DE3475535D1 - Aqueous alcaline bath for chemically plating copper or nickel - Google Patents
Aqueous alcaline bath for chemically plating copper or nickelInfo
- Publication number
- DE3475535D1 DE3475535D1 DE8484115513T DE3475535T DE3475535D1 DE 3475535 D1 DE3475535 D1 DE 3475535D1 DE 8484115513 T DE8484115513 T DE 8484115513T DE 3475535 T DE3475535 T DE 3475535T DE 3475535 D1 DE3475535 D1 DE 3475535D1
- Authority
- DE
- Germany
- Prior art keywords
- bath
- nickel
- plating copper
- chemically plating
- alcaline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8484115513T DE3475535D1 (en) | 1984-02-04 | 1984-12-15 | Aqueous alcaline bath for chemically plating copper or nickel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19843404270 DE3404270A1 (de) | 1984-02-04 | 1984-02-04 | Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen |
DE8484115513T DE3475535D1 (en) | 1984-02-04 | 1984-12-15 | Aqueous alcaline bath for chemically plating copper or nickel |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3475535D1 true DE3475535D1 (en) | 1989-01-12 |
Family
ID=6227013
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19843404270 Withdrawn DE3404270A1 (de) | 1984-02-04 | 1984-02-04 | Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen |
DE8484115513T Expired DE3475535D1 (en) | 1984-02-04 | 1984-12-15 | Aqueous alcaline bath for chemically plating copper or nickel |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19843404270 Withdrawn DE3404270A1 (de) | 1984-02-04 | 1984-02-04 | Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US4720404A (de) |
EP (1) | EP0152601B1 (de) |
JP (1) | JPS60204885A (de) |
AT (1) | AT384829B (de) |
CA (1) | CA1254353A (de) |
DE (2) | DE3404270A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4983428A (en) * | 1988-06-09 | 1991-01-08 | United Technologies Corporation | Ethylenethiourea wear resistant electroless nickel-boron coating compositions |
DE4412295C1 (de) * | 1994-04-08 | 1996-01-18 | Plastform Gmbh | Verfahren zum galvanischen Beschichten von Metalloberflächen mit Kupfer oder Kupferlegierungen |
US6054173A (en) * | 1997-08-22 | 2000-04-25 | Micron Technology, Inc. | Copper electroless deposition on a titanium-containing surface |
US5976614A (en) * | 1998-10-13 | 1999-11-02 | Midwest Research Institute | Preparation of cuxinygazsen precursor films and powders by electroless deposition |
US6797312B2 (en) * | 2003-01-21 | 2004-09-28 | Mattson Technology, Inc. | Electroless plating solution and process |
US20060141281A1 (en) * | 2004-12-24 | 2006-06-29 | Tdk Corporation | R-T-B system permanent magnet and plating film |
EP3190209B1 (de) | 2016-01-06 | 2018-06-06 | ATOTECH Deutschland GmbH | 1-acylguanidinverbindungen und verwendung dieser verbindungen bei der stromlosen abscheidung von nickel und nickellegierungsbeschichtungen |
KR101681116B1 (ko) * | 2016-05-26 | 2016-12-09 | (주)오알켐 | 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2430581A (en) * | 1944-11-29 | 1947-11-11 | Rca Corp | Metallizing nonmetallic bodies |
US2935425A (en) * | 1954-12-29 | 1960-05-03 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
US2938805A (en) * | 1958-03-31 | 1960-05-31 | Gen Electric | Process of stabilizing autocatalytic copper plating solutions |
US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
US3268353A (en) * | 1960-11-18 | 1966-08-23 | Electrada Corp | Electroless deposition and method of producing such electroless deposition |
US3383224A (en) * | 1965-11-09 | 1968-05-14 | Shipley Co | Electroless copper deposition |
US3472660A (en) * | 1965-11-14 | 1969-10-14 | Toshihiko Satake | Separation and polishing of rice grains |
DE1298827B (de) * | 1966-03-19 | 1969-07-03 | Siemens Ag | Vernickelungsloesung zum stromlosen Vernickeln von Siliciumscheiben |
US3992211A (en) * | 1968-07-15 | 1976-11-16 | Trans-Metals Corporation | Electroless plating composition |
US3615735A (en) * | 1968-08-13 | 1971-10-26 | Shipley Co | Electroless copper plating |
GB1332307A (en) * | 1970-01-17 | 1973-10-03 | Marconi Co Ltd | Electroless plating solutions |
JPS5149576B2 (de) * | 1971-08-10 | 1976-12-27 | ||
JPS4928571A (de) * | 1972-07-11 | 1974-03-14 | ||
JPS4962330A (de) * | 1972-10-19 | 1974-06-17 | ||
US4287253A (en) * | 1975-04-08 | 1981-09-01 | Photocircuits Division Of Kollmorgen Corp. | Catalytic filler for electroless metallization of hole walls |
SU740860A1 (ru) * | 1978-02-06 | 1980-06-15 | Предприятие П/Я В-8657 | Раствор дл химического осаждени сплава никель-бор |
US4268536A (en) * | 1978-12-07 | 1981-05-19 | Western Electric Company, Inc. | Method for depositing a metal on a surface |
DE2919726A1 (de) * | 1979-05-16 | 1980-11-27 | Bernd Tolkmit | Verfahren zum aufbringen metallischer ueberzuege auf metallische werkstuecke durch mechanisch-chemisches behandeln der werkstuecke |
DE2854159C2 (de) * | 1978-12-15 | 1982-04-22 | Bernd 4000 Düsseldorf Tolkmit | Verfahren zum Aufbringen metallischer Überzüge auf metallische Werkstücke durch mechanisch-chemisches Behandeln der Werkstücke |
JPS5643109A (en) * | 1979-09-07 | 1981-04-21 | Hitachi Ltd | Book stocking and delivering apparatus |
DE3121015C2 (de) * | 1981-05-27 | 1986-12-04 | Friedr. Blasberg GmbH und Co KG, 5650 Solingen | Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben |
CA1184359A (en) * | 1981-10-23 | 1985-03-26 | Donald A. Arcilesi | Metallic impurity control for electroless copper plating |
-
1984
- 1984-02-04 DE DE19843404270 patent/DE3404270A1/de not_active Withdrawn
- 1984-12-15 DE DE8484115513T patent/DE3475535D1/de not_active Expired
- 1984-12-15 EP EP84115513A patent/EP0152601B1/de not_active Expired
-
1985
- 1985-01-31 AT AT0027385A patent/AT384829B/de not_active IP Right Cessation
- 1985-02-01 CA CA000473446A patent/CA1254353A/en not_active Expired
- 1985-02-04 JP JP60018815A patent/JPS60204885A/ja active Pending
-
1986
- 1986-08-07 US US06/896,741 patent/US4720404A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3404270A1 (de) | 1985-08-08 |
EP0152601A1 (de) | 1985-08-28 |
ATA27385A (de) | 1987-06-15 |
JPS60204885A (ja) | 1985-10-16 |
AT384829B (de) | 1988-01-11 |
EP0152601B1 (de) | 1988-12-07 |
US4720404A (en) | 1988-01-19 |
CA1254353A (en) | 1989-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |