DE3474043D1 - Electroless copper plating bath and method - Google Patents

Electroless copper plating bath and method

Info

Publication number
DE3474043D1
DE3474043D1 DE8484306516T DE3474043T DE3474043D1 DE 3474043 D1 DE3474043 D1 DE 3474043D1 DE 8484306516 T DE8484306516 T DE 8484306516T DE 3474043 T DE3474043 T DE 3474043T DE 3474043 D1 DE3474043 D1 DE 3474043D1
Authority
DE
Germany
Prior art keywords
plating bath
copper plating
electroless copper
electroless
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484306516T
Other languages
German (de)
English (en)
Inventor
Akemi Kinoshita
Ken Araki
Hidemi Nawafune
Shozo Mizumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Application granted granted Critical
Publication of DE3474043D1 publication Critical patent/DE3474043D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8484306516T 1983-09-28 1984-09-25 Electroless copper plating bath and method Expired DE3474043D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58179778A JPS6070183A (ja) 1983-09-28 1983-09-28 化学銅めっき方法

Publications (1)

Publication Number Publication Date
DE3474043D1 true DE3474043D1 (en) 1988-10-20

Family

ID=16071720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484306516T Expired DE3474043D1 (en) 1983-09-28 1984-09-25 Electroless copper plating bath and method

Country Status (4)

Country Link
US (1) US4650691A (en, 2012)
EP (1) EP0140575B1 (en, 2012)
JP (1) JPS6070183A (en, 2012)
DE (1) DE3474043D1 (en, 2012)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3148330A1 (de) * 1981-12-07 1983-06-09 Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JPH0723539B2 (ja) * 1986-11-06 1995-03-15 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
AU579776B2 (en) * 1986-11-06 1988-12-08 Nippondenso Co. Ltd. Electroless copper plating solution and process for electrolessly plating copper
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US4935267A (en) * 1987-05-08 1990-06-19 Nippondenso Co., Ltd. Process for electrolessly plating copper and plating solution therefor
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
JPH01230785A (ja) * 1988-03-10 1989-09-14 Matsushita Electric Ind Co Ltd 無電解銅めっき液
JP2595319B2 (ja) * 1988-07-20 1997-04-02 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JP2794741B2 (ja) * 1989-01-13 1998-09-10 日立化成工業株式会社 無電解銅めっき液
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
US5258200A (en) * 1992-08-04 1993-11-02 Amp-Akzo Corporation Electroless copper deposition
MY144574A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
US6897603B2 (en) * 2001-08-24 2005-05-24 Si Diamond Technology, Inc. Catalyst for carbon nanotube growth
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
US7306662B2 (en) * 2006-05-11 2007-12-11 Lam Research Corporation Plating solution for electroless deposition of copper
US6773760B1 (en) * 2003-04-28 2004-08-10 Yuh Sung Method for metallizing surfaces of substrates
RU2344136C2 (ru) * 2003-06-24 2009-01-20 НьюроСёрч А/С Новые производные 8-аза-бицикло[3.2.1]октана и их применение в качестве ингибиторов обратного захвата моноаминовых нейротрансмиттеров

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
DE2137940A1 (de) * 1971-07-29 1973-02-08 Basf Ag Alkalisches kupferbad
JPS5268033A (en) * 1975-12-03 1977-06-06 Masaaki Hirayama Production method of nonnelectrolytic copper plating bath
US4171225A (en) * 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
US4406249A (en) * 1979-11-14 1983-09-27 C. Uyemura & Co., Ltd. Apparatus for controlling electroless plating bath
JPS58125422A (ja) * 1981-12-14 1983-07-26 友和産業株式会社 金属コイル端面包装装置
JPS58153765A (ja) * 1982-03-05 1983-09-12 Toshiba Corp 無電解銅めつき浴の自動濃度調整装置
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS6033358A (ja) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd 無電解銅めっき液

Also Published As

Publication number Publication date
JPH0247551B2 (en, 2012) 1990-10-22
EP0140575A3 (en) 1985-07-03
EP0140575B1 (en) 1988-09-14
US4650691A (en) 1987-03-17
JPS6070183A (ja) 1985-04-20
EP0140575A2 (en) 1985-05-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee