AT384829B - Waesseriges alkalisches bad und verfahren zur haftfesten chemischen abscheidung von kupfer, nickel, kobalt oder deren legierungen - Google Patents

Waesseriges alkalisches bad und verfahren zur haftfesten chemischen abscheidung von kupfer, nickel, kobalt oder deren legierungen

Info

Publication number
AT384829B
AT384829B AT0027385A AT27385A AT384829B AT 384829 B AT384829 B AT 384829B AT 0027385 A AT0027385 A AT 0027385A AT 27385 A AT27385 A AT 27385A AT 384829 B AT384829 B AT 384829B
Authority
AT
Austria
Prior art keywords
alloys
cobalt
nickel
copper
aqueous alkaline
Prior art date
Application number
AT0027385A
Other languages
English (en)
Other versions
ATA27385A (de
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of ATA27385A publication Critical patent/ATA27385A/de
Application granted granted Critical
Publication of AT384829B publication Critical patent/AT384829B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
AT0027385A 1984-02-04 1985-01-31 Waesseriges alkalisches bad und verfahren zur haftfesten chemischen abscheidung von kupfer, nickel, kobalt oder deren legierungen AT384829B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843404270 DE3404270A1 (de) 1984-02-04 1984-02-04 Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen

Publications (2)

Publication Number Publication Date
ATA27385A ATA27385A (de) 1987-06-15
AT384829B true AT384829B (de) 1988-01-11

Family

ID=6227013

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0027385A AT384829B (de) 1984-02-04 1985-01-31 Waesseriges alkalisches bad und verfahren zur haftfesten chemischen abscheidung von kupfer, nickel, kobalt oder deren legierungen

Country Status (6)

Country Link
US (1) US4720404A (de)
EP (1) EP0152601B1 (de)
JP (1) JPS60204885A (de)
AT (1) AT384829B (de)
CA (1) CA1254353A (de)
DE (2) DE3404270A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983428A (en) * 1988-06-09 1991-01-08 United Technologies Corporation Ethylenethiourea wear resistant electroless nickel-boron coating compositions
DE4412295C1 (de) * 1994-04-08 1996-01-18 Plastform Gmbh Verfahren zum galvanischen Beschichten von Metalloberflächen mit Kupfer oder Kupferlegierungen
US6054173A (en) 1997-08-22 2000-04-25 Micron Technology, Inc. Copper electroless deposition on a titanium-containing surface
US5976614A (en) * 1998-10-13 1999-11-02 Midwest Research Institute Preparation of cuxinygazsen precursor films and powders by electroless deposition
US6797312B2 (en) * 2003-01-21 2004-09-28 Mattson Technology, Inc. Electroless plating solution and process
US20060141281A1 (en) * 2004-12-24 2006-06-29 Tdk Corporation R-T-B system permanent magnet and plating film
EP3190209B1 (de) 2016-01-06 2018-06-06 ATOTECH Deutschland GmbH 1-acylguanidinverbindungen und verwendung dieser verbindungen bei der stromlosen abscheidung von nickel und nickellegierungsbeschichtungen
KR101681116B1 (ko) * 2016-05-26 2016-12-09 (주)오알켐 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992211A (en) * 1968-07-15 1976-11-16 Trans-Metals Corporation Electroless plating composition
DE2854159A1 (de) * 1978-12-15 1980-06-19 Bernd Tolkmit Verfahren zum aufbringen metallischer ueberzuege auf metallische werkstuecke durch mechanisch-chemisches behandeln der werkstuecke
DE2919726A1 (de) * 1979-05-16 1980-11-27 Bernd Tolkmit Verfahren zum aufbringen metallischer ueberzuege auf metallische werkstuecke durch mechanisch-chemisches behandeln der werkstuecke
US4268536A (en) * 1978-12-07 1981-05-19 Western Electric Company, Inc. Method for depositing a metal on a surface
US4287253A (en) * 1975-04-08 1981-09-01 Photocircuits Division Of Kollmorgen Corp. Catalytic filler for electroless metallization of hole walls
DE3121015A1 (de) * 1981-05-27 1982-12-16 Friedr. Blasberg GmbH und Co KG, 5650 Solingen Verfahren zur aktivierung von gebeizten oberflaechen und loesung zur durchfuehrung desselben

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2430581A (en) * 1944-11-29 1947-11-11 Rca Corp Metallizing nonmetallic bodies
US2935425A (en) * 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3268353A (en) * 1960-11-18 1966-08-23 Electrada Corp Electroless deposition and method of producing such electroless deposition
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
US3472660A (en) * 1965-11-14 1969-10-14 Toshihiko Satake Separation and polishing of rice grains
DE1298827B (de) * 1966-03-19 1969-07-03 Siemens Ag Vernickelungsloesung zum stromlosen Vernickeln von Siliciumscheiben
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
GB1332307A (en) * 1970-01-17 1973-10-03 Marconi Co Ltd Electroless plating solutions
JPS5149576B2 (de) * 1971-08-10 1976-12-27
JPS4928571A (de) * 1972-07-11 1974-03-14
JPS4962330A (de) * 1972-10-19 1974-06-17
SU740860A1 (ru) * 1978-02-06 1980-06-15 Предприятие П/Я В-8657 Раствор дл химического осаждени сплава никель-бор
JPS5643109A (en) * 1979-09-07 1981-04-21 Hitachi Ltd Book stocking and delivering apparatus
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992211A (en) * 1968-07-15 1976-11-16 Trans-Metals Corporation Electroless plating composition
US4287253A (en) * 1975-04-08 1981-09-01 Photocircuits Division Of Kollmorgen Corp. Catalytic filler for electroless metallization of hole walls
US4268536A (en) * 1978-12-07 1981-05-19 Western Electric Company, Inc. Method for depositing a metal on a surface
DE2854159A1 (de) * 1978-12-15 1980-06-19 Bernd Tolkmit Verfahren zum aufbringen metallischer ueberzuege auf metallische werkstuecke durch mechanisch-chemisches behandeln der werkstuecke
DE2919726A1 (de) * 1979-05-16 1980-11-27 Bernd Tolkmit Verfahren zum aufbringen metallischer ueberzuege auf metallische werkstuecke durch mechanisch-chemisches behandeln der werkstuecke
DE3121015A1 (de) * 1981-05-27 1982-12-16 Friedr. Blasberg GmbH und Co KG, 5650 Solingen Verfahren zur aktivierung von gebeizten oberflaechen und loesung zur durchfuehrung desselben

Also Published As

Publication number Publication date
DE3404270A1 (de) 1985-08-08
US4720404A (en) 1988-01-19
DE3475535D1 (en) 1989-01-12
EP0152601A1 (de) 1985-08-28
EP0152601B1 (de) 1988-12-07
ATA27385A (de) 1987-06-15
CA1254353A (en) 1989-05-23
JPS60204885A (ja) 1985-10-16

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Legal Events

Date Code Title Description
RZN Patent revoked
ELJ Ceased due to non-payment of the annual fee