DE3425724A1 - Tauchloetfaehiges chip-bauelement zum einsatz in platinen - Google Patents

Tauchloetfaehiges chip-bauelement zum einsatz in platinen

Info

Publication number
DE3425724A1
DE3425724A1 DE19843425724 DE3425724A DE3425724A1 DE 3425724 A1 DE3425724 A1 DE 3425724A1 DE 19843425724 DE19843425724 DE 19843425724 DE 3425724 A DE3425724 A DE 3425724A DE 3425724 A1 DE3425724 A1 DE 3425724A1
Authority
DE
Germany
Prior art keywords
adhesive
chip
dip
component
microcapsules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843425724
Other languages
English (en)
Inventor
Reinhard 8000 München Behn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19843425724 priority Critical patent/DE3425724A1/de
Publication of DE3425724A1 publication Critical patent/DE3425724A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

  • Tauchlötfähiaes Chio-Bauelement zum Einsatz in Platinen
  • Die Erfindung betrifft ein tauchlötfähiges Chip-Bauelement zum Einsatz in Platinen, das eine auf der Unterseite des Chips angeordnete Klebeschicht mit einem in Mikrokapseln enthaltenem Kleber besitzt.
  • Derartige Chip-Bauelemente sind aus der DE-OS 3 232 659 bekannt. Als Kleber ist dort ein schnell härtender Zyanacrylat-Kleber angeführt. Diese Kleber lassen sich allerdings schlecht einkapseln und auch bei der Behandlung, z.B. Lagerung, muß darauf geachtet werden, daß nicht durch unbeabsichtigte Druckeinwirkungen Kleber austritt und zu einem unerwünschten Verkleben der Mikrokapseln führt.
  • Aufgabe der Erfindung ist es, ein tauchlötfähiges Chip-Bauelement der eingangs genannten Art anzugeben, das einen Kleber aufweist, der sich sowohl gut einkapseln als auch gut behandeln und lagern läßt.
  • Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß der Kleber aus einem Zweikomponentenkleber besteht, dessen beide Komponenten in jeweils getrennten Mikrokapseln enthalten sind.
  • Derartige Zweikomponentenkleber, z.B. auf Epoxidharzbasis, lassen sich wesentlich besser einkapseln als die eingangs angeführten Einkomponentenkleber. Auch bei der Behandlung treten die angeführten Schwierigkeiten nicht auf, solange die Mikrokapseln mit den beiden Komponenten getrennt aufbewahrt werden. Selbst bei unbeabsichtigter Druckeinwirkung und Austritt einer Komponente können deshalb die Mikrokapseln nicht untereinander verklebt werden.
  • Zum Aufbringen auf die Unterseite der Chip-Bauelemente werden die Mikrokapseln dann im zum Kleben gewünschten Verhältnis gemischt, so daß bei der Aktivierung der Kapseln (Aufplatzen durch Druckeinwirkung) sogleich das richtige Komponentengemisch an die zu klebende Stelle gezielt gelang. Da die Kapsel, und damit die Mengen, sehr klein sind, ist auch zugleich eine intensive Mischung der Zweikomponenten ineinander gewährleistet.
  • Das Aufbringen der Mikrokapseln auf die Unterseite der Chip-Bauelemente geschieht in bekannter Weise, indem z.B.
  • zunächst auf die Chip-Unterseite eine dünne Klebeschicht aufgetragen wird und auf diese Klebeschicht dann die Mikrokapseln aufgebracht werden. Dabei bleiben die Kapseln, die direkt mit der Klebeschicht in Berührung komme, auf dem Chip haften und kleben dort fest. Die Klebeschicht kann anschließend ausgehärtet werden, so daß die mit Kleber gefüllten Mikrokapseln an der Chipfläche haften bleiben.
  • Die Unterseite des Chip-Bauelementes muß nicht durchgehend mit der Klebeschicht versehen sein, sondern es können z.B.
  • in bekannter Weise Nocken an der Unterseite angebracht sein, an denen die Mikrokapseln mit dem Kleber angeordnet sind.
  • Dadurch kann die Lötung nicht durch seitlich am Chip austretenden Kleber behindert werden.
  • Der Gegenstand der Erfindung ist für alle bekannten Chip-Bauelemente anwendbar, z.B. für auf einem Substrat angeordnete Vielschichtkondensatoren mit einem Dielektrikum aus glimmpolymeren Schichten oder Tantal-Elektrolytkondensatoren.
  • 1 Patentanspruch

Claims (1)

  1. Patentanspruch Tauchlötfähiges Chip-Bauelement zum Einsatz in Platinen, das eine auf der Unterseite des Chips angeordnete Klebeschicht mit einem in Mikrokapseln enthaltenem Kleber besitzt, d a d u r c h g e k e n n z e i c h n e t, daß der Kleber aus einem Zweikomponentenkleber besteht, dessen beide Komponenten in jeweils getrennten Mikrokapseln enthalten sind.
DE19843425724 1984-07-12 1984-07-12 Tauchloetfaehiges chip-bauelement zum einsatz in platinen Withdrawn DE3425724A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843425724 DE3425724A1 (de) 1984-07-12 1984-07-12 Tauchloetfaehiges chip-bauelement zum einsatz in platinen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843425724 DE3425724A1 (de) 1984-07-12 1984-07-12 Tauchloetfaehiges chip-bauelement zum einsatz in platinen

Publications (1)

Publication Number Publication Date
DE3425724A1 true DE3425724A1 (de) 1986-01-23

Family

ID=6240493

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843425724 Withdrawn DE3425724A1 (de) 1984-07-12 1984-07-12 Tauchloetfaehiges chip-bauelement zum einsatz in platinen

Country Status (1)

Country Link
DE (1) DE3425724A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2609232A1 (fr) * 1986-12-25 1988-07-01 Tdk Corp Element de circuit electronique
DE4223576A1 (de) * 1992-07-17 1993-02-04 Tech Wissenschaftliche Ges Thi Montage- und kontaktierungsverfahren von bauelementen auf leiterplatten
WO2003093686A1 (en) * 2002-04-30 2003-11-13 Karelia Yhtymä Oyj Building board and method of fastening one
US10575393B1 (en) * 2018-11-13 2020-02-25 International Business Machines Corporation Heat-shielding microcapsules for protecting temperature sensitive components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2609232A1 (fr) * 1986-12-25 1988-07-01 Tdk Corp Element de circuit electronique
DE4223576A1 (de) * 1992-07-17 1993-02-04 Tech Wissenschaftliche Ges Thi Montage- und kontaktierungsverfahren von bauelementen auf leiterplatten
WO2003093686A1 (en) * 2002-04-30 2003-11-13 Karelia Yhtymä Oyj Building board and method of fastening one
US10575393B1 (en) * 2018-11-13 2020-02-25 International Business Machines Corporation Heat-shielding microcapsules for protecting temperature sensitive components

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