DE3311480A1 - Kontaktbaustein - Google Patents
KontaktbausteinInfo
- Publication number
- DE3311480A1 DE3311480A1 DE19833311480 DE3311480A DE3311480A1 DE 3311480 A1 DE3311480 A1 DE 3311480A1 DE 19833311480 DE19833311480 DE 19833311480 DE 3311480 A DE3311480 A DE 3311480A DE 3311480 A1 DE3311480 A1 DE 3311480A1
- Authority
- DE
- Germany
- Prior art keywords
- contact
- hard material
- material layer
- module according
- contact module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 58
- 238000012360 testing method Methods 0.000 claims abstract description 21
- 150000004767 nitrides Chemical class 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims description 3
- 229910026551 ZrC Inorganic materials 0.000 claims description 3
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 claims description 3
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 3
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical compound C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 claims description 2
- OFEAOSSMQHGXMM-UHFFFAOYSA-N 12007-10-2 Chemical compound [W].[W]=[B] OFEAOSSMQHGXMM-UHFFFAOYSA-N 0.000 claims description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical group [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- LGLOITKZTDVGOE-UHFFFAOYSA-N boranylidynemolybdenum Chemical compound [Mo]#B LGLOITKZTDVGOE-UHFFFAOYSA-N 0.000 claims description 2
- VDZMENNHPJNJPP-UHFFFAOYSA-N boranylidyneniobium Chemical compound [Nb]#B VDZMENNHPJNJPP-UHFFFAOYSA-N 0.000 claims description 2
- XTDAIYZKROTZLD-UHFFFAOYSA-N boranylidynetantalum Chemical compound [Ta]#B XTDAIYZKROTZLD-UHFFFAOYSA-N 0.000 claims description 2
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 claims description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- -1 Mo2B2 Inorganic materials 0.000 description 1
- 229910015425 Mo2B5 Inorganic materials 0.000 description 1
- 229910019802 NbC Inorganic materials 0.000 description 1
- 229910004448 Ta2C Inorganic materials 0.000 description 1
- 229910004533 TaB2 Inorganic materials 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007948 ZrB2 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- AUVPWTYQZMLSKY-UHFFFAOYSA-N boron;vanadium Chemical compound [V]#B AUVPWTYQZMLSKY-UHFFFAOYSA-N 0.000 description 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
- H01R11/18—End pieces terminating in a probe
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833311480 DE3311480A1 (de) | 1983-03-29 | 1983-03-29 | Kontaktbaustein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833311480 DE3311480A1 (de) | 1983-03-29 | 1983-03-29 | Kontaktbaustein |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3311480A1 true DE3311480A1 (de) | 1984-10-11 |
| DE3311480C2 DE3311480C2 (enExample) | 1988-03-17 |
Family
ID=6195020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19833311480 Granted DE3311480A1 (de) | 1983-03-29 | 1983-03-29 | Kontaktbaustein |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3311480A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3604717A1 (de) * | 1986-02-14 | 1987-08-27 | Nixdorf Computer Ag | Kontaktstiftanordnung |
| US4851765A (en) * | 1986-09-08 | 1989-07-25 | Mania Elektronik Automatisation Entwicklung Und Geratebau Gmbh | Apparatus for electrically testing printed circuit boards having contact pads in an extremely fine grid |
| US7212019B2 (en) | 2001-10-15 | 2007-05-01 | Infineon Technologies Ag | Probe needle for testing semiconductor chips and method for producing said probe needle |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2253745B2 (de) * | 1971-11-12 | 1975-07-31 | Sandvik Ab, Sandviken (Schweden) | Verbundkörper |
| DE2904360C2 (de) * | 1979-02-06 | 1982-07-01 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktbaustein |
-
1983
- 1983-03-29 DE DE19833311480 patent/DE3311480A1/de active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2253745B2 (de) * | 1971-11-12 | 1975-07-31 | Sandvik Ab, Sandviken (Schweden) | Verbundkörper |
| DE2904360C2 (de) * | 1979-02-06 | 1982-07-01 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktbaustein |
Non-Patent Citations (2)
| Title |
|---|
| Habig K.H. "Verschleiß u. Härte von Werkstoffen" Hauser-Verlag 1980 * |
| Kieffer R. u. Benesovsky F. "Hartstoffe" Springer-Verl. Wien 1963 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3604717A1 (de) * | 1986-02-14 | 1987-08-27 | Nixdorf Computer Ag | Kontaktstiftanordnung |
| US4851765A (en) * | 1986-09-08 | 1989-07-25 | Mania Elektronik Automatisation Entwicklung Und Geratebau Gmbh | Apparatus for electrically testing printed circuit boards having contact pads in an extremely fine grid |
| US4952872A (en) * | 1986-09-08 | 1990-08-28 | Mania Elektronik Automatisation Entwicklung Und Geratebau Gmbh | Apparatus for electrically testing printed circuit boards having contact pads in an extremely fine grid |
| US7212019B2 (en) | 2001-10-15 | 2007-05-01 | Infineon Technologies Ag | Probe needle for testing semiconductor chips and method for producing said probe needle |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3311480C2 (enExample) | 1988-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8363 | Opposition against the patent | ||
| 8330 | Complete disclaimer |