DE3380242D1 - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
DE3380242D1
DE3380242D1 DE8383108768T DE3380242T DE3380242D1 DE 3380242 D1 DE3380242 D1 DE 3380242D1 DE 8383108768 T DE8383108768 T DE 8383108768T DE 3380242 T DE3380242 T DE 3380242T DE 3380242 D1 DE3380242 D1 DE 3380242D1
Authority
DE
Germany
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
semiconductor
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383108768T
Other languages
English (en)
Inventor
Shigeo Kuboki
Mitsuhiro Ikeda
Akihiko Takano
Yoji Nishio
Ikuro Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Engineering Co Ltd
Hitachi Ltd
Original Assignee
Hitachi Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Engineering Co Ltd
Application granted granted Critical
Publication of DE3380242D1 publication Critical patent/DE3380242D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
DE8383108768T 1982-09-06 1983-09-06 Semiconductor integrated circuit device Expired DE3380242D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57153921A JPS5943548A (ja) 1982-09-06 1982-09-06 半導体集積回路装置

Publications (1)

Publication Number Publication Date
DE3380242D1 true DE3380242D1 (en) 1989-08-24

Family

ID=15573000

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383108768T Expired DE3380242D1 (en) 1982-09-06 1983-09-06 Semiconductor integrated circuit device

Country Status (5)

Country Link
US (1) US4589007A (de)
EP (1) EP0102644B1 (de)
JP (1) JPS5943548A (de)
KR (1) KR860000970B1 (de)
DE (1) DE3380242D1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783749A (en) * 1985-05-21 1988-11-08 Siemens Aktiengesellschaft Basic cell realized in the CMOS technique and a method for the automatic generation of such a basic cell
US5051917A (en) * 1987-02-24 1991-09-24 International Business Machines Corporation Method of combining gate array and standard cell circuits on a common semiconductor chip
US4786613A (en) * 1987-02-24 1988-11-22 International Business Machines Corporation Method of combining gate array and standard cell circuits on a common semiconductor chip
JP2516962B2 (ja) * 1987-03-18 1996-07-24 三菱電機株式会社 マスタ−スライスｌｓｉ
US4949149A (en) * 1987-03-31 1990-08-14 Unisys Corporation Semicustom chip whose logic cells have narrow tops and wide bottoms
EP0288688A3 (de) * 1987-04-30 1990-07-11 International Business Machines Corporation Poröser Schaltungsmacro für integrierte Halbleiterschaltungen
GB8722414D0 (en) * 1987-09-23 1987-10-28 Veeder Root Ltd Determining amount of material in tank
US5369595A (en) * 1988-03-18 1994-11-29 International Business Machines Corporation Method of combining gate array and standard cell circuits on a common semiconductor chip
DE4002780C2 (de) * 1990-01-31 1995-01-19 Fraunhofer Ges Forschung Basiszelle für eine kanallose Gate-Array-Anordnung
US20050127399A1 (en) * 2003-12-12 2005-06-16 Meadows Ronald C. Non-uniform gate pitch semiconductor devices
US7135747B2 (en) * 2004-02-25 2006-11-14 Cree, Inc. Semiconductor devices having thermal spacers
US7908578B2 (en) 2007-08-02 2011-03-15 Tela Innovations, Inc. Methods for designing semiconductor device with dynamic array section
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US8541879B2 (en) 2007-12-13 2013-09-24 Tela Innovations, Inc. Super-self-aligned contacts and method for making the same
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US9035359B2 (en) 2006-03-09 2015-05-19 Tela Innovations, Inc. Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods
US8653857B2 (en) 2006-03-09 2014-02-18 Tela Innovations, Inc. Circuitry and layouts for XOR and XNOR logic
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US9009641B2 (en) 2006-03-09 2015-04-14 Tela Innovations, Inc. Circuits with linear finfet structures
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US7763534B2 (en) 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US9230910B2 (en) 2006-03-09 2016-01-05 Tela Innovations, Inc. Oversized contacts and vias in layout defined by linearly constrained topology
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
KR101749351B1 (ko) 2008-07-16 2017-06-20 텔라 이노베이션스, 인코포레이티드 동적 어레이 아키텍쳐에서의 셀 페이징과 배치를 위한 방법 및 그 구현
US9122832B2 (en) 2008-08-01 2015-09-01 Tela Innovations, Inc. Methods for controlling microloading variation in semiconductor wafer layout and fabrication
US8661392B2 (en) 2009-10-13 2014-02-25 Tela Innovations, Inc. Methods for cell boundary encroachment and layouts implementing the Same
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
JPS5925381B2 (ja) * 1977-12-30 1984-06-16 富士通株式会社 半導体集積回路装置
JPS5874052A (ja) * 1981-10-29 1983-05-04 Nec Corp マスタ−スライス半導体集積回路装置
JPS5897847A (ja) * 1981-12-08 1983-06-10 Nec Corp 集積回路装置

Also Published As

Publication number Publication date
EP0102644B1 (de) 1989-07-19
KR840005920A (ko) 1984-11-19
JPH0135501B2 (de) 1989-07-25
US4589007A (en) 1986-05-13
JPS5943548A (ja) 1984-03-10
EP0102644A2 (de) 1984-03-14
KR860000970B1 (ko) 1986-07-23
EP0102644A3 (en) 1986-02-19

Similar Documents

Publication Publication Date Title
GB8319848D0 (en) Semiconductor integrated circuit device
GB8324163D0 (en) Semiconductor integrated circuit device
DE3380242D1 (en) Semiconductor integrated circuit device
DE3470265D1 (en) Semiconductor integrated circuit device
DE3162416D1 (en) Semiconductor integrated circuit device
GB2087183B (en) Semiconductor integrated circuit device
DE3277855D1 (en) Semiconductor integrated circuit device
DE3278873D1 (en) Semiconductor integrated circuit device
GB8416885D0 (en) Semiconductor integrated circuit device
GB8414839D0 (en) Semiconductor integrated circuit device
GB8418407D0 (en) Semiconductor integrated circuit device
GB2152752B (en) Semiconductor integrated circuit device
EP0145497A3 (en) Semiconductor integrated circuit device
DE3475366D1 (en) Master-slice-type semiconductor integrated circuit device
GB2126782B (en) Semiconductor integrated circuit devices
GB2089611B (en) Semiconductor integrated circuit device
EP0127100A3 (en) Semiconductor integrated circuit device
GB8306917D0 (en) Semiconductor integrated circuit device
GB8431943D0 (en) Semiconductor integrated circuit device
HK46086A (en) Semiconductor integrated circuit device
HK54386A (en) Semiconductor integrated circuit device
GB8422520D0 (en) Semiconductor integrated circuit device
DE3380105D1 (en) Semiconductor integrated circuit device
DE3380891D1 (en) Semiconductor integrated circuit
GB8502453D0 (en) Semiconductor integrated circuit device

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee