DE3307933C2 - Optoelektronische Sendeeinheit - Google Patents
Optoelektronische SendeeinheitInfo
- Publication number
- DE3307933C2 DE3307933C2 DE19833307933 DE3307933A DE3307933C2 DE 3307933 C2 DE3307933 C2 DE 3307933C2 DE 19833307933 DE19833307933 DE 19833307933 DE 3307933 A DE3307933 A DE 3307933A DE 3307933 C2 DE3307933 C2 DE 3307933C2
- Authority
- DE
- Germany
- Prior art keywords
- laser diode
- carrier
- optical waveguide
- housing
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000006073 displacement reaction Methods 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
- G02B6/4415—Cables for special applications
- G02B6/4427—Pressure resistant cables, e.g. undersea cables
- G02B6/4428—Penetrator systems in pressure-resistant devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833307933 DE3307933C2 (de) | 1983-03-05 | 1983-03-05 | Optoelektronische Sendeeinheit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833307933 DE3307933C2 (de) | 1983-03-05 | 1983-03-05 | Optoelektronische Sendeeinheit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3307933A1 DE3307933A1 (de) | 1984-10-11 |
| DE3307933C2 true DE3307933C2 (de) | 1987-05-07 |
Family
ID=6192687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19833307933 Expired DE3307933C2 (de) | 1983-03-05 | 1983-03-05 | Optoelektronische Sendeeinheit |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3307933C2 (en18) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3902579A1 (de) * | 1988-01-28 | 1989-08-10 | Mitsubishi Electric Corp | Optischer koppler |
| AT405776B (de) * | 1997-11-24 | 1999-11-25 | Femtolasers Produktions Gmbh | Kühlvorrichtung für einen laserkristall |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3409146A1 (de) * | 1984-03-13 | 1985-09-19 | Siemens AG, 1000 Berlin und 8000 München | Optoelektronisches mudul |
| DE3606588A1 (de) * | 1986-02-28 | 1987-09-03 | Siemens Ag | Gasdichte durchfuehrung einer glasfaser |
| DE3732433A1 (de) * | 1987-09-26 | 1989-04-06 | Standard Elektrik Lorenz Ag | Lasermodul und verfahren zum ankoppeln einer glasfaser |
| US4946553A (en) * | 1988-09-08 | 1990-08-07 | United Technologies Corporation | Apparatus for interfacing an optical fiber to an optical source |
| DE3835701A1 (de) * | 1988-10-20 | 1990-04-26 | Messerschmitt Boelkow Blohm | Anordnung fuer eine laserdiode mit integrierter ansteuerelektronik |
| IT1283224B1 (it) * | 1996-03-11 | 1998-04-16 | Pirelli Cavi Spa | Apparato e metodo di protezione per dispositivi in fibra ottica |
| JP3180701B2 (ja) * | 1997-02-07 | 2001-06-25 | 日本電気株式会社 | 半導体レーザ装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5360651A (en) * | 1976-11-12 | 1978-05-31 | Hitachi Ltd | Semiconductor laser with optical fibers |
| DE3010820C2 (de) * | 1980-03-20 | 1984-07-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Anordnung mit einer Haltevorrichtung zur Halterung eines Lichtwellenleiters |
| JPS57138191A (en) * | 1981-02-19 | 1982-08-26 | Kokusai Denshin Denwa Co Ltd <Kdd> | United structure of semiconductor laser and optical fiber |
-
1983
- 1983-03-05 DE DE19833307933 patent/DE3307933C2/de not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3902579A1 (de) * | 1988-01-28 | 1989-08-10 | Mitsubishi Electric Corp | Optischer koppler |
| AT405776B (de) * | 1997-11-24 | 1999-11-25 | Femtolasers Produktions Gmbh | Kühlvorrichtung für einen laserkristall |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3307933A1 (de) | 1984-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0204224B1 (de) | Verfahren und Vorrichtung zur Justage und Fixierung eines Festkörpers und damit hergestelltes Bauelement | |
| DE4229462A1 (de) | Temperaturreguliertes laserdiodengehaeuse | |
| DE60029807T2 (de) | Optoelektronische module mit doppelter umhüllung | |
| DE68905832T2 (de) | Laserdiodenmodul. | |
| DE3307933C2 (de) | Optoelektronische Sendeeinheit | |
| DE69109378T2 (de) | Unterbaugruppe auf Siliziumbasis. | |
| DE69008426T2 (de) | Laserdiodenmodul. | |
| EP0775376B1 (de) | Lasersystem mit einer kompensierten optik | |
| DE69824766T2 (de) | Halbleiterlaserbaustein mit verbessertem metallischem Substrat auf einem Peltierelement | |
| DE3902579C2 (de) | Optoelektronisches Bauteil | |
| WO1999062150A2 (de) | Gehäuseanordnung für lasermodul | |
| DE69333837T2 (de) | Verfahren zur Hybridisierung und Positionierung eines optoelektrischen Bauelements hinsichtlich eines integrierten Lichtwellenleiters | |
| DE602005003720T2 (de) | Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign | |
| DE2900356A1 (de) | Halbleiterlaser-vorrichtung | |
| WO2003069744A1 (de) | Optoelektronische baugruppe mit peltierkühlung | |
| DE3888606T2 (de) | Optischer Multiplexer/Demultiplexer vom Wellenleiter-Typ. | |
| DE3809182A1 (de) | Optisches bauelement | |
| DE2356436A1 (de) | Verfahren zum verbinden eines ersten, verlustarmen dielektrischen werkstueckes mit einem zweiten werkstueck | |
| DE102019127593B4 (de) | Sockel für ein Gehäuse mit einer elektronischen Komponente zur Hochfrequenz-Signalübertragung | |
| DE69429199T2 (de) | Luftdichte Dichtungsstruktur mit Glas mit niedrigem Schmelzpunkt zur Verwendung im Faserführungsteil einer optischen Vorrichtung und Verfahren zum luftdichten Abdichten mit Glas mit niedrigen Schmelzpunkt | |
| EP0214464A1 (de) | Gehäuse für ein optoelektronisches Schaltungsmodul | |
| DE112021007591T5 (de) | Halbleiterlaser-Lichtquellenvorrichtung | |
| DE69419194T2 (de) | Optoelektronisches Modul mit Kopplung zwischen einer optoelektronischen Komponente, insbesondere einem Halbleiterlaser, und einer optischen Glasfaser, und Methode seiner Herstellung | |
| DE602004006941T2 (de) | Optisches Wellenleiterbauteil, variabler optischer Abschwächer und optischer Schalter | |
| DE3539402C2 (en18) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8363 | Opposition against the patent | ||
| 8320 | Willingness to grant licences declared (paragraph 23) | ||
| 8330 | Complete renunciation |