DE3330385A1 - Aufprall-kuehleinrichtung - Google Patents

Aufprall-kuehleinrichtung

Info

Publication number
DE3330385A1
DE3330385A1 DE19833330385 DE3330385A DE3330385A1 DE 3330385 A1 DE3330385 A1 DE 3330385A1 DE 19833330385 DE19833330385 DE 19833330385 DE 3330385 A DE3330385 A DE 3330385A DE 3330385 A1 DE3330385 A1 DE 3330385A1
Authority
DE
Germany
Prior art keywords
impingement
cooling device
cooling
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833330385
Other languages
English (en)
Inventor
Timothy J Bland
Richard E Niggemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sundstrand Corp
Original Assignee
Sundstrand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US06/411,059 priority Critical patent/US4494171A/en
Application filed by Sundstrand Corp filed Critical Sundstrand Corp
Publication of DE3330385A1 publication Critical patent/DE3330385A1/de
Application status is Withdrawn legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00Heat exchange
    • Y10S165/908Fluid jets
DE19833330385 1982-08-24 1983-08-23 Aufprall-kuehleinrichtung Withdrawn DE3330385A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/411,059 US4494171A (en) 1982-08-24 1982-08-24 Impingement cooling apparatus for heat liberating device

Publications (1)

Publication Number Publication Date
DE3330385A1 true DE3330385A1 (de) 1984-03-01

Family

ID=23627388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833330385 Withdrawn DE3330385A1 (de) 1982-08-24 1983-08-23 Aufprall-kuehleinrichtung

Country Status (4)

Country Link
US (1) US4494171A (de)
JP (1) JPS5957499A (de)
DE (1) DE3330385A1 (de)
GB (1) GB2125951B (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0161282A1 (de) * 1983-11-04 1985-11-21 Sundstrand Corp Halbleiterpack mit internem wärmeaustausch.
EP0168677A2 (de) * 1984-07-12 1986-01-22 International Business Machines Corporation Kühlungssystem für integrierte Schaltungschips
EP0447835A2 (de) * 1990-03-21 1991-09-25 International Business Machines Corporation Wärmeabfuhrvorrichtung für ein durch Flüssigkeit gekühltes Halbleiter-Bauelement
EP0485205A2 (de) * 1990-11-09 1992-05-13 Kabushiki Kaisha Toshiba Wärmesenke und ihr Herstellungsverfahren

