DE3272286D1 - A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath - Google Patents

A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath

Info

Publication number
DE3272286D1
DE3272286D1 DE8282400798T DE3272286T DE3272286D1 DE 3272286 D1 DE3272286 D1 DE 3272286D1 DE 8282400798 T DE8282400798 T DE 8282400798T DE 3272286 T DE3272286 T DE 3272286T DE 3272286 D1 DE3272286 D1 DE 3272286D1
Authority
DE
Germany
Prior art keywords
electroless plating
plating bath
regenerating
regenerating apparatus
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282400798T
Other languages
English (en)
Inventor
Hideo Honma
Yoshiaki Suzuki
Yasuhiro Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Facility Ltd
Kanto Kasei Co Ltd
Original Assignee
Facility Ltd
Kanto Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57039869A external-priority patent/JPS58157959A/ja
Priority claimed from JP6736482A external-priority patent/JPS58185757A/ja
Application filed by Facility Ltd, Kanto Kasei Co Ltd filed Critical Facility Ltd
Application granted granted Critical
Publication of DE3272286D1 publication Critical patent/DE3272286D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/13—Purification and treatment of electroplating baths and plating wastes

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8282400798T 1982-03-13 1982-04-30 A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath Expired DE3272286D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57039869A JPS58157959A (ja) 1982-03-13 1982-03-13 無電解めつき浴の再生方法およびそれに使用する装置
JP6736482A JPS58185757A (ja) 1982-04-23 1982-04-23 無電解めつき浴の再生方法

Publications (1)

Publication Number Publication Date
DE3272286D1 true DE3272286D1 (en) 1986-09-04

Family

ID=26379280

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282400798T Expired DE3272286D1 (en) 1982-03-13 1982-04-30 A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath

Country Status (5)

Country Link
US (1) US4425205A (de)
EP (1) EP0088852B1 (de)
CA (1) CA1220759A (de)
DE (1) DE3272286D1 (de)
GB (1) GB2117003B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4549946A (en) * 1984-05-09 1985-10-29 Electrochem International, Inc. Process and an electrodialytic cell for electrodialytically regenerating a spent electroless copper plating bath
US4752373A (en) * 1985-01-14 1988-06-21 Morton Thiokol, Inc. Electrodialysis apparatus for the chemical maintenance of electroless copper plating baths
US4600493A (en) * 1985-01-14 1986-07-15 Morton Thiokol, Inc. Electrodialysis apparatus for the chemical maintenance of electroless copper plating baths
US4671861A (en) * 1986-03-31 1987-06-09 Morton Thiokol, Inc. Measurement and control of net caustic production during electrodialysis
DE3668914D1 (de) * 1986-04-11 1990-03-15 Ibm Deutschland Verfahren zur regenerierung eines stromlosen verkupferungsbades und vorrichtung zur durchfuehrung desselben.
US4956097A (en) * 1988-10-11 1990-09-11 Enthone, Incorporated Waste treatment of metal containing solutions
DE3929137C1 (de) * 1989-09-01 1991-02-28 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
US5230782A (en) * 1991-07-22 1993-07-27 International Business Machines Corporation Electrolytic process for reducing the organic content of an aqueous composition and apparatus therefore
US5211831A (en) * 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JP3455709B2 (ja) 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
JP2001107258A (ja) * 1999-10-06 2001-04-17 Hitachi Ltd 無電解銅めっき方法とめっき装置および多層配線基板
US6733679B2 (en) * 2001-11-06 2004-05-11 Intel Corporation Method of treating an electroless plating waste
US20080083623A1 (en) * 2006-10-04 2008-04-10 Golden Josh H Method and apparatus for treatment of plating solutions
US7601264B2 (en) * 2006-10-04 2009-10-13 Applied Materials, Inc. Method for treatment of plating solutions
JP4678052B2 (ja) 2008-12-05 2011-04-27 パナソニック電工株式会社 電解水生成装置
US8411083B2 (en) 2011-04-06 2013-04-02 General Electric Company Method and device for displaying an indication of the quality of the three-dimensional data for a surface of a viewed object
CN108358352A (zh) * 2018-03-24 2018-08-03 佛山市云米电器科技有限公司 一种稳流式净水器以及净水设备
CN111039363A (zh) * 2019-12-25 2020-04-21 同济大学 一种基于电化学耦合膜分离自诱导类芬顿的铜破络与强化去除装置及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6603696A (de) 1965-04-28 1966-10-31
DE2114652A1 (de) * 1971-03-23 1972-10-05 Schering Ag Verfahren zum Regenerieren von Elektrolyten fur die chemische Ab scheidung von Metallen
DE2713392C2 (de) * 1977-03-23 1981-11-12 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Metallkomplexlösungen
DE2721994A1 (de) 1977-04-06 1978-10-12 Bbc Brown Boveri & Cie Verfahren zur aufarbeitung waessriger rueckstaende von metallisierungsbaedern
US4337129A (en) 1979-05-08 1982-06-29 The United States Of America As Represented By The Secretary Of The Interior Regeneration of waste metallurgical process liquor
US4324629A (en) 1979-06-19 1982-04-13 Hitachi, Ltd. Process for regenerating chemical copper plating solution
FR2479856A1 (fr) 1980-04-04 1981-10-09 Electricite De France Installation de traitement de surface par depot metallique et procede de regeneration des bains de depot metallique par voie electrolytique

Also Published As

Publication number Publication date
US4425205A (en) 1984-01-10
GB2117003A (en) 1983-10-05
EP0088852B1 (de) 1986-07-30
CA1220759A (en) 1987-04-21
GB2117003B (en) 1985-11-13
EP0088852A1 (de) 1983-09-21

Similar Documents

Publication Publication Date Title
DE3272286D1 (en) A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
GB2066510B (en) Method and apparatus for controlling electroless plating bath
GB2064827B (en) Method and apparatus for controlling electroless plating bath
DE3474043D1 (en) Electroless copper plating bath and method
NZ214511A (en) Electrodialysis apparatus for chemical maintenance of electroless plating baths
GB2147009B (en) Method and apparatus for continuous electroplating of alloys
DE3466076D1 (en) Apparatus for and method of monitoring the operations of a plating process
IL53298A (en) Method and apparatus for operating electroless plating bath
DE3464262D1 (en) Apparatus and process for the galvanic deposition of metals
DE3474165D1 (en) Process for activating substrates for electroless plating
US5077099B1 (en) Electroless copper plating process and apparatus
GB2117408B (en) Nickel electroplating bath and process
DE3063023D1 (en) Process for the regeneration of electroless plating baths
DE3476683D1 (en) Process for electroless plating
DE3464768D1 (en) Process and apparatus for regenerating an ammoniacal etching solution
IL84234A0 (en) Method of and apparatus for enhancing plating bath stability in electroless copper purification process
DE3662278D1 (en) Apparatus and method for monitoring electroless metall plating baths
HK67386A (en) Electroplating bath and process for white palladium
DE3376852D1 (en) Catalyst solutions for activating non-conductive substrates and electroless plating process
EP0265887A3 (en) Method for treating a plating solution
GB2085924B (en) Bath and process for high speed nickel electroplating
SG66786G (en) Bath and process for high speed electroplating of palladium
GB2114159B (en) Method and bath for the electroless plating of gold
HK15092A (en) Apparatus and process for continuously plating fiber
ZA844770B (en) Apparatus and process for continuously plating fiber

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee