DE3442809C2 - - Google Patents

Info

Publication number
DE3442809C2
DE3442809C2 DE3442809A DE3442809A DE3442809C2 DE 3442809 C2 DE3442809 C2 DE 3442809C2 DE 3442809 A DE3442809 A DE 3442809A DE 3442809 A DE3442809 A DE 3442809A DE 3442809 C2 DE3442809 C2 DE 3442809C2
Authority
DE
Germany
Prior art keywords
brazing filler
layer
metal
line connection
composite structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3442809A
Other languages
German (de)
English (en)
Other versions
DE3442809A1 (de
Inventor
Hirofumi Sendai Jp Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of DE3442809A1 publication Critical patent/DE3442809A1/de
Application granted granted Critical
Publication of DE3442809C2 publication Critical patent/DE3442809C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
DE19843442809 1983-11-24 1984-11-23 Verbundstruktur eines externen leitungsanschlusses und verfahren zur herstellung desselben Granted DE3442809A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58221785A JPS60113450A (ja) 1983-11-24 1983-11-24 外部リ−ド端子の接合構造

Publications (2)

Publication Number Publication Date
DE3442809A1 DE3442809A1 (de) 1985-06-05
DE3442809C2 true DE3442809C2 (OSRAM) 1993-08-19

Family

ID=16772161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843442809 Granted DE3442809A1 (de) 1983-11-24 1984-11-23 Verbundstruktur eines externen leitungsanschlusses und verfahren zur herstellung desselben

Country Status (2)

Country Link
JP (1) JPS60113450A (OSRAM)
DE (1) DE3442809A1 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763083B2 (ja) * 1985-04-22 1995-07-05 日本特殊陶業株式会社 端子接続構造およびその接続方法

Also Published As

Publication number Publication date
JPS60113450A (ja) 1985-06-19
DE3442809A1 (de) 1985-06-05

Similar Documents

Publication Publication Date Title
DE10164502A1 (de) Verfahren zur hermetischen Verkapselung eines Bauelements
EP0016925B1 (de) Verfahren zum Aufbringen von Metall auf Metallmuster auf dielektrischen Substraten
DE2849971A1 (de) Hybrid-schaltkreis und verfahren zu seiner herstellung
DE3107943C2 (OSRAM)
DE2314731B2 (de) Halbleiteranordnung mit höckerartigen Vorsprüngen auf Kontaktflecken und Verfahren zur Herstellung einer solchen Halbleiteranordnung
DE2509912C3 (de) Elektronische Dünnfilmschaltung
DE2402709B2 (de) Festkoerperbauelement mit einem duennen film aus vanadinoxyd
DE1943519A1 (de) Halbleiterbauelement
DE10158809B4 (de) Herstellungsverfahren für eine Leiterbahn auf einem Substrat und eine entsprechende Leiterbahn
WO1995000459A1 (de) Verfahren zur herstellung einer gasdichten lötverbindung und anwendung des verfahrens bei der herstellung von bauelementen mit vakuumdichtem gehäuse
DE1907567A1 (de) Elektrische Schaltungseinheit
DE2549861C3 (de) Verfahren zur Anbringung von lokalisierten Kontakten auf einer Dünnschichtschaltung
DE1915501C3 (de) Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE69025877T2 (de) Befestigen eines Leiters an eine Unterlage
DE19622971A1 (de) Halbleitereinrichtung zur Oberflächenmontage und Halbleitereinrichtungs-Montagekomponente sowie Verfahren zu ihrer Herstellung
EP0840660B1 (de) Flussmittelfreie kontaktierung von bauelementen
DE3635375C2 (OSRAM)
DE3442809C2 (OSRAM)
DE10103084B4 (de) Halbleitermodul und Verfahren zu seiner Herstellung
EP0090820B1 (de) Elektronische dünnschichtschaltung und deren herstellungsverfahren
DE10239081B4 (de) Verfahren zur Herstellung einer Halbleitereinrichtung
DE3704200C2 (OSRAM)
DE112022001600T5 (de) Halbleiterbauelement und herstellungsverfahren für halbleiterbauelement
DE2207012C2 (de) Verfahren zur Kontaktierung von Halbleiterbauelementen
DE2808950C2 (de) Hermetisch abgeschlossenes elektrisches oder elektronisches Bauelement

Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: DIEHL, H., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 800

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition