DE3130072A1 - Integriertes schaltglied - Google Patents

Integriertes schaltglied

Info

Publication number
DE3130072A1
DE3130072A1 DE19813130072 DE3130072A DE3130072A1 DE 3130072 A1 DE3130072 A1 DE 3130072A1 DE 19813130072 DE19813130072 DE 19813130072 DE 3130072 A DE3130072 A DE 3130072A DE 3130072 A1 DE3130072 A1 DE 3130072A1
Authority
DE
Germany
Prior art keywords
capacitor
plane
conductors
chip
latticework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813130072
Other languages
German (de)
English (en)
Inventor
Ward Parkinson
Elliott 29577 Myrtle Beach S.C. Philofsky
Dennis 83702 Boise Id. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of DE3130072A1 publication Critical patent/DE3130072A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE19813130072 1981-01-12 1981-07-30 Integriertes schaltglied Withdrawn DE3130072A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22412781A 1981-01-12 1981-01-12

Publications (1)

Publication Number Publication Date
DE3130072A1 true DE3130072A1 (de) 1982-08-05

Family

ID=22839370

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813130072 Withdrawn DE3130072A1 (de) 1981-01-12 1981-07-30 Integriertes schaltglied

Country Status (5)

Country Link
JP (1) JPS57126157A (https=)
CA (1) CA1156771A (https=)
DE (1) DE3130072A1 (https=)
FR (1) FR2499768B1 (https=)
GB (1) GB2091035B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3428881A1 (de) * 1983-08-10 1985-02-28 Rca Corp., New York, N.Y. Verfahren zum herstellen einer integrierten schaltungsvorrichtung
DE3410196A1 (de) * 1984-03-20 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Leiterband fuer die montage von integrierten schaltkreisen

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
JPH0828447B2 (ja) * 1983-10-05 1996-03-21 富士通株式会社 半導体装置の製造方法
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
JPS61151349U (https=) * 1985-03-11 1986-09-18
FR2584865B1 (fr) * 1985-07-12 1988-06-17 Inf Milit Spatiale Aeronaut Composant electronique comportant un condensateur
DE4017217A1 (de) * 1990-05-29 1991-12-19 Texas Instruments Deutschland Elektronisches bauelement
US5281846A (en) * 1990-05-29 1994-01-25 Texas Instruments Deutschland Gmbh Electronic device having a discrete capacitor adherently mounted to a lead frame
US5140496A (en) * 1991-01-02 1992-08-18 Honeywell, Inc. Direct microcircuit decoupling

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3802069A (en) * 1972-05-04 1974-04-09 Gte Sylvania Inc Fabricating packages for use in integrated circuits
US3880493A (en) * 1973-12-28 1975-04-29 Burroughs Corp Capacitor socket for a dual-in-line package
JPS558286Y2 (https=) * 1974-11-20 1980-02-23
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier
JPS55179055U (https=) * 1979-06-07 1980-12-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3428881A1 (de) * 1983-08-10 1985-02-28 Rca Corp., New York, N.Y. Verfahren zum herstellen einer integrierten schaltungsvorrichtung
DE3410196A1 (de) * 1984-03-20 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Leiterband fuer die montage von integrierten schaltkreisen

Also Published As

Publication number Publication date
CA1156771A (en) 1983-11-08
GB2091035A (en) 1982-07-21
GB2091035B (en) 1985-01-09
JPS57126157A (en) 1982-08-05
FR2499768A1 (fr) 1982-08-13
FR2499768B1 (fr) 1985-12-20
JPS6316906B2 (https=) 1988-04-11

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee