DE3475031D1 - A semiconductor device comprising packing means for protecting parts of the device - Google Patents

A semiconductor device comprising packing means for protecting parts of the device

Info

Publication number
DE3475031D1
DE3475031D1 DE8484300521T DE3475031T DE3475031D1 DE 3475031 D1 DE3475031 D1 DE 3475031D1 DE 8484300521 T DE8484300521 T DE 8484300521T DE 3475031 T DE3475031 T DE 3475031T DE 3475031 D1 DE3475031 D1 DE 3475031D1
Authority
DE
Germany
Prior art keywords
packing means
semiconductor device
protecting parts
protecting
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484300521T
Other languages
English (en)
Inventor
Kunito C O Mitsubishi De Sakai
Akinobu C O Mitsubishi Tamaki
Takashi C O Mitsubish Takahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE3475031D1 publication Critical patent/DE3475031D1/de
Expired legal-status Critical Current

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Classifications

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE8484300521T 1983-03-18 1984-01-27 A semiconductor device comprising packing means for protecting parts of the device Expired DE3475031D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58046153A JPS59172253A (ja) 1983-03-18 1983-03-18 半導体装置

Publications (1)

Publication Number Publication Date
DE3475031D1 true DE3475031D1 (en) 1988-12-08

Family

ID=12739035

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484300521T Expired DE3475031D1 (en) 1983-03-18 1984-01-27 A semiconductor device comprising packing means for protecting parts of the device

Country Status (4)

Country Link
US (1) US4717948A (de)
EP (1) EP0122687B1 (de)
JP (1) JPS59172253A (de)
DE (1) DE3475031D1 (de)

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Also Published As

Publication number Publication date
JPS59172253A (ja) 1984-09-28
EP0122687A2 (de) 1984-10-24
EP0122687A3 (en) 1986-01-15
US4717948A (en) 1988-01-05
JPH0315339B2 (de) 1991-02-28
EP0122687B1 (de) 1988-11-02

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