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US4628219A (en) * 1985-09-13 1986-12-09 Sundstrand Corporation Rectifier assembly for mounting in a rotor
US4806814A (en) * 1987-11-16 1989-02-21 Sundstrand Corporation Half-wave rotary rectifier assembly
US4827165A (en) * 1987-11-16 1989-05-02 Sundstrand Corporation Integrated diode package
US4934454A (en) * 1988-08-25 1990-06-19 Sundstrand Corporation Pressure sealed laminated heat exchanger
US4901201A (en) * 1988-10-25 1990-02-13 Sundstrand Corporation Plate fin/chic heat exchanger
US4910642A (en) * 1988-12-05 1990-03-20 Sundstrand Corporation Coolant activated contact compact high intensity cooler
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
US4880055A (en) * 1988-12-07 1989-11-14 Sundstrand Corporation Impingement plate type heat exchanger
US4936380A (en) * 1989-01-03 1990-06-26 Sundstrand Corporation Impingement plate type heat exchanger
US4962444A (en) * 1989-01-03 1990-10-09 Sunstrand Corporation Cold chassis for cooling electronic circuit components on an electronic board
US5025856A (en) * 1989-02-27 1991-06-25 Sundstrand Corporation Crossflow jet impingement heat exchanger
US4993487A (en) * 1989-03-29 1991-02-19 Sundstrand Corporation Spiral heat exchanger
US5029640A (en) * 1989-05-01 1991-07-09 Sundstrand Corporation Gas-liquid impingement plate type heat exchanger
US5145001A (en) * 1989-07-24 1992-09-08 Creare Inc. High heat flux compact heat exchanger having a permeable heat transfer element
US5029638A (en) * 1989-07-24 1991-07-09 Creare Incorporated High heat flux compact heat exchanger having a permeable heat transfer element
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5016707A (en) * 1989-12-28 1991-05-21 Sundstrand Corporation Multi-pass crossflow jet impingement heat exchanger
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
US5196989A (en) * 1990-04-09 1993-03-23 Trw Inc. Rigid circuit board structure using impingement cooling
US5099915A (en) * 1990-04-17 1992-03-31 Sundstrand Corporation Helical jet impingement evaporator
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5056586A (en) * 1990-06-18 1991-10-15 Modine Heat Transfer, Inc. Vortex jet impingement heat exchanger
US5038857A (en) * 1990-06-19 1991-08-13 Sundstrand Corporation Method of diffusion bonding and laminated heat exchanger formed thereby
US5435381A (en) * 1990-09-14 1995-07-25 Sundstrand Corporation Shear flow/jet fin condenser
US5129449A (en) * 1990-12-26 1992-07-14 Sundstrand Corporation High performance heat exchanger
US5263536A (en) * 1991-07-19 1993-11-23 Thermo Electron Technologies Corp. Miniature heat exchanger
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5749413A (en) * 1991-09-23 1998-05-12 Sundstrand Corporation Heat exchanger for high power electrical component and package incorporating same
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5316075A (en) * 1992-12-22 1994-05-31 Hughes Aircraft Company Liquid jet cold plate for impingement cooling
US5329994A (en) * 1992-12-23 1994-07-19 Sundstrand Corporation Jet impingement heat exchanger
FR2701554B1 (fr) * 1993-02-12 1995-05-12 Transcal Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5864466A (en) * 1994-07-19 1999-01-26 Remsburg; Ralph Thermosyphon-powered jet-impingement cooling device
US5546809A (en) * 1994-12-12 1996-08-20 Houston Industries Incorporated Vibration monitor mounting block
US5901783A (en) * 1995-10-12 1999-05-11 Croyogen, Inc. Cryogenic heat exchanger
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US5768103A (en) * 1996-08-30 1998-06-16 Motorola, Inc. Circuit board apparatus and apparatus and method for spray-cooling an electronic component
US5835345A (en) * 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
JPH11135973A (ja) * 1997-10-31 1999-05-21 Nec Corp 冷却装置
US6167952B1 (en) 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
AU3169799A (en) * 1998-08-18 2000-03-14 Hamamatsu Photonics K.K. Heat sink, and semiconductor laser and semiconductor laser stacker using the same
US6141219A (en) * 1998-12-23 2000-10-31 Sundstrand Corporation Modular power electronics die having integrated cooling apparatus
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler
JP3681581B2 (ja) * 1999-07-30 2005-08-10 ファナック株式会社 冷却装置とそれを備えた面発光装置
US7069975B1 (en) 1999-09-16 2006-07-04 Raytheon Company Method and apparatus for cooling with a phase change material and heat pipes
US7302998B2 (en) * 2000-06-08 2007-12-04 Mikros Manufacturing, Inc. Normal-flow heat exchanger
US6935411B2 (en) * 2000-06-08 2005-08-30 Mikros Manufacturing, Inc. Normal-flow heat exchanger
FR2818447B1 (fr) * 2000-12-18 2003-03-07 Ferraz Date Ind Raccord electrique refroidi notamment pour courants forts et son procede de fabrication
US6823205B1 (en) * 2001-02-08 2004-11-23 Boston University Radiology Associates Synthetic images for a magnetic resonance imaging scanner using linear combination of source images to generate contrast and spatial navigation
JP2003302176A (ja) * 2001-08-07 2003-10-24 Denso Corp 沸騰冷却器
US7278474B2 (en) * 2001-10-09 2007-10-09 Mikros Manufacturing, Inc. Heat exchanger
US20050211417A1 (en) * 2002-11-01 2005-09-29 Cooligy,Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US20040112571A1 (en) * 2002-11-01 2004-06-17 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US20050211418A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
TWI300466B (en) * 2002-11-01 2008-09-01 Cooligy Inc Channeled flat plate fin heat exchange system, device and method
US20050211427A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US7201012B2 (en) * 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US20090044928A1 (en) * 2003-01-31 2009-02-19 Girish Upadhya Method and apparatus for preventing cracking in a liquid cooling system
US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
US7156159B2 (en) * 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US20040182551A1 (en) * 2003-03-17 2004-09-23 Cooligy, Inc. Boiling temperature design in pumped microchannel cooling loops
US7058101B2 (en) 2003-09-20 2006-06-06 Spectra Physics, Inc. Stepped manifold array of microchannel heat sinks
US7075959B1 (en) 2003-11-14 2006-07-11 Hamilton Sundstrand Corporation Cooling device for diode pumped laser
DE202005003832U1 (de) * 2004-03-26 2005-05-12 Ebm-Papst St. Georgen Gmbh & Co. Kg Wärmeaufnehmer
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7293423B2 (en) * 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US20060042785A1 (en) * 2004-08-27 2006-03-02 Cooligy, Inc. Pumped fluid cooling system and method
JP4333587B2 (ja) * 2005-01-14 2009-09-16 三菱電機株式会社 ヒートシンクおよび冷却ユニット
US7472741B2 (en) * 2005-02-09 2009-01-06 Raytheon Company Foil slot impingement cooler with effective light-trap cavities
US7233494B2 (en) * 2005-05-06 2007-06-19 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
US7516776B2 (en) * 2005-05-19 2009-04-14 International Business Machines Corporation Microjet module assembly
US7913719B2 (en) * 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200813695A (en) * 2006-03-30 2008-03-16 Cooligy Inc Integrated liquid to air conduction module
US7715194B2 (en) * 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
CN100584169C (zh) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 液冷散热装置
US20070256825A1 (en) * 2006-05-04 2007-11-08 Conway Bruce R Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
JP4675283B2 (ja) * 2006-06-14 2011-04-20 トヨタ自動車株式会社 ヒートシンクおよび冷却器
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
US8242595B2 (en) * 2007-08-10 2012-08-14 Panasonic Electric Works SUNX Co., Ltd. Heatsink and semiconductor device with heatsink
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8250877B2 (en) * 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP4557055B2 (ja) * 2008-06-25 2010-10-06 ソニー株式会社 熱輸送デバイス及び電子機器
US8299604B2 (en) 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20110226455A1 (en) * 2010-03-16 2011-09-22 Saudi Arabian Oil Company Slotted impingement plates for heat exchangers
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
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US20130027885A1 (en) * 2011-07-25 2013-01-31 International Business Machines Corporation Heat spreader for multi-chip modules
US9271427B2 (en) 2012-11-28 2016-02-23 Hamilton Sundstrand Corporation Flexible thermal transfer strips
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
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JPWO2016067785A1 (ja) * 2014-10-30 2017-08-10 東京エレクトロン株式会社 基板載置台
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0161282A1 (de) * 1983-11-04 1985-11-21 Sundstrand Corp Halbleiterpack mit internem wärmeaustausch.
EP0161282A4 (de) * 1983-11-04 1987-01-20 Sundstrand Corp Halbleiterpack mit internem wärmeaustausch.
EP0168677A2 (de) * 1984-07-12 1986-01-22 International Business Machines Corporation Kühlungssystem für integrierte Schaltungschips
EP0168677A3 (en) * 1984-07-12 1987-04-01 International Business Machines Corporation A cooling system for integrated circuit chips
EP0447835A2 (de) * 1990-03-21 1991-09-25 International Business Machines Corporation Wärmeabfuhrvorrichtung für ein durch Flüssigkeit gekühltes Halbleiter-Bauelement
EP0447835A3 (en) * 1990-03-21 1991-11-13 International Business Machines Corporation Heat removal apparatus for liquid cooled semiconductor modules
EP0485205A2 (de) * 1990-11-09 1992-05-13 Kabushiki Kaisha Toshiba Wärmesenke und ihr Herstellungsverfahren
EP0485205A3 (en) * 1990-11-09 1993-03-17 Kabushiki Kaisha Toshiba Heat sink and the producing method thereof
US5381859A (en) * 1990-11-09 1995-01-17 Kabushiki Kaisha Toshiba Heat sink and the producing method thereof

Also Published As

Publication number Publication date
GB2125951A (en) 1984-03-14
GB8316416D0 (en) 1983-07-20
GB2125951B (en) 1985-09-18
US4494171A (en) 1985-01-15
JPS5957499A (en) 1984-04-03

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination