DE3277789D1 - Method of electron beam evaporating reactive metals onto semiconductors - Google Patents

Method of electron beam evaporating reactive metals onto semiconductors

Info

Publication number
DE3277789D1
DE3277789D1 DE8282105478T DE3277789T DE3277789D1 DE 3277789 D1 DE3277789 D1 DE 3277789D1 DE 8282105478 T DE8282105478 T DE 8282105478T DE 3277789 T DE3277789 T DE 3277789T DE 3277789 D1 DE3277789 D1 DE 3277789D1
Authority
DE
Germany
Prior art keywords
electron beam
reactive metals
metals onto
beam evaporating
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282105478T
Other languages
English (en)
Inventor
Hormazdyar Minocher Dalal
John Joseph Lowney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3277789D1 publication Critical patent/DE3277789D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0278—Röntgenlithographic or X-ray lithographic processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28537—Deposition of Schottky electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/974—Substrate surface preparation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
DE8282105478T 1981-08-31 1982-06-23 Method of electron beam evaporating reactive metals onto semiconductors Expired DE3277789D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/297,642 US4379832A (en) 1981-08-31 1981-08-31 Method for making low barrier Schottky devices of the electron beam evaporation of reactive metals

Publications (1)

Publication Number Publication Date
DE3277789D1 true DE3277789D1 (en) 1988-01-14

Family

ID=23147159

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282105478T Expired DE3277789D1 (en) 1981-08-31 1982-06-23 Method of electron beam evaporating reactive metals onto semiconductors

Country Status (5)

Country Link
US (1) US4379832A (de)
EP (1) EP0073312B1 (de)
JP (1) JPS5846634A (de)
CA (1) CA1166765A (de)
DE (1) DE3277789D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647291B2 (ja) * 1984-08-17 1994-06-22 京セラ株式会社 サ−マルヘツド
US4692991A (en) * 1985-07-19 1987-09-15 Signetics Corporation Method of controlling forward voltage across Schottky diode
JP2613239B2 (ja) * 1988-02-26 1997-05-21 株式会社日立製作所 磁気抵抗効果型ヘツド
US5236868A (en) * 1990-04-20 1993-08-17 Applied Materials, Inc. Formation of titanium nitride on semiconductor wafer by reaction of titanium with nitrogen-bearing gas in an integrated processing system
JP3023853B2 (ja) * 1990-08-23 2000-03-21 富士通株式会社 半導体装置の製造方法
US5242860A (en) * 1991-07-24 1993-09-07 Applied Materials, Inc. Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
US5221638A (en) * 1991-09-10 1993-06-22 Sanken Electric Co., Ltd. Method of manufacturing a Schottky barrier semiconductor device
US5418003A (en) * 1993-09-10 1995-05-23 General Electric Company Vapor deposition of ceramic materials
US6361618B1 (en) 1994-07-20 2002-03-26 Applied Materials, Inc. Methods and apparatus for forming and maintaining high vacuum environments
JP3360461B2 (ja) * 1995-01-31 2002-12-24 ソニー株式会社 メタル成膜工程の前処理方法
US5830279A (en) * 1995-09-29 1998-11-03 Harris Corporation Device and method for improving corrosion resistance and etch tool integrity in dry metal etching
US6130161A (en) 1997-05-30 2000-10-10 International Business Machines Corporation Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity
US6069068A (en) * 1997-05-30 2000-05-30 International Business Machines Corporation Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
EP1034566A1 (de) * 1997-11-26 2000-09-13 Applied Materials, Inc. Zerstörungsfreie beschichtungsmethode
US7253109B2 (en) * 1997-11-26 2007-08-07 Applied Materials, Inc. Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
US20050272254A1 (en) * 1997-11-26 2005-12-08 Applied Materials, Inc. Method of depositing low resistivity barrier layers for copper interconnects
US6077404A (en) 1998-02-17 2000-06-20 Applied Material, Inc. Reflow chamber and process
JP2000164594A (ja) * 1998-11-25 2000-06-16 Murata Mfg Co Ltd 配線パターンの形成方法
US7800024B2 (en) * 2004-09-27 2010-09-21 Duguay Michel A Lithic wireless warming table and portable heaters
JP4954463B2 (ja) * 2004-10-22 2012-06-13 三菱電機株式会社 ショットキーバリアダイオード
US20080254619A1 (en) * 2007-04-14 2008-10-16 Tsang-Jung Lin Method of fabricating a semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874922A (en) * 1973-08-16 1975-04-01 Boeing Co Tantalum thin film resistors by reactive evaporation
US4004044A (en) * 1975-05-09 1977-01-18 International Business Machines Corporation Method for forming patterned films utilizing a transparent lift-off mask
US4215156A (en) * 1977-08-26 1980-07-29 International Business Machines Corporation Method for fabricating tantalum semiconductor contacts
DE2812311C2 (de) * 1978-03-21 1986-10-09 Leybold-Heraeus GmbH, 5000 Köln Verfahren zum gleichzeitigen Vakuumaufdampfen dünner Schichten auf mehrere Substrate mittels Elektronenstrahlen und Anwendung auf die Bedampfung von Turbinenschaufeln
DE3068255D1 (en) * 1979-12-26 1984-07-19 Ibm Process for depositing a pattern of material on a substrate and use of this process for forming a patterned mask structure on a semiconductor substrate

Also Published As

Publication number Publication date
US4379832A (en) 1983-04-12
EP0073312B1 (de) 1987-12-02
EP0073312A3 (en) 1985-08-21
CA1166765A (en) 1984-05-01
JPH025296B2 (de) 1990-02-01
JPS5846634A (ja) 1983-03-18
EP0073312A2 (de) 1983-03-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee