DE3161547D1 - Method of forming a glass-ceramic structure - Google Patents

Method of forming a glass-ceramic structure

Info

Publication number
DE3161547D1
DE3161547D1 DE8181104921T DE3161547T DE3161547D1 DE 3161547 D1 DE3161547 D1 DE 3161547D1 DE 8181104921 T DE8181104921 T DE 8181104921T DE 3161547 T DE3161547 T DE 3161547T DE 3161547 D1 DE3161547 D1 DE 3161547D1
Authority
DE
Germany
Prior art keywords
glass
forming
ceramic structure
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181104921T
Other languages
English (en)
Inventor
Derry Jay Dubetsky
Lester Wynn Herron
Raj Navinchandra Master
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3161547D1 publication Critical patent/DE3161547D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
DE8181104921T 1980-07-14 1981-06-25 Method of forming a glass-ceramic structure Expired DE3161547D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/167,975 US4340436A (en) 1980-07-14 1980-07-14 Process for flattening glass-ceramic substrates

Publications (1)

Publication Number Publication Date
DE3161547D1 true DE3161547D1 (en) 1984-01-05

Family

ID=22609575

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181104921T Expired DE3161547D1 (en) 1980-07-14 1981-06-25 Method of forming a glass-ceramic structure

Country Status (4)

Country Link
US (1) US4340436A (de)
EP (1) EP0043955B1 (de)
JP (1) JPS5732657A (de)
DE (1) DE3161547D1 (de)

Families Citing this family (53)

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JPS57118077A (en) * 1981-01-06 1982-07-22 Central Glass Co Ltd Manufacture of glazed ceramic substrate
DE3204167A1 (de) * 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4540621A (en) * 1983-07-29 1985-09-10 Eggerding Carl L Dielectric substrates comprising cordierite and method of forming the same
JPS60137884A (ja) * 1983-12-26 1985-07-22 株式会社日立製作所 セラミツク多層配線回路基板の製造法
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法
JPS60257195A (ja) * 1984-06-01 1985-12-18 鳴海製陶株式会社 ハイブリツド基板及びその製造方法
DE3534886A1 (de) * 1984-09-30 1986-04-03 Kabushiki Kaisha Toshiba, Kawasaki, Kanagawa Verfahren zum herstellen von aluminiumnitrid-keramik-platten
US4645552A (en) * 1984-11-19 1987-02-24 Hughes Aircraft Company Process for fabricating dimensionally stable interconnect boards
JPS61155243A (ja) * 1984-12-28 1986-07-14 富士通株式会社 グリ−ンシ−ト組成物
US4738885A (en) * 1986-02-24 1988-04-19 Kyocera Corporation Magnetic disk, substrate therefor and process for preparation thereof
US4898842A (en) * 1986-03-03 1990-02-06 International Business Machines Corporation Organometallic-derived cordierite and other compounds comprising oxides of silicon
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
US5130067A (en) * 1986-05-02 1992-07-14 International Business Machines Corporation Method and means for co-sintering ceramic/metal mlc substrates
US4808365A (en) * 1986-10-24 1989-02-28 International Business Machines Corporation Method for reducing edge curl on green sheets
FR2626270B1 (fr) * 1988-01-22 1992-04-30 Pechiney Recherche Procede de cofrittage, de conducteurs en cuivre ou en alliages a base de cuivre et de leur substrat ceramique en cordierite
US5194196A (en) * 1989-10-06 1993-03-16 International Business Machines Corporation Hermetic package for an electronic device and method of manufacturing same
US5211786A (en) * 1990-12-21 1993-05-18 W. R. Grace & Co.-Conn. Use of permeable materials to improve hot pressing process
US5316989A (en) * 1991-05-08 1994-05-31 Gilbert James Method for making a smooth-surface ceramic
EP0563758B1 (de) * 1992-03-25 1997-10-01 Nissan Chemical Industries Ltd. Darstellung eines Sinterkörpers aus Zirconiumoxid
JP2559977B2 (ja) * 1992-07-29 1996-12-04 インターナショナル・ビジネス・マシーンズ・コーポレイション バイアに係るクラックを除去する方法及び構造、並びに、半導体セラミックパッケージ基板。
US5350637A (en) * 1992-10-30 1994-09-27 Corning Incorporated Microlaminated composites and method
US5519191A (en) * 1992-10-30 1996-05-21 Corning Incorporated Fluid heater utilizing laminar heating element having conductive layer bonded to flexible ceramic foil substrate
US5798469A (en) * 1992-12-29 1998-08-25 International Business Machines Corporation Non-sintering controlled pattern formation
US5655209A (en) * 1995-03-28 1997-08-05 International Business Machines Corporation Multilayer ceramic substrates having internal capacitor, and process for producing same
US5628849A (en) * 1995-05-26 1997-05-13 International Business Machines Corporation Method for in-situ environment sensitive sealing and/or product controlling
US5755570A (en) * 1995-05-26 1998-05-26 International Business Machines Corporation Apparatus for in situ environment sensitive sealing and/or product controlling
US6042667A (en) * 1996-03-13 2000-03-28 Sumotomo Metal Electronics Devices, Inc. Method of fabricating ceramic multilayer substrate
US5874162A (en) * 1996-10-10 1999-02-23 International Business Machines Corporation Weighted sintering process and conformable load tile
EP1040333B1 (de) * 1997-12-23 2002-07-03 Unaxis Balzers Aktiengesellschaft Membrane für eine kapazitive vakuummesszelle
DE59803948D1 (de) * 1997-12-23 2002-05-29 Unaxis Balzers Ag Kapazitive vakuummesszelle
US6194053B1 (en) * 1998-02-26 2001-02-27 International Business Machines Corporation Apparatus and method fabricating buried and flat metal features
US6285080B1 (en) 1998-11-23 2001-09-04 International Business Machines Corporation Planar metallized substrate with embedded camber control material and method thereof
US6395337B1 (en) 1999-07-30 2002-05-28 International Business Machines Corporation Substrate with ceramic coating for camber modification and method for making
JP4160901B2 (ja) 2001-10-01 2008-10-08 ヘラエウス インコーポレイテッド マイクロエレクトロニクス用自己拘束型非焼結低温ガラスセラミックテープ及びその製法ならびに用途
DE10205877A1 (de) * 2002-02-13 2003-09-04 Epcos Ag Keramisches Vielschichtbauelement, Verfahren zu dessen Herstellung und Haltevorrichtung
US20090186195A1 (en) * 2006-09-08 2009-07-23 Reactive Nanotechnologies, Inc. Reactive Multilayer Joining With Improved Metallization Techniques
ES2408861T3 (es) * 2010-07-07 2013-06-21 Technical University Of Denmark Método para sinterización
US9206086B2 (en) 2012-04-18 2015-12-08 Nitto Denko Corporation Method and apparatus for sintering flat ceramics
US9205571B2 (en) 2012-04-18 2015-12-08 Nitto Denko Corporation Method and apparatus for sintering flat ceramics
US9362546B1 (en) 2013-01-07 2016-06-07 Quantumscape Corporation Thin film lithium conducting powder material deposition from flux
DE102013007703A1 (de) * 2013-05-03 2014-11-06 Forschungszentrum Jülich GmbH Verfahren zur Herstellung einer Glaslot-Gründichtung
ES2890654T3 (es) 2013-10-07 2022-01-21 Quantumscape Battery Inc Materiales de granate para baterías secundarias de Li y métodos de fabricación y uso de los materiales de granate
KR102609408B1 (ko) * 2015-04-16 2023-12-04 퀀텀스케이프 배터리, 인코포레이티드 고체 전해질 제조를 위한 세터 플레이트 및 그를 사용하여 치밀한 고체 전해질을 제조하는 방법
CN107851774A (zh) 2015-07-21 2018-03-27 昆腾斯科普公司 铸造和烧结生坯石榴石薄膜的方法和材料
US9966630B2 (en) 2016-01-27 2018-05-08 Quantumscape Corporation Annealed garnet electrolyte separators
US11158880B2 (en) 2016-08-05 2021-10-26 Quantumscape Battery, Inc. Translucent and transparent separators
EP3529839A1 (de) 2016-10-21 2019-08-28 QuantumScape Corporation Mit lithium gefüllte granatelektrolyten mit reduzierter oberflächendefektdichte und verfahren zur herstellung und verwendung davon
EP4369453A3 (de) 2017-06-23 2024-10-02 QuantumScape Battery, Inc. Mit lithium gefüllte granatelektrolyten mit sekundärphaseneinschlüssen
US10347937B2 (en) 2017-06-23 2019-07-09 Quantumscape Corporation Lithium-stuffed garnet electrolytes with secondary phase inclusions
WO2019090360A1 (en) 2017-11-06 2019-05-09 Quantumscape Corporation Lithium-stuffed garnet thin films and pellets having an oxyfluorinated and/or fluorinated surface and methods of making and using the thin films and pellets
WO2020018393A1 (en) 2018-07-16 2020-01-23 Corning Incorporated Glass ceramic articles having improved properties and methods for making the same
WO2020018285A1 (en) * 2018-07-16 2020-01-23 Corning Incorporated Methods of ceramming glass articles having improved warp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1671028B1 (de) * 1966-05-18 1971-07-15 Siemens Ag Verfahren zur herstellung von brennunterlagen oder auflagen fuer die verwendung bei der sinterung von duennen plaett chenfoermigen rohlingen aus oxidkeramischen werkstoffen
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
US3879509A (en) * 1971-09-07 1975-04-22 Gilbert James Elderbaum Method of producing thin ceramic sheets with minimal distortion
US4301324A (en) * 1978-02-06 1981-11-17 International Business Machines Corporation Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors

Also Published As

Publication number Publication date
EP0043955B1 (de) 1983-11-30
EP0043955A1 (de) 1982-01-20
JPS643355B2 (de) 1989-01-20
US4340436A (en) 1982-07-20
JPS5732657A (en) 1982-02-22

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee