DE3429375C2 - Lötvorrichtung - Google Patents
LötvorrichtungInfo
- Publication number
- DE3429375C2 DE3429375C2 DE3429375A DE3429375A DE3429375C2 DE 3429375 C2 DE3429375 C2 DE 3429375C2 DE 3429375 A DE3429375 A DE 3429375A DE 3429375 A DE3429375 A DE 3429375A DE 3429375 C2 DE3429375 C2 DE 3429375C2
- Authority
- DE
- Germany
- Prior art keywords
- boards
- solder
- circuit boards
- zone
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 239000003779 heat-resistant material Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 230000009970 fire resistant effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 26
- 238000002844 melting Methods 0.000 abstract description 14
- 230000008018 melting Effects 0.000 abstract description 14
- 239000002826 coolant Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 5
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Tunnel Furnaces (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984084351U JPS614870U (ja) | 1984-06-08 | 1984-06-08 | リフロ−炉 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3429375A1 DE3429375A1 (de) | 1985-12-12 |
| DE3429375C2 true DE3429375C2 (de) | 1987-02-26 |
Family
ID=13828096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3429375A Expired DE3429375C2 (de) | 1984-06-08 | 1984-08-09 | Lötvorrichtung |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS614870U (US20100268047A1-20101021-C00003.png) |
| DE (1) | DE3429375C2 (US20100268047A1-20101021-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3837531A1 (de) * | 1988-11-04 | 1990-05-10 | Siemens Ag | Heissluft-reflow-ofen |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3720912A1 (de) * | 1986-07-03 | 1988-01-07 | Licentia Gmbh | Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten |
| DE3635448C1 (en) * | 1986-10-18 | 1988-01-21 | Sab Schumacher Appbau Gmbh & C | Method and device for reflow soldering of electronic components on printed circuit boards, conforming with SMD technology |
| JPS6471571A (en) * | 1987-09-11 | 1989-03-16 | Senju Metal Industry Co | Reflow furnace |
| DE3737565A1 (de) * | 1987-11-05 | 1989-05-24 | Ernst Hohnerlein | Verfahren und vorrichtung zum loeten |
| JPH0751273B2 (ja) * | 1988-01-13 | 1995-06-05 | 松下電器産業株式会社 | 基板加熱装置 |
| DE3806753A1 (de) * | 1988-03-02 | 1989-09-14 | Heino Pachschwoell | Loet- und/oder aushaertvorrichtung |
| US4973244A (en) * | 1988-06-08 | 1990-11-27 | Electrovert Limited | Heating system in the manufacture of printed circuit boards, assemblies and the like |
| DE3841447C1 (US20100268047A1-20101021-C00003.png) * | 1988-12-09 | 1990-08-02 | Heraeus Quarzschmelze Gmbh, 6450 Hanau, De | |
| US6146448A (en) * | 1998-11-02 | 2000-11-14 | Soltec B.V. | Flux management system for a solder reflow oven |
| US7303109B2 (en) * | 2003-07-01 | 2007-12-04 | Asm Technology Singapore Pte Ltd. | Stud bumping apparatus |
| JP4787379B1 (ja) * | 2011-02-17 | 2011-10-05 | 吉政 玉井 | コンパクトテーブル |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2435884A1 (fr) * | 1978-09-07 | 1980-04-04 | Cit Alcatel | Machine a souder un connecteur a une plaque de circuit imprime |
-
1984
- 1984-06-08 JP JP1984084351U patent/JPS614870U/ja active Granted
- 1984-08-09 DE DE3429375A patent/DE3429375C2/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3837531A1 (de) * | 1988-11-04 | 1990-05-10 | Siemens Ag | Heissluft-reflow-ofen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS614870U (ja) | 1986-01-13 |
| JPH024781Y2 (US20100268047A1-20101021-C00003.png) | 1990-02-05 |
| DE3429375A1 (de) | 1985-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3850195T2 (de) | Aufschmelzofen. | |
| EP0251257B1 (de) | Verfahren u. Anordnung zum Reflow-Löten und Reflow-Entlöten von Leiterplatten | |
| DE4016366C2 (de) | Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte | |
| DE69709221T2 (de) | Verfahren und Vorrichtung zum Reflowlöten | |
| DE69104652T2 (de) | Wiederaufschmelzlötofen. | |
| DE3429375C2 (de) | Lötvorrichtung | |
| DE69706357T2 (de) | Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat | |
| DE69710383T2 (de) | Verfahren und Vorrichtung zum Wellenlöten oder Wellenverzinnen | |
| DE3038841C2 (US20100268047A1-20101021-C00003.png) | ||
| DE8027979U1 (de) | Vorrichtung zum aufbringen von lot auf leiterplatten | |
| DE2411854B2 (de) | Vorrichtung zum Aufbringen von geschmolzenem Lötmittel auf gedruckte Schaltungsplatten | |
| DE3217851A1 (de) | Vorrichtung zum erhitzen von abdeckueberzuegen auf halbleiterplaettchen | |
| EP0219059B1 (de) | Vorrichtung zum Heissverzinnen von Leiterplatten und Verfahren zum Verlöten der Anschlüsse von Bauteilen mit den Leiterbahnen und Lötaugen einer Leiterplatte | |
| DE102014110720A1 (de) | Lötmodul | |
| WO1994002279A1 (de) | Vorrichtung und verfahren zum auflöten von bauelementen auf platinen | |
| WO1980002662A1 (fr) | Dispositif pour realiser un contact entre les parcours conducteurs de plaques a circuits imprimes et des broches de connexion | |
| DE3843191C2 (de) | Vorrichtung zum Löten | |
| EP0756442B1 (de) | Verfahren zum Löten von Bauelementen auf einer Trägerfolie | |
| DE2852132A1 (de) | Verfahren und vorrichtung zum massenloeten von mit bauteilen bestueckten gedruckten schaltungsplatten | |
| DE19931287A1 (de) | Wellen-Lötverfahren und Wellen-Lötvorrichtung | |
| DE3936955C1 (en) | Plasma treating conductor plates for electronic elements - with process gas e.g. oxygen, hydrogen, fluoro-(chloro)-hydrocarbon, etc. before soldering | |
| DE68915526T2 (de) | Ein automatisches Lötverfahren und Apparat dafür. | |
| DE3518405A1 (de) | Loetsystem | |
| DE1900591A1 (de) | Verfahren zum Anloeten von Anschlussleitungen an gedruckte Schaltungen | |
| DE3737830C2 (US20100268047A1-20101021-C00003.png) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8363 | Opposition against the patent | ||
| 8365 | Fully valid after opposition proceedings | ||
| 8339 | Ceased/non-payment of the annual fee |