DE3543588C2 - - Google Patents

Info

Publication number
DE3543588C2
DE3543588C2 DE3543588A DE3543588A DE3543588C2 DE 3543588 C2 DE3543588 C2 DE 3543588C2 DE 3543588 A DE3543588 A DE 3543588A DE 3543588 A DE3543588 A DE 3543588A DE 3543588 C2 DE3543588 C2 DE 3543588C2
Authority
DE
Germany
Prior art keywords
electrode
arrangement
workpieces
holding
broad sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3543588A
Other languages
German (de)
English (en)
Other versions
DE3543588A1 (de
Inventor
George Martin Scottsdale Ariz. Us Engle
Richard Stephen Paradise Valley Ariz. Us Rosler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Semiconductor Materials America Inc
Original Assignee
Advanced Semiconductor Materials America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Materials America Inc filed Critical Advanced Semiconductor Materials America Inc
Publication of DE3543588A1 publication Critical patent/DE3543588A1/de
Application granted granted Critical
Publication of DE3543588C2 publication Critical patent/DE3543588C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H10P72/135—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
DE19853543588 1984-12-10 1985-12-10 Vorrichtung zum bearbeiten von halbleiterplaettchen oder dergleichen Granted DE3543588A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/679,898 US4610748A (en) 1984-12-10 1984-12-10 Apparatus for processing semiconductor wafers or the like

Publications (2)

Publication Number Publication Date
DE3543588A1 DE3543588A1 (de) 1986-07-17
DE3543588C2 true DE3543588C2 (https=) 1991-10-10

Family

ID=24728843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853543588 Granted DE3543588A1 (de) 1984-12-10 1985-12-10 Vorrichtung zum bearbeiten von halbleiterplaettchen oder dergleichen

Country Status (6)

Country Link
US (1) US4610748A (https=)
JP (1) JPS61203634A (https=)
DE (1) DE3543588A1 (https=)
FR (1) FR2574319B1 (https=)
GB (2) GB2169443B (https=)
NL (1) NL8503386A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799451A (en) * 1987-02-20 1989-01-24 Asm America, Inc. Electrode boat apparatus for processing semiconductor wafers or the like
US5001327A (en) * 1987-09-11 1991-03-19 Hitachi, Ltd. Apparatus and method for performing heat treatment on semiconductor wafers
US4882028A (en) * 1988-01-22 1989-11-21 Micron Technology, Inc. R-F electrodes for removably providing electrical energy to an apparatus during R-F energy reactive treatment processes
US4873942A (en) * 1988-06-08 1989-10-17 The Stackpole Corporation Plasma enhanced chemical vapor deposition wafer holding fixture
US5421891A (en) * 1989-06-13 1995-06-06 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5175021A (en) * 1990-02-01 1992-12-29 Advanced Semiconductor Materials America, Inc. Transmission line for providing power to an electrode boat in a plasma enhanced chemical vapor deposition system
JPH05209279A (ja) * 1991-10-29 1993-08-20 Canon Inc 金属膜形成装置および金属膜形成法
JP2631434B2 (ja) * 1992-02-06 1997-07-16 義知 村田 エアーフラッシャー
US5355832A (en) * 1992-12-15 1994-10-18 Advanced Surface Technology, Inc. Polymerization reactor
US6461980B1 (en) 2000-01-28 2002-10-08 Applied Materials, Inc. Apparatus and process for controlling the temperature of a substrate in a plasma reactor chamber
FI123170B (fi) * 2009-05-26 2012-11-30 Beneq Oy Järjestely substraatin käsittelemiseksi sekä asennusalusta substraattia varten
DE102015004352A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Behandlungsvorrichtung für Wafer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233109A (en) * 1976-01-16 1980-11-11 Zaidan Hojin Handotai Kenkyu Shinkokai Dry etching method
JPS53112066A (en) * 1977-03-11 1978-09-30 Fujitsu Ltd Plasma treatment apparatus
US4223048A (en) * 1978-08-07 1980-09-16 Pacific Western Systems Plasma enhanced chemical vapor processing of semiconductive wafers
US4222839A (en) * 1978-09-21 1980-09-16 Motorola, Inc. Workpiece holder and method for plasma reactor apparatus
US4287851A (en) * 1980-01-16 1981-09-08 Dozier Alfred R Mounting and excitation system for reaction in the plasma state
US4282077A (en) * 1980-07-03 1981-08-04 General Dynamics, Pomona Division Uniform plasma etching system
US4381965A (en) * 1982-01-06 1983-05-03 Drytek, Inc. Multi-planar electrode plasma etching
US4424096A (en) * 1982-12-23 1984-01-03 Western Electric Co., Inc. R-F Electrode type workholder and methods of supporting workpieces during R-F powered reactive treatment

Also Published As

Publication number Publication date
NL8503386A (nl) 1986-07-01
GB8530304D0 (en) 1986-01-22
GB2201547B (en) 1989-07-05
FR2574319A1 (fr) 1986-06-13
GB2169443A (en) 1986-07-09
GB2169443B (en) 1989-07-12
GB8803604D0 (en) 1988-03-16
GB2201547A (en) 1988-09-01
JPS61203634A (ja) 1986-09-09
DE3543588A1 (de) 1986-07-17
US4610748A (en) 1986-09-09
FR2574319B1 (fr) 1990-01-19

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee