DE3484738D1 - Elektronisches geraet mit einer packung. - Google Patents

Elektronisches geraet mit einer packung.

Info

Publication number
DE3484738D1
DE3484738D1 DE8484116284T DE3484738T DE3484738D1 DE 3484738 D1 DE3484738 D1 DE 3484738D1 DE 8484116284 T DE8484116284 T DE 8484116284T DE 3484738 T DE3484738 T DE 3484738T DE 3484738 D1 DE3484738 D1 DE 3484738D1
Authority
DE
Germany
Prior art keywords
pack
electronic device
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484116284T
Other languages
English (en)
Inventor
Noriaki Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3484738D1 publication Critical patent/DE3484738D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Details Of Resistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laser Beam Processing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE8484116284T 1984-04-06 1984-12-24 Elektronisches geraet mit einer packung. Expired - Lifetime DE3484738D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59067713A JPS60211960A (ja) 1984-04-06 1984-04-06 半導体装置

Publications (1)

Publication Number Publication Date
DE3484738D1 true DE3484738D1 (de) 1991-07-25

Family

ID=13352872

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484116284T Expired - Lifetime DE3484738D1 (de) 1984-04-06 1984-12-24 Elektronisches geraet mit einer packung.

Country Status (4)

Country Link
EP (1) EP0157008B1 (de)
JP (1) JPS60211960A (de)
DE (1) DE3484738D1 (de)
MY (1) MY100971A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720741A (en) * 1986-06-26 1988-01-19 American Telephone And Telegraph Company, At&T Technologies, Inc. Antistatic and antitack coating for circuit devices
DE3713298A1 (de) * 1987-04-18 1988-11-03 Telefunken Electronic Gmbh Kunststoffgehaeuse fuer halbleiterbauelemente mit abstandsnocken
DE4338774A1 (de) * 1993-11-12 1995-05-18 Baasel Carl Lasertech Vorrichtung zum Beschriften von Werkstücken

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device
JPS5835367B2 (ja) * 1978-07-18 1983-08-02 ミツミ電機株式会社 回路素子基板及びその製造方法
US4258652A (en) * 1979-06-01 1981-03-31 Stillman Ben S DIP Top coating apparatus
US4510519A (en) * 1982-03-26 1985-04-09 Motorola, Inc. Electrically isolated semiconductor power device
JPS5928361A (ja) * 1982-08-09 1984-02-15 Nec Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
EP0157008A2 (de) 1985-10-09
EP0157008A3 (en) 1986-10-08
EP0157008B1 (de) 1991-06-19
JPS60211960A (ja) 1985-10-24
MY100971A (en) 1991-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee