DE3375732D1 - Electrolytic copper plating solutions and a method for their application - Google Patents

Electrolytic copper plating solutions and a method for their application

Info

Publication number
DE3375732D1
DE3375732D1 DE8383109814T DE3375732T DE3375732D1 DE 3375732 D1 DE3375732 D1 DE 3375732D1 DE 8383109814 T DE8383109814 T DE 8383109814T DE 3375732 T DE3375732 T DE 3375732T DE 3375732 D1 DE3375732 D1 DE 3375732D1
Authority
DE
Germany
Prior art keywords
hydrogen
magnesium
alkali metal
compound
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383109814T
Other languages
English (en)
Inventor
John Houman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Application granted granted Critical
Publication of DE3375732D1 publication Critical patent/DE3375732D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
DE8383109814T 1982-09-30 1983-09-30 Electrolytic copper plating solutions and a method for their application Expired DE3375732D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42905582A 1982-09-30 1982-09-30

Publications (1)

Publication Number Publication Date
DE3375732D1 true DE3375732D1 (en) 1988-03-31

Family

ID=23701587

Family Applications (2)

Application Number Title Priority Date Filing Date
DE198383109814T Pending DE107109T1 (de) 1982-09-30 1983-09-30 Elektrolytische kupferplattierungsloesungen und verfahren fuer ihre anwendung.
DE8383109814T Expired DE3375732D1 (en) 1982-09-30 1983-09-30 Electrolytic copper plating solutions and a method for their application

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE198383109814T Pending DE107109T1 (de) 1982-09-30 1983-09-30 Elektrolytische kupferplattierungsloesungen und verfahren fuer ihre anwendung.

Country Status (5)

Country Link
EP (1) EP0107109B1 (de)
JP (1) JPS59501829A (de)
AT (1) ATE32611T1 (de)
DE (2) DE107109T1 (de)
WO (1) WO1984001393A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
DE3721985A1 (de) * 1987-06-30 1989-01-12 Schering Ag Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2888390A (en) * 1956-11-08 1959-05-26 Anaconda Co Electrolytic refining of copper
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
JPS4931183B1 (de) * 1969-12-19 1974-08-20
JPS4931406B1 (de) * 1970-02-19 1974-08-21
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths

Also Published As

Publication number Publication date
WO1984001393A1 (en) 1984-04-12
DE107109T1 (de) 1985-02-14
JPS6250559B2 (de) 1987-10-26
JPS59501829A (ja) 1984-11-01
ATE32611T1 (de) 1988-03-15
EP0107109A2 (de) 1984-05-02
EP0107109B1 (de) 1988-02-24
EP0107109A3 (en) 1984-07-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee