DE3207846A1 - Mikrogehaeuse zum einkapseln von halbleiterplaettchen - Google Patents

Mikrogehaeuse zum einkapseln von halbleiterplaettchen

Info

Publication number
DE3207846A1
DE3207846A1 DE19823207846 DE3207846A DE3207846A1 DE 3207846 A1 DE3207846 A1 DE 3207846A1 DE 19823207846 DE19823207846 DE 19823207846 DE 3207846 A DE3207846 A DE 3207846A DE 3207846 A1 DE3207846 A1 DE 3207846A1
Authority
DE
Germany
Prior art keywords
base
microhousing
external connections
micro
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823207846
Other languages
German (de)
English (en)
Inventor
Pierre 75020 Paris Texier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of DE3207846A1 publication Critical patent/DE3207846A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
DE19823207846 1981-03-06 1982-03-04 Mikrogehaeuse zum einkapseln von halbleiterplaettchen Withdrawn DE3207846A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8104536A FR2501414A1 (fr) 1981-03-06 1981-03-06 Microboitier d'encapsulation de pastilles de semi-conducteur, testable apres soudure sur un substrat

Publications (1)

Publication Number Publication Date
DE3207846A1 true DE3207846A1 (de) 1982-09-16

Family

ID=9255957

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823207846 Withdrawn DE3207846A1 (de) 1981-03-06 1982-03-04 Mikrogehaeuse zum einkapseln von halbleiterplaettchen

Country Status (3)

Country Link
DE (1) DE3207846A1 (OSRAM)
FR (1) FR2501414A1 (OSRAM)
GB (1) GB2094552A (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4638348A (en) * 1982-08-10 1987-01-20 Brown David F Semiconductor chip carrier
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
US4695870A (en) * 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
EP0351581A1 (de) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
TW238419B (OSRAM) 1992-08-21 1995-01-11 Olin Corp
AU7873894A (en) * 1993-10-12 1995-05-04 Olin Corporation Edge connectable metal package
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
JPH10125741A (ja) * 1996-10-16 1998-05-15 Oki Electric Ind Co Ltd 集積回路及び集積回路の製造方法及び集積回路の評価方法
TW456004B (en) * 1998-02-10 2001-09-21 Nissha Printing Substrate sheet for semiconductor module, method and apparatus for manufacturing the same
US8395399B2 (en) 2007-12-06 2013-03-12 Nxp B.V. Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3809797A (en) * 1971-11-16 1974-05-07 Du Pont Seal ring compositions and electronic packages made therewith
US4180161A (en) * 1977-02-14 1979-12-25 Motorola, Inc. Carrier structure integral with an electronic package and method of construction

Also Published As

Publication number Publication date
FR2501414B1 (OSRAM) 1984-07-06
FR2501414A1 (fr) 1982-09-10
GB2094552A (en) 1982-09-15

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee