DE3579572D1 - Mehrschichtiger trockener positiv arbeitender photolack. - Google Patents
Mehrschichtiger trockener positiv arbeitender photolack.Info
- Publication number
- DE3579572D1 DE3579572D1 DE8585309464T DE3579572T DE3579572D1 DE 3579572 D1 DE3579572 D1 DE 3579572D1 DE 8585309464 T DE8585309464 T DE 8585309464T DE 3579572 T DE3579572 T DE 3579572T DE 3579572 D1 DE3579572 D1 DE 3579572D1
- Authority
- DE
- Germany
- Prior art keywords
- layer dry
- positively working
- working photo
- photo paint
- dry positively
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/686,838 US4571374A (en) | 1984-12-27 | 1984-12-27 | Multilayer dry-film positive-acting laminable photoresist with two photoresist layers wherein one layer includes thermal adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3579572D1 true DE3579572D1 (de) | 1990-10-11 |
Family
ID=24757964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585309464T Expired - Lifetime DE3579572D1 (de) | 1984-12-27 | 1985-12-23 | Mehrschichtiger trockener positiv arbeitender photolack. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4571374A (de) |
EP (1) | EP0186510B1 (de) |
JP (1) | JPH06105354B2 (de) |
KR (1) | KR940001551B1 (de) |
CA (1) | CA1265696A (de) |
DE (1) | DE3579572D1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4762766A (en) * | 1986-01-14 | 1988-08-09 | Kroy Inc. | Dry transfer film with photosensitized color carrying layer and photosensitized pressure sensitive adhesive layer wherein photosensitizer is o-quinone diazide |
CA1321315C (en) * | 1986-04-11 | 1993-08-17 | Yoichi Mori | Printing plate |
DE3621376A1 (de) * | 1986-06-26 | 1988-01-07 | Hoechst Ag | Strahlungsempfindliches aufzeichnungsmaterial |
US4863827A (en) * | 1986-10-20 | 1989-09-05 | American Hoechst Corporation | Postive working multi-level photoresist |
US5364731A (en) * | 1987-01-30 | 1994-11-15 | Konica Corporation | Multi-color transfer image forming method to form color proofs |
EP0367762A1 (de) * | 1987-06-10 | 1990-05-16 | Siemens Aktiengesellschaft | Anordnung zur strukturierung durch fotolithografie und verfahren zu ihrer herstellung |
JP2635353B2 (ja) * | 1988-02-29 | 1997-07-30 | 日本合成化学工業株式会社 | 画像形成方法 |
US4939229A (en) * | 1989-05-12 | 1990-07-03 | Rohm And Haas Company | Method for preparing lithographically sensitive branched novolaks using a mannich base intermediate |
GB8910961D0 (en) * | 1989-05-12 | 1989-06-28 | Am Int | Method of forming a pattern on a surface |
JPH0685465B2 (ja) * | 1989-06-12 | 1994-10-26 | 株式会社トクヤマ | 電磁シールド配線板の製造方法 |
US5176973A (en) * | 1989-09-28 | 1993-01-05 | Minnesota Mining And Manufacturing Company | Low optical dot gain pre-press proofs wherein the first down adhesive layer thickness is at least twice that of any additional thin adhesive layer |
US5532105A (en) * | 1992-08-07 | 1996-07-02 | Hitachi Chemical Company, Ltd. | Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board |
US5288589A (en) * | 1992-12-03 | 1994-02-22 | Mckeever Mark R | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
US5405731A (en) * | 1992-12-22 | 1995-04-11 | E. I. Du Pont De Nemours And Company | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
US5415971A (en) * | 1993-04-02 | 1995-05-16 | The Chromaline Corporation | Photoresist laminate including photoimageable adhesive layer |
US5645963A (en) * | 1995-11-20 | 1997-07-08 | Minnesota Mining And Manufacturing Company | Method for making color filter elements using laminable colored photosensitive materials |
US6462107B1 (en) | 1997-12-23 | 2002-10-08 | The Texas A&M University System | Photoimageable compositions and films for printed wiring board manufacture |
US7361444B1 (en) * | 1998-02-23 | 2008-04-22 | International Business Machines Corporation | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof |
CN100472330C (zh) * | 2002-01-25 | 2009-03-25 | 捷时雅株式会社 | 双层层叠物及使用它的构图方法 |
DE10260235B4 (de) * | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
US7248800B2 (en) | 2003-05-30 | 2007-07-24 | Canon Kabushiki Kaisha | Optical receiver, optical transmitter and optical transceiver |
TW200600975A (en) * | 2004-02-20 | 2006-01-01 | Jsr Corp | Bilayer laminated film for bump formation and method of bump formation |
JP4837396B2 (ja) * | 2006-02-23 | 2011-12-14 | 富士フイルム株式会社 | 多層材料、及び樹脂パターンの形成方法 |
WO2007097112A1 (ja) * | 2006-02-23 | 2007-08-30 | Fujifilm Corporation | 多層材料、樹脂パターンの形成方法、基板、表示装置及び液晶表示装置 |
JP4762756B2 (ja) * | 2006-02-23 | 2011-08-31 | 富士フイルム株式会社 | 多層材料及び樹脂パターンの形成方法 |
CN103091987B (zh) * | 2008-12-26 | 2016-11-23 | 日立化成株式会社 | 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件 |
JP5865859B2 (ja) | 2013-03-22 | 2016-02-17 | 株式会社東芝 | 光結合装置 |
KR20220101662A (ko) | 2019-11-14 | 2022-07-19 | 메르크 파텐트 게엠베하 | 알칼리-가용성 아크릴 수지를 포함하는 dnq-타입 포토레지스트 조성물 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE755709A (fr) * | 1969-10-29 | 1971-02-15 | Shipley Co | Procede d'application d'une reserve photographique sur un support et produit obtenu |
JPS5421089B2 (de) * | 1973-05-29 | 1979-07-27 | ||
CA1051707A (en) * | 1973-10-25 | 1979-04-03 | Michael Gulla | Photoresist film with non-photosensitive resist layer |
US3982943A (en) * | 1974-03-05 | 1976-09-28 | Ibm Corporation | Lift-off method of fabricating thin films and a structure utilizable as a lift-off mask |
US4191573A (en) * | 1974-10-09 | 1980-03-04 | Fuji Photo Film Co., Ltd. | Photosensitive positive image forming process with two photo-sensitive layers |
JPS5921540B2 (ja) * | 1977-10-26 | 1984-05-21 | セイコーエプソン株式会社 | フオトレジストパタ−ンの形成方法 |
US4180604A (en) * | 1977-12-30 | 1979-12-25 | International Business Machines Corporation | Two layer resist system |
BE883410A (fr) * | 1979-06-15 | 1980-11-21 | Du Pont | Film de photoresist pouvant etre developpe par un solvant |
US4247616A (en) * | 1979-07-27 | 1981-01-27 | Minnesota Mining And Manufacturing Company | Positive-acting photoresist composition |
US4260673A (en) * | 1979-09-05 | 1981-04-07 | Minnesota Mining And Manufacturing Company | Single sheet color proofing system |
US4352870A (en) * | 1979-11-27 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | High resolution two-layer resists |
JPS56126836A (en) * | 1980-03-11 | 1981-10-05 | Ricoh Co Ltd | Photosensitive lithographic original plate |
US4413051A (en) * | 1981-05-04 | 1983-11-01 | Dynamics Research Corporation | Method for providing high resolution, highly defined, thick film patterns |
JPS5811943A (ja) * | 1981-07-16 | 1983-01-22 | Ricoh Co Ltd | スクリ−ンレス平版印刷原版 |
DE3382145D1 (de) * | 1982-09-29 | 1991-03-07 | Minnesota Mining & Mfg | Mehrschichtiger trockenphotolack. |
US4504566A (en) * | 1982-11-01 | 1985-03-12 | E. I. Du Pont De Nemours And Company | Single exposure positive contact multilayer photosolubilizable litho element with two quinone diazide layers |
US4464458A (en) * | 1982-12-30 | 1984-08-07 | International Business Machines Corporation | Process for forming resist masks utilizing O-quinone diazide and pyrene |
DE3340154A1 (de) * | 1983-11-07 | 1985-05-15 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von bildmaessig strukturierten resistschichten und fuer dieses verfahren geeigneter trockenfilmresist |
-
1984
- 1984-12-27 US US06/686,838 patent/US4571374A/en not_active Expired - Lifetime
-
1985
- 1985-11-14 CA CA000495316A patent/CA1265696A/en not_active Expired - Fee Related
- 1985-12-23 EP EP85309464A patent/EP0186510B1/de not_active Expired - Lifetime
- 1985-12-23 JP JP60290299A patent/JPH06105354B2/ja not_active Expired - Lifetime
- 1985-12-23 DE DE8585309464T patent/DE3579572D1/de not_active Expired - Lifetime
- 1985-12-26 KR KR1019850009798A patent/KR940001551B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR860005258A (ko) | 1986-07-21 |
JPS61156251A (ja) | 1986-07-15 |
CA1265696A (en) | 1990-02-13 |
EP0186510A2 (de) | 1986-07-02 |
JPH06105354B2 (ja) | 1994-12-21 |
KR940001551B1 (ko) | 1994-02-24 |
EP0186510A3 (en) | 1988-01-27 |
US4571374A (en) | 1986-02-18 |
EP0186510B1 (de) | 1990-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |