DE3378871D1 - Cooling device for a plurality of integrated components assembled as a flat structure - Google Patents

Cooling device for a plurality of integrated components assembled as a flat structure

Info

Publication number
DE3378871D1
DE3378871D1 DE8383104872T DE3378871T DE3378871D1 DE 3378871 D1 DE3378871 D1 DE 3378871D1 DE 8383104872 T DE8383104872 T DE 8383104872T DE 3378871 T DE3378871 T DE 3378871T DE 3378871 D1 DE3378871 D1 DE 3378871D1
Authority
DE
Germany
Prior art keywords
cooling device
flat structure
integrated components
components assembled
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383104872T
Other languages
German (de)
English (en)
Inventor
Herrmann Dipl Ing Wessely
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE8383104872T priority Critical patent/DE3378871D1/de
Application granted granted Critical
Publication of DE3378871D1 publication Critical patent/DE3378871D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE8383104872T 1982-09-09 1983-05-17 Cooling device for a plurality of integrated components assembled as a flat structure Expired DE3378871D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8383104872T DE3378871D1 (en) 1982-09-09 1983-05-17 Cooling device for a plurality of integrated components assembled as a flat structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3233491 1982-09-09
DE8383104872T DE3378871D1 (en) 1982-09-09 1983-05-17 Cooling device for a plurality of integrated components assembled as a flat structure

Publications (1)

Publication Number Publication Date
DE3378871D1 true DE3378871D1 (en) 1989-02-09

Family

ID=6172825

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383104872T Expired DE3378871D1 (en) 1982-09-09 1983-05-17 Cooling device for a plurality of integrated components assembled as a flat structure

Country Status (5)

Country Link
US (1) US4521829A (OSRAM)
EP (1) EP0103068B1 (OSRAM)
JP (1) JPS5950552A (OSRAM)
AT (1) ATE39788T1 (OSRAM)
DE (1) DE3378871D1 (OSRAM)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215192A1 (de) * 1982-04-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente
JPS60260104A (ja) * 1984-06-06 1985-12-23 日本電気株式会社 発熱体の実装構造
JPH0530392Y2 (OSRAM) * 1985-01-14 1993-08-03
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
US4803546A (en) * 1986-09-17 1989-02-07 Fujitsu Limited Heatsink package for flip-chip IC
US4887147A (en) * 1987-07-01 1989-12-12 Digital Equipment Corporation Thermal package for electronic components
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
EP0357747A1 (en) * 1988-03-01 1990-03-14 Digital Equipment Corporation Method and apparatus for packaging and cooling integrated circuit chips
EP0340959B1 (en) * 1988-05-06 1994-12-28 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
DE4015788C2 (de) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Baugruppe
US5050039A (en) * 1990-06-26 1991-09-17 Digital Equipment Corporation Multiple circuit chip mounting and cooling arrangement
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking
JP3000307B2 (ja) * 1991-08-28 2000-01-17 株式会社日立製作所 冷却装置付き半導体装置およびその製造方法
DE4210834C2 (de) * 1992-04-01 1995-10-05 Siemens Nixdorf Inf Syst Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefaßten gehäuselosen filmmontierten integrierten Bausteinen
DE4210835C1 (OSRAM) * 1992-04-01 1993-06-17 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
WO1993023825A1 (fr) * 1992-05-20 1993-11-25 Seiko Epson Corporation Cartouche destinee a un appareil electronique
US8213431B2 (en) * 2008-01-18 2012-07-03 The Boeing Company System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments
US5267867A (en) * 1992-09-11 1993-12-07 Digital Equipment Corporation Package for multiple removable integrated circuits
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US6035523A (en) * 1995-06-16 2000-03-14 Apple Computer, Inc. Method and apparatus for supporting a component on a substrate
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US5960535A (en) * 1997-10-28 1999-10-05 Hewlett-Packard Company Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
US6349032B1 (en) 1999-02-03 2002-02-19 International Business Machines Corporation Electronic chip packaging
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US6847529B2 (en) * 1999-07-15 2005-01-25 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6452113B2 (en) * 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US20030156400A1 (en) * 1999-07-15 2003-08-21 Dibene Joseph Ted Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US7167379B2 (en) * 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
US6711811B2 (en) * 2001-06-18 2004-03-30 Hewlett-Packard Development Company, L.P. Method to assemble a uniform force hydrostatic bolster plate
US6845013B2 (en) 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
DE102007014789B3 (de) * 2007-03-28 2008-11-06 Ixys Ch Gmbh Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul
US9554488B2 (en) * 2014-04-18 2017-01-24 Raytheon Company Method to align surface mount packages for thermal enhancement
KR102585802B1 (ko) * 2019-07-01 2023-10-11 현대모비스 주식회사 자율주행 차량의 브레이크 장치 및 그 제어 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3896544A (en) * 1973-01-15 1975-07-29 Essex International Inc Method of making resilient electrical contact assembly for semiconductor devices
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
NL7704773A (nl) * 1977-05-02 1978-11-06 Philips Nv Hybrideschakeling voorzien van een halfgeleider- schakeling.
US4167771A (en) * 1977-06-16 1979-09-11 International Business Machines Corporation Thermal interface adapter for a conduction cooling module
US4153107A (en) * 1977-06-30 1979-05-08 International Business Machines Corporation Temperature equalizing element for a conduction cooling module
JPS54126474A (en) * 1978-03-24 1979-10-01 Nec Corp High-density package
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
JPS6159660A (ja) * 1984-08-31 1986-03-27 Hitachi Ltd 自動演奏装置のデイスク着脱機構

Also Published As

Publication number Publication date
JPS5950552A (ja) 1984-03-23
EP0103068A2 (de) 1984-03-21
EP0103068B1 (de) 1989-01-04
JPS6355867B2 (OSRAM) 1988-11-04
ATE39788T1 (de) 1989-01-15
EP0103068A3 (en) 1986-03-12
US4521829A (en) 1985-06-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee