DE3276979D1 - Method of forming wide bandgap region within multilayer semiconductors - Google Patents

Method of forming wide bandgap region within multilayer semiconductors

Info

Publication number
DE3276979D1
DE3276979D1 DE8282901772T DE3276979T DE3276979D1 DE 3276979 D1 DE3276979 D1 DE 3276979D1 DE 8282901772 T DE8282901772 T DE 8282901772T DE 3276979 T DE3276979 T DE 3276979T DE 3276979 D1 DE3276979 D1 DE 3276979D1
Authority
DE
Germany
Prior art keywords
wide bandgap
bandgap region
forming wide
multilayer semiconductors
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282901772T
Other languages
German (de)
English (en)
Inventor
Nick Holonyak
Wyn Davis Laidig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Illinois at Urbana Champaign
University of Illinois Foundation
Original Assignee
University of Illinois at Urbana Champaign
University of Illinois Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/260,956 external-priority patent/US4378255A/en
Priority claimed from US06/370,756 external-priority patent/US4511408A/en
Application filed by University of Illinois at Urbana Champaign, University of Illinois Foundation filed Critical University of Illinois at Urbana Champaign
Application granted granted Critical
Publication of DE3276979D1 publication Critical patent/DE3276979D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/222—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the angle between the ion beam and the crystal planes or the main crystal surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/206—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group III-V semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3824—Intermixing, interdiffusion or disordering of III-V heterostructures, e.g. IILD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/208—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically inactive species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054—Methods of obtaining the confinement
    • H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
DE8282901772T 1981-05-06 1982-05-04 Method of forming wide bandgap region within multilayer semiconductors Expired DE3276979D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/260,956 US4378255A (en) 1981-05-06 1981-05-06 Method for producing integrated semiconductor light emitter
US06/370,756 US4511408A (en) 1982-04-22 1982-04-22 Semiconductor device fabrication with disordering elements introduced into active region
PCT/US1982/000574 WO1982003946A1 (en) 1981-05-06 1982-05-04 Method of forming wide bandgap region within a multilayer iii-v semiconductors

Publications (1)

Publication Number Publication Date
DE3276979D1 true DE3276979D1 (en) 1987-09-17

Family

ID=26948292

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282901772T Expired DE3276979D1 (en) 1981-05-06 1982-05-04 Method of forming wide bandgap region within multilayer semiconductors

Country Status (4)

Country Link
EP (1) EP0077825B1 (ref)
JP (1) JPS58500681A (ref)
DE (1) DE3276979D1 (ref)
WO (1) WO1982003946A1 (ref)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639275A (en) * 1982-04-22 1987-01-27 The Board Of Trustees Of The University Of Illinois Forming disordered layer by controlled diffusion in heterojunction III-V semiconductor
JPS5929484A (ja) * 1982-08-12 1984-02-16 Fujitsu Ltd 半導体発光装置
JPS59171186A (ja) * 1982-11-12 1984-09-27 Fujitsu Ltd 半導体発光装置
NL8301215A (nl) * 1983-04-07 1984-11-01 Philips Nv Halfgeleiderinrichting voor het opwekken van electromagnetische straling.
JPS6079785A (ja) * 1983-10-06 1985-05-07 Agency Of Ind Science & Technol 半導体レ−ザ装置
JPS61236184A (ja) * 1985-04-12 1986-10-21 Agency Of Ind Science & Technol 半導体レ−ザ素子の製造方法
JPH0821748B2 (ja) * 1985-09-04 1996-03-04 株式会社日立製作所 半導体レ−ザ装置
JPS62130581A (ja) * 1985-11-30 1987-06-12 Fujitsu Ltd 半導体レーザの製造方法
JPS62173792A (ja) * 1986-01-21 1987-07-30 ゼロツクス　コ−ポレ−シヨン 半導体構造体及びその半導体領域変換方法
US4751194A (en) * 1986-06-27 1988-06-14 American Telephone And Telegraph Company, At&T Bell Laboratories Structures including quantum well wires and boxes
US4731338A (en) * 1986-10-09 1988-03-15 Amoco Corporation Method for selective intermixing of layered structures composed of thin solid films
US4865923A (en) * 1986-10-09 1989-09-12 Amoco Corporation Selective intermixing of layered structures composed of thin solid films
JPH01312871A (ja) * 1988-06-10 1989-12-18 Omron Tateisi Electron Co スリット光用半導体発光ダイオード
US6590918B1 (en) 1999-11-17 2003-07-08 Matsushita Electronics Corporation Semiconductor laser device and method for producing the same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3485685A (en) * 1967-05-31 1969-12-23 Bell Telephone Labor Inc Method and source composition for reproducible diffusion of zinc into gallium arsenide
US3868281A (en) * 1968-07-05 1975-02-25 Ibm Luminescent device and method therefor
US3626328A (en) * 1969-04-01 1971-12-07 Ibm Semiconductor bulk oscillator
US4001055A (en) * 1973-05-28 1977-01-04 Charmakadze Revaz A Semiconductor light-emitting diode and method for producing same
FR2288390A1 (fr) * 1974-10-18 1976-05-14 Thomson Csf Procede de realisation d'une structure semi-conductrice pour hyperfrequence et composant electronique ainsi obtenu
US3982207A (en) * 1975-03-07 1976-09-21 Bell Telephone Laboratories, Incorporated Quantum effects in heterostructure lasers
US4138274A (en) * 1976-06-09 1979-02-06 Northern Telecom Limited Method of producing optoelectronic devices with control of light propagation by proton bombardment
US4124826A (en) * 1977-03-01 1978-11-07 Bell Telephone Laboratories, Incorporated Current confinement in semiconductor lasers
US4099999A (en) * 1977-06-13 1978-07-11 Xerox Corporation Method of making etched-striped substrate planar laser
US4211586A (en) * 1977-09-21 1980-07-08 International Business Machines Corporation Method of fabricating multicolor light emitting diode array utilizing stepped graded epitaxial layers
US4199385A (en) * 1977-09-21 1980-04-22 International Business Machines Corporation Method of making an optically isolated monolithic light emitting diode array utilizing epitaxial deposition of graded layers and selective diffusion
US4165474A (en) * 1977-12-27 1979-08-21 Texas Instruments Incorporated Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes
US4183038A (en) * 1978-03-29 1980-01-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor laser device
US4169727A (en) * 1978-05-01 1979-10-02 Morgan Semiconductor, Inc. Alloy of silicon and gallium arsenide
US4261771A (en) * 1979-10-31 1981-04-14 Bell Telephone Laboratories, Incorporated Method of fabricating periodic monolayer semiconductor structures by molecular beam epitaxy
US4249967A (en) * 1979-12-26 1981-02-10 International Telephone And Telegraph Corporation Method of manufacturing a light-emitting diode by liquid phase epitaxy

Also Published As

Publication number Publication date
EP0077825A1 (en) 1983-05-04
JPS6351557B2 (ref) 1988-10-14
JPS58500681A (ja) 1983-04-28
WO1982003946A1 (en) 1982-11-11
EP0077825B1 (en) 1987-08-12
EP0077825A4 (en) 1984-07-18

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Legal Events

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