FR2517124B1 - - Google Patents
Info
- Publication number
- FR2517124B1 FR2517124B1 FR8219603A FR8219603A FR2517124B1 FR 2517124 B1 FR2517124 B1 FR 2517124B1 FR 8219603 A FR8219603 A FR 8219603A FR 8219603 A FR8219603 A FR 8219603A FR 2517124 B1 FR2517124 B1 FR 2517124B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32451281A | 1981-11-24 | 1981-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2517124A1 FR2517124A1 (fr) | 1983-05-27 |
FR2517124B1 true FR2517124B1 (fr) | 1985-02-15 |
Family
ID=23263921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8219603A Granted FR2517124A1 (fr) | 1981-11-24 | 1982-11-23 | Appareil de serrage de tranches de semi-conducteur actionne de facon hydraulique |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5893247A (fr) |
DE (1) | DE3242856A1 (fr) |
FR (1) | FR2517124A1 (fr) |
GB (1) | GB2109996B (fr) |
NL (1) | NL8204560A (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0770297B2 (ja) * | 1986-05-20 | 1995-07-31 | 東京エレクトロン株式会社 | イオン注入装置におけるウエハ保持装置 |
JPH0775158B2 (ja) * | 1986-05-20 | 1995-08-09 | 東京エレクトロン株式会社 | 半導体製造装置用高真空チヤンバ−における駆動装置 |
US4938815A (en) * | 1986-10-15 | 1990-07-03 | Advantage Production Technology, Inc. | Semiconductor substrate heater and reactor process and apparatus |
US5044314A (en) * | 1986-10-15 | 1991-09-03 | Advantage Production Technology, Inc. | Semiconductor wafer processing apparatus |
US4778559A (en) * | 1986-10-15 | 1988-10-18 | Advantage Production Technology | Semiconductor substrate heater and reactor process and apparatus |
US4891335A (en) * | 1986-10-15 | 1990-01-02 | Advantage Production Technology Inc. | Semiconductor substrate heater and reactor process and apparatus |
US4956046A (en) * | 1986-10-15 | 1990-09-11 | Advantage Production Technology, Inc. | Semiconductor substrate treating method |
US7385821B1 (en) * | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
CH697200A5 (de) | 2004-10-01 | 2008-06-25 | Oerlikon Assembly Equipment Ag | Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten. |
CN110379729B (zh) * | 2018-04-13 | 2022-10-21 | 北京北方华创微电子装备有限公司 | 加热基座及半导体加工设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4282924A (en) * | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
FR2501907A1 (fr) * | 1981-03-13 | 1982-09-17 | Thomson Csf | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
-
1982
- 1982-11-11 GB GB08232241A patent/GB2109996B/en not_active Expired
- 1982-11-19 DE DE19823242856 patent/DE3242856A1/de not_active Withdrawn
- 1982-11-22 JP JP20383582A patent/JPS5893247A/ja active Pending
- 1982-11-23 NL NL8204560A patent/NL8204560A/nl not_active Application Discontinuation
- 1982-11-23 FR FR8219603A patent/FR2517124A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
NL8204560A (nl) | 1983-06-16 |
JPS5893247A (ja) | 1983-06-02 |
DE3242856A1 (de) | 1983-06-01 |
FR2517124A1 (fr) | 1983-05-27 |
GB2109996B (en) | 1985-08-07 |
GB2109996A (en) | 1983-06-08 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |