ATA251785A - Vorrichtung zum plasmaaetzen von leiterplatten od.dgl. - Google Patents

Vorrichtung zum plasmaaetzen von leiterplatten od.dgl.

Info

Publication number
ATA251785A
ATA251785A AT251785A AT251785A ATA251785A AT A251785 A ATA251785 A AT A251785A AT 251785 A AT251785 A AT 251785A AT 251785 A AT251785 A AT 251785A AT A251785 A ATA251785 A AT A251785A
Authority
AT
Austria
Prior art keywords
plasming
pcbs
plasming pcbs
Prior art date
Application number
AT251785A
Other languages
English (en)
Other versions
AT383147B (de
Original Assignee
Voest Alpine Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Voest Alpine Ag filed Critical Voest Alpine Ag
Priority to AT251785A priority Critical patent/AT383147B/de
Priority to CH342386A priority patent/CH672037A5/de
Priority to JP20121886A priority patent/JPS6286184A/ja
Priority to DE19863629054 priority patent/DE3629054A1/de
Publication of ATA251785A publication Critical patent/ATA251785A/de
Application granted granted Critical
Publication of AT383147B publication Critical patent/AT383147B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
AT251785A 1985-08-28 1985-08-28 Vorrichtung zum plasmaaetzen von leiterplatten od.dgl. AT383147B (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AT251785A AT383147B (de) 1985-08-28 1985-08-28 Vorrichtung zum plasmaaetzen von leiterplatten od.dgl.
CH342386A CH672037A5 (de) 1985-08-28 1986-08-26
JP20121886A JPS6286184A (ja) 1985-08-28 1986-08-27 プラズマエツチング装置
DE19863629054 DE3629054A1 (de) 1985-08-28 1986-08-27 Vorrichtung zum plasmaaetzen von leiterplatten od. dgl.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT251785A AT383147B (de) 1985-08-28 1985-08-28 Vorrichtung zum plasmaaetzen von leiterplatten od.dgl.

Publications (2)

Publication Number Publication Date
ATA251785A true ATA251785A (de) 1986-10-15
AT383147B AT383147B (de) 1987-05-25

Family

ID=3535699

Family Applications (1)

Application Number Title Priority Date Filing Date
AT251785A AT383147B (de) 1985-08-28 1985-08-28 Vorrichtung zum plasmaaetzen von leiterplatten od.dgl.

Country Status (4)

Country Link
JP (1) JPS6286184A (de)
AT (1) AT383147B (de)
CH (1) CH672037A5 (de)
DE (1) DE3629054A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3731444A1 (de) * 1987-09-18 1989-03-30 Leybold Ag Vorrichtung zum beschichten von substraten
DE3935002A1 (de) * 1989-10-20 1991-04-25 Plasonic Oberflaechentechnik G Verfahren und vorrichtung zur kontinuierlichen bearbeitung von substraten
MY120869A (en) * 2000-01-26 2005-11-30 Matsushita Electric Ind Co Ltd Plasma treatment apparatus and method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104669A (en) * 1980-12-19 1982-06-29 Hitachi Ltd Multistage chemical vessel treating device

Also Published As

Publication number Publication date
CH672037A5 (de) 1989-10-13
DE3629054A1 (de) 1987-03-12
JPS6348950B2 (de) 1988-10-03
JPS6286184A (ja) 1987-04-20
AT383147B (de) 1987-05-25

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee