DE3070907D1 - Mounting and packaging of silicon devices on ceramic substrates, and packaged silicon devices - Google Patents

Mounting and packaging of silicon devices on ceramic substrates, and packaged silicon devices

Info

Publication number
DE3070907D1
DE3070907D1 DE8080108016T DE3070907T DE3070907D1 DE 3070907 D1 DE3070907 D1 DE 3070907D1 DE 8080108016 T DE8080108016 T DE 8080108016T DE 3070907 T DE3070907 T DE 3070907T DE 3070907 D1 DE3070907 D1 DE 3070907D1
Authority
DE
Germany
Prior art keywords
silicon devices
packaging
mounting
ceramic substrates
packaged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080108016T
Other languages
German (de)
English (en)
Inventor
Louis Jacques Rodrique St
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Application granted granted Critical
Publication of DE3070907D1 publication Critical patent/DE3070907D1/de
Expired legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
DE8080108016T 1980-01-09 1980-12-18 Mounting and packaging of silicon devices on ceramic substrates, and packaged silicon devices Expired DE3070907D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA343,318A CA1115852A (en) 1980-01-09 1980-01-09 Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices

Publications (1)

Publication Number Publication Date
DE3070907D1 true DE3070907D1 (en) 1985-08-29

Family

ID=4116006

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080108016T Expired DE3070907D1 (en) 1980-01-09 1980-12-18 Mounting and packaging of silicon devices on ceramic substrates, and packaged silicon devices

Country Status (5)

Country Link
US (1) US4406054A (enExample)
EP (1) EP0032565B1 (enExample)
JP (2) JPS56101750A (enExample)
CA (1) CA1115852A (enExample)
DE (1) DE3070907D1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566170A (en) * 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
US4760440A (en) * 1983-10-31 1988-07-26 General Electric Company Package for solid state image sensors
DE3516954A1 (de) * 1984-05-14 1985-11-14 Gigabit Logic, Inc., Newbury Park, Calif. Montierte integrierte schaltung
US5162251A (en) * 1991-03-18 1992-11-10 Hughes Danbury Optical Systems, Inc. Method for making thinned charge-coupled devices
JP4663304B2 (ja) * 2004-11-30 2011-04-06 株式会社吉野工業所 液状物の注出容器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577037A (en) * 1968-07-05 1971-05-04 Ibm Diffused electrical connector apparatus and method of making same
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package

Also Published As

Publication number Publication date
JPH0410700Y2 (enExample) 1992-03-17
EP0032565A1 (en) 1981-07-29
EP0032565B1 (en) 1985-07-24
CA1115852A (en) 1982-01-05
JPS56101750A (en) 1981-08-14
JPH0357946U (enExample) 1991-06-05
US4406054A (en) 1983-09-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee