DE3068204D1 - Process for transferring onto a support the true shadow of a mask pierced with regularly distributed slits, and application of this process to photolithography in particular - Google Patents
Process for transferring onto a support the true shadow of a mask pierced with regularly distributed slits, and application of this process to photolithography in particularInfo
- Publication number
- DE3068204D1 DE3068204D1 DE8080401211T DE3068204T DE3068204D1 DE 3068204 D1 DE3068204 D1 DE 3068204D1 DE 8080401211 T DE8080401211 T DE 8080401211T DE 3068204 T DE3068204 T DE 3068204T DE 3068204 D1 DE3068204 D1 DE 3068204D1
- Authority
- DE
- Germany
- Prior art keywords
- photolithography
- support
- application
- regularly distributed
- transferring onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000000206 photolithography Methods 0.000 title 1
- 230000000644 propagated effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70583—Speckle reduction, e.g. coherence control or amplitude/wavefront splitting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2045—Exposure; Apparatus therefor using originals with apertures, e.g. stencil exposure masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S359/00—Optical: systems and elements
- Y10S359/90—Methods
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Spectrometry And Color Measurement (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7922554A FR2465255B1 (fr) | 1979-09-10 | 1979-09-10 | Procede pour reporter sur un support l'ombre fidele d'un masque perce de fentes distribuees periodiquement, et application de ce procede notamment en photolithogravure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3068204D1 true DE3068204D1 (en) | 1984-07-19 |
Family
ID=9229507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8080401211T Expired DE3068204D1 (en) | 1979-09-10 | 1980-08-25 | Process for transferring onto a support the true shadow of a mask pierced with regularly distributed slits, and application of this process to photolithography in particular |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4389094A (OSRAM) |
| EP (1) | EP0025380B1 (OSRAM) |
| JP (1) | JPS5640831A (OSRAM) |
| AT (1) | ATE7967T1 (OSRAM) |
| CA (1) | CA1140373A (OSRAM) |
| DE (1) | DE3068204D1 (OSRAM) |
| FR (1) | FR2465255B1 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5465220A (en) | 1992-06-02 | 1995-11-07 | Fujitsu Limited | Optical exposure method |
| FR2519157B1 (fr) * | 1981-12-30 | 1987-07-31 | Labo Electronique Physique | Procede pour la realisation de motifs submicroniques et motifs ainsi obtenus |
| JPS5930574A (ja) * | 1982-08-14 | 1984-02-18 | Konishiroku Photo Ind Co Ltd | 電子写真複写機用クリ−ニングブレ−ド |
| US5243583A (en) * | 1989-04-06 | 1993-09-07 | Ricoh Company, Ltd. | Optical pickup device with dual grating element |
| DE19810055A1 (de) * | 1998-03-09 | 1999-09-23 | Suess Kg Karl | Verfahren zur Nahfeldbelichtung mit im wesentlichen parallelem Licht |
| RU2164705C1 (ru) * | 2000-07-31 | 2001-03-27 | Чурюмов Владимир Александрович | Способ получения вариоизображений |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1744642A (en) * | 1925-08-04 | 1930-01-21 | Kondo Kenyu | Manufacture of reproduced diffraction gratings |
| DE1572195A1 (de) * | 1965-06-05 | 1970-03-26 | Telefunken Patent | Verfahren zur Herstellung von Mikrostrukturen kleiner Linienbreite |
| US3615449A (en) * | 1969-09-25 | 1971-10-26 | Rca Corp | Method of generating high area-density periodic arrays by diffraction imaging |
| US3640197A (en) * | 1970-01-22 | 1972-02-08 | Motorola Inc | Production of fine single lines and of discrete closely spaced fine lines |
| DE2037590A1 (de) * | 1970-07-29 | 1972-02-10 | Licentia Gmbh | Verfahren zur Herstellung von Mikro strukturen |
| US3680945A (en) * | 1970-10-23 | 1972-08-01 | Xerox Corp | Fabrication of refractive blazed holograms |
| DE2116713B2 (de) * | 1971-04-06 | 1974-03-28 | Ibm Deutschland Gmbh, 7000 Stuttgart | Belichtungsverfahren zum Abbilden sehr fein strukturierter Lichtmuster auf Photolackschichten und dazu geeignete Belichtungsvorrichtung |
| US3697178A (en) * | 1971-11-01 | 1972-10-10 | Rca Corp | Method of projection printing photoresist masking layers, including elimination of spurious diffraction-associated patterns from the print |
| JPS5147573A (en) * | 1974-10-22 | 1976-04-23 | Japan Atomic Energy Res Inst | Yojoodei kongonamaodeino maeshorihoho |
| JPS51120615A (en) * | 1975-04-16 | 1976-10-22 | Nippon Hoso Kyokai <Nhk> | Manufacturing method for comb-type electrodes |
| FR2356975A1 (fr) * | 1976-06-30 | 1978-01-27 | Ibm | Procede d'impression photolithographique du type a contact permettant d'obtenir des profils a resolution elevee et appareil utilisant un tel procede |
| FR2406236A1 (fr) * | 1976-12-10 | 1979-05-11 | Thomson Csf | Dispositif optique a source coherente pour le transfert rapide de motifs sur substrats, applique a la realisation de composants et circuits a microstructures |
| US4157935A (en) * | 1977-12-23 | 1979-06-12 | International Business Machines Corporation | Method for producing nozzle arrays for ink jet printers |
-
1979
- 1979-09-10 FR FR7922554A patent/FR2465255B1/fr not_active Expired
-
1980
- 1980-08-25 AT AT80401211T patent/ATE7967T1/de not_active IP Right Cessation
- 1980-08-25 EP EP80401211A patent/EP0025380B1/fr not_active Expired
- 1980-08-25 DE DE8080401211T patent/DE3068204D1/de not_active Expired
- 1980-08-29 JP JP11853680A patent/JPS5640831A/ja active Granted
- 1980-09-05 US US06/184,265 patent/US4389094A/en not_active Expired - Lifetime
- 1980-09-08 CA CA000359986A patent/CA1140373A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2465255A1 (fr) | 1981-03-20 |
| CA1140373A (en) | 1983-02-01 |
| JPH0250613B2 (OSRAM) | 1990-11-02 |
| FR2465255B1 (fr) | 1987-02-20 |
| EP0025380B1 (fr) | 1984-06-13 |
| ATE7967T1 (de) | 1984-06-15 |
| US4389094A (en) | 1983-06-21 |
| EP0025380A1 (fr) | 1981-03-18 |
| JPS5640831A (en) | 1981-04-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8339 | Ceased/non-payment of the annual fee |