
| DE10103341C2 (de) * | 2000-01-26 | 2003-08-07 | Matsushita Electric Ind Co Ltd | Plasmabehandlungsvorrichtung und Verfahren |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104669A (en) * | 1980-12-19 | 1982-06-29 | Hitachi Ltd | Multistage chemical vessel treating device |
-
1985
- 1985-08-28 AT AT251785A patent/AT383147B/de not_active IP Right Cessation
-
1986
- 1986-08-26 CH CH342386A patent/CH672037A5/de not_active IP Right Cessation
- 1986-08-27 JP JP20121886A patent/JPS6286184A/ja active Granted
- 1986-08-27 DE DE19863629054 patent/DE3629054A1/de not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3731444A1 (de) * | 1987-09-18 | 1989-03-30 | Leybold Ag | Vorrichtung zum beschichten von substraten |
| DE3935002A1 (de) * | 1989-10-20 | 1991-04-25 | Plasonic Oberflaechentechnik G | Verfahren und vorrichtung zur kontinuierlichen bearbeitung von substraten |
| DE10103341C2 (de) * | 2000-01-26 | 2003-08-07 | Matsushita Electric Ind Co Ltd | Plasmabehandlungsvorrichtung und Verfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6348950B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-10-03 |
| CH672037A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-10-13 |
| JPS6286184A (ja) | 1987-04-20 |
| ATA251785A (de) | 1986-10-15 |
| AT383147B (de) | 1987-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |