DE3242856A1 - Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitung - Google Patents
Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitungInfo
- Publication number
- DE3242856A1 DE3242856A1 DE19823242856 DE3242856A DE3242856A1 DE 3242856 A1 DE3242856 A1 DE 3242856A1 DE 19823242856 DE19823242856 DE 19823242856 DE 3242856 A DE3242856 A DE 3242856A DE 3242856 A1 DE3242856 A1 DE 3242856A1
- Authority
- DE
- Germany
- Prior art keywords
- pressure plate
- fluid
- plate
- pressure
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32451281A | 1981-11-24 | 1981-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3242856A1 true DE3242856A1 (de) | 1983-06-01 |
Family
ID=23263921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19823242856 Withdrawn DE3242856A1 (de) | 1981-11-24 | 1982-11-19 | Verfahren zum festklemmen und kuehlen eines halbleiterplaettchens waehrend seiner bearbeitung |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5893247A (fr) |
| DE (1) | DE3242856A1 (fr) |
| FR (1) | FR2517124A1 (fr) |
| GB (1) | GB2109996B (fr) |
| NL (1) | NL8204560A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396005B2 (en) | 2004-10-01 | 2008-07-08 | Unaxis International Trading Ltd. | Clamping device and transport mechanism for transporting substrates |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0775158B2 (ja) * | 1986-05-20 | 1995-08-09 | 東京エレクトロン株式会社 | 半導体製造装置用高真空チヤンバ−における駆動装置 |
| JPH0770297B2 (ja) * | 1986-05-20 | 1995-07-31 | 東京エレクトロン株式会社 | イオン注入装置におけるウエハ保持装置 |
| US4938815A (en) * | 1986-10-15 | 1990-07-03 | Advantage Production Technology, Inc. | Semiconductor substrate heater and reactor process and apparatus |
| US4778559A (en) * | 1986-10-15 | 1988-10-18 | Advantage Production Technology | Semiconductor substrate heater and reactor process and apparatus |
| US5044314A (en) * | 1986-10-15 | 1991-09-03 | Advantage Production Technology, Inc. | Semiconductor wafer processing apparatus |
| US4956046A (en) * | 1986-10-15 | 1990-09-11 | Advantage Production Technology, Inc. | Semiconductor substrate treating method |
| US4891335A (en) * | 1986-10-15 | 1990-01-02 | Advantage Production Technology Inc. | Semiconductor substrate heater and reactor process and apparatus |
| US7385821B1 (en) * | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
| CN110379729B (zh) * | 2018-04-13 | 2022-10-21 | 北京北方华创微电子装备有限公司 | 加热基座及半导体加工设备 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4282924A (en) * | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
| FR2501907A1 (fr) * | 1981-03-13 | 1982-09-17 | Thomson Csf | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
-
1982
- 1982-11-11 GB GB08232241A patent/GB2109996B/en not_active Expired
- 1982-11-19 DE DE19823242856 patent/DE3242856A1/de not_active Withdrawn
- 1982-11-22 JP JP20383582A patent/JPS5893247A/ja active Pending
- 1982-11-23 NL NL8204560A patent/NL8204560A/nl not_active Application Discontinuation
- 1982-11-23 FR FR8219603A patent/FR2517124A1/fr active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396005B2 (en) | 2004-10-01 | 2008-07-08 | Unaxis International Trading Ltd. | Clamping device and transport mechanism for transporting substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2517124B1 (fr) | 1985-02-15 |
| NL8204560A (nl) | 1983-06-16 |
| GB2109996A (en) | 1983-06-08 |
| FR2517124A1 (fr) | 1983-05-27 |
| GB2109996B (en) | 1985-08-07 |
| JPS5893247A (ja) | 1983-06-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8128 | New person/name/address of the agent |
Representative=s name: BERNHARDT, K., DIPL.-ING., PAT.-ANW., 8000 MUENCHE |
|
| 8139 | Disposal/non-payment of the annual fee |