DE3311712C2 - - Google Patents
Info
- Publication number
- DE3311712C2 DE3311712C2 DE19833311712 DE3311712A DE3311712C2 DE 3311712 C2 DE3311712 C2 DE 3311712C2 DE 19833311712 DE19833311712 DE 19833311712 DE 3311712 A DE3311712 A DE 3311712A DE 3311712 C2 DE3311712 C2 DE 3311712C2
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- insulating
- semiconductor
- cooler
- cooling box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8205439A FR2524760B1 (fr) | 1982-03-30 | 1982-03-30 | Piece de maintien pour semiconducteur, et dispositif de puissance a semiconducteur comportant une telle piece |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3311712A1 DE3311712A1 (de) | 1983-10-06 |
DE3311712C2 true DE3311712C2 (xx) | 1992-12-17 |
Family
ID=9272563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19833311712 Granted DE3311712A1 (de) | 1982-03-30 | 1983-03-30 | Halbleiter-halter und damit ausgeruestete halbleiter-leistungsschaltanordnung |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE3311712A1 (xx) |
FR (1) | FR2524760B1 (xx) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4322933A1 (de) * | 1993-07-09 | 1995-01-12 | Abb Patent Gmbh | Flüssigkeitskühlkörper mit hydraulischem Kühlmittelanschluß |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06101524B2 (ja) * | 1985-09-18 | 1994-12-12 | 株式会社東芝 | 半導体素子用冷却体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2103982C3 (de) * | 1971-01-28 | 1980-01-17 | Brown, Boveri & Cie Ag, 6800 Mannheim | Mit isolierender Flüssigkeit gekühlter Stromrichter |
DE2160302C3 (de) * | 1971-12-04 | 1975-07-17 | Siemens Ag | Kühldose zum Einbau in Scheibenzellenstapel |
DE2348207A1 (de) * | 1973-09-25 | 1975-04-17 | Siemens Ag | Thyristorsaeule |
FR2277433A1 (fr) * | 1974-07-05 | 1976-01-30 | Auxilec | Montage compact d'element semiconducteur de puissance refroidi par liquide |
DE2515046C3 (de) * | 1975-04-07 | 1980-03-20 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Thyristorsäule |
DE2659527A1 (de) * | 1976-12-30 | 1978-07-06 | Licentia Gmbh | Baueinheit fuer stromrichter mit wassergekuehlten leistungshalbleitern |
FR2479566A1 (fr) * | 1980-03-26 | 1981-10-02 | Comptoir Cal Importation | Dispositif d'evacuation de chaleur, notamment pour thyristors, et son procede de fabrication |
-
1982
- 1982-03-30 FR FR8205439A patent/FR2524760B1/fr not_active Expired
-
1983
- 1983-03-30 DE DE19833311712 patent/DE3311712A1/de active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4322933A1 (de) * | 1993-07-09 | 1995-01-12 | Abb Patent Gmbh | Flüssigkeitskühlkörper mit hydraulischem Kühlmittelanschluß |
Also Published As
Publication number | Publication date |
---|---|
FR2524760A1 (fr) | 1983-10-07 |
FR2524760B1 (fr) | 1986-10-10 |
DE3311712A1 (de) | 1983-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8125 | Change of the main classification |
Ipc: H01L 23/473 |
|
8127 | New person/name/address of the applicant |
Owner name: AUXILEC, CHATOU, FR |
|
8181 | Inventor (new situation) |
Free format text: BINET, MAX, ENGHIEN, FR JACQUES, CLAUDE, CHEVREUSE, FR |
|
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |