DE3339946A1 - Verfahren zum metallisieren der bohrungswandungen in leiterplatten - Google Patents

Verfahren zum metallisieren der bohrungswandungen in leiterplatten

Info

Publication number
DE3339946A1
DE3339946A1 DE19833339946 DE3339946A DE3339946A1 DE 3339946 A1 DE3339946 A1 DE 3339946A1 DE 19833339946 DE19833339946 DE 19833339946 DE 3339946 A DE3339946 A DE 3339946A DE 3339946 A1 DE3339946 A1 DE 3339946A1
Authority
DE
Germany
Prior art keywords
bath
printed circuit
circuit board
treatment
hole walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19833339946
Other languages
German (de)
English (en)
Other versions
DE3339946C2 (enrdf_load_stackoverflow
Inventor
Klaus 6500 Mainz Eisenmenger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19833339946 priority Critical patent/DE3339946A1/de
Publication of DE3339946A1 publication Critical patent/DE3339946A1/de
Application granted granted Critical
Publication of DE3339946C2 publication Critical patent/DE3339946C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
DE19833339946 1983-11-04 1983-11-04 Verfahren zum metallisieren der bohrungswandungen in leiterplatten Granted DE3339946A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19833339946 DE3339946A1 (de) 1983-11-04 1983-11-04 Verfahren zum metallisieren der bohrungswandungen in leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833339946 DE3339946A1 (de) 1983-11-04 1983-11-04 Verfahren zum metallisieren der bohrungswandungen in leiterplatten

Publications (2)

Publication Number Publication Date
DE3339946A1 true DE3339946A1 (de) 1985-05-23
DE3339946C2 DE3339946C2 (enrdf_load_stackoverflow) 1990-12-06

Family

ID=6213486

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833339946 Granted DE3339946A1 (de) 1983-11-04 1983-11-04 Verfahren zum metallisieren der bohrungswandungen in leiterplatten

Country Status (1)

Country Link
DE (1) DE3339946A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111601461A (zh) * 2020-06-08 2020-08-28 大连崇达电路有限公司 一种线路板孔无铜的改善方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Z: Metalloberfläche, 1965, H. 4, S.121 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111601461A (zh) * 2020-06-08 2020-08-28 大连崇达电路有限公司 一种线路板孔无铜的改善方法

Also Published As

Publication number Publication date
DE3339946C2 (enrdf_load_stackoverflow) 1990-12-06

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8331 Complete revocation