DE3269785D1 - A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method - Google Patents

A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method

Info

Publication number
DE3269785D1
DE3269785D1 DE8282901553T DE3269785T DE3269785D1 DE 3269785 D1 DE3269785 D1 DE 3269785D1 DE 8282901553 T DE8282901553 T DE 8282901553T DE 3269785 T DE3269785 T DE 3269785T DE 3269785 D1 DE3269785 D1 DE 3269785D1
Authority
DE
Germany
Prior art keywords
nickel
including palladium
metals copper
chemically stripping
bath intended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282901553T
Other languages
English (en)
Inventor
Jerzy Skowronek
Jan Ola Persson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE3269785D1 publication Critical patent/DE3269785D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8282901553T 1981-05-21 1982-05-06 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method Expired DE3269785D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE8103205A SE426178B (sv) 1981-05-21 1981-05-21 Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel
PCT/SE1982/000154 WO1982004072A1 (en) 1981-05-21 1982-05-06 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method

Publications (1)

Publication Number Publication Date
DE3269785D1 true DE3269785D1 (en) 1986-04-17

Family

ID=20343892

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282901553T Expired DE3269785D1 (en) 1981-05-21 1982-05-06 A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method

Country Status (5)

Country Link
EP (1) EP0079356B1 (de)
JP (1) JPS58500765A (de)
DE (1) DE3269785D1 (de)
SE (1) SE426178B (de)
WO (1) WO1982004072A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1209886A (en) * 1982-01-11 1986-08-19 Thomas W. Bleeks Peroxide selective stripping compositions and method
JPS63172799A (ja) * 1987-01-12 1988-07-16 日本パ−カライジング株式会社 アルミニウムの表面洗浄剤
GB8829253D0 (en) * 1988-12-15 1989-01-25 Imasa Ltd Method of removing deposits of tin lead or tin/lead alloys from copper substrates and compositions for use therein
DE19635981C2 (de) * 1996-09-05 1998-12-24 Peter Prof Dr Ing Mutschler Verfahren zur direkten Regelung der Geschwindigkeit eines elektrischen Antriebes
KR100761608B1 (ko) * 2000-07-26 2007-09-27 미츠비시 가스 가가쿠 가부시키가이샤 팔라듐 제거액 및 팔라듐 제거방법
JP6236824B2 (ja) * 2012-03-29 2017-11-29 宇部興産株式会社 プリント配線基板の製造方法
CN110344033A (zh) 2014-07-10 2019-10-18 奥野制药工业株式会社 树脂镀敷方法以及树脂镀敷用蚀刻浴的管理方法
JP6142408B2 (ja) 2015-03-13 2017-06-07 奥野製薬工業株式会社 治具用電解剥離剤
CN106245030A (zh) * 2016-09-14 2016-12-21 佛山科学技术学院 一种钯镍合金镀层退镀的化学退镀液及退镀方法
CN110629224B (zh) * 2019-10-15 2022-03-18 昆山市板明电子科技有限公司 环境友好型退镍剂及其制备方法和使用方法
CN112111740A (zh) * 2020-09-24 2020-12-22 深圳市松柏实业发展有限公司 镍磷镀层的褪除液、制备方法以及镍磷层的褪除方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945865A (en) * 1974-07-22 1976-03-23 Dart Environment And Services Company Metal dissolution process

Also Published As

Publication number Publication date
SE8103205L (sv) 1982-11-22
EP0079356B1 (de) 1986-03-12
JPS58500765A (ja) 1983-05-12
EP0079356A1 (de) 1983-05-25
WO1982004072A1 (en) 1982-11-25
SE426178B (sv) 1982-12-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee