DE29504352U1 - Halbleiteranordnung mit Spannvorrichtung für scheibenförmige Leistungs-Halbleiterbauelemente - Google Patents

Halbleiteranordnung mit Spannvorrichtung für scheibenförmige Leistungs-Halbleiterbauelemente

Info

Publication number
DE29504352U1
DE29504352U1 DE29504352U DE29504352U DE29504352U1 DE 29504352 U1 DE29504352 U1 DE 29504352U1 DE 29504352 U DE29504352 U DE 29504352U DE 29504352 U DE29504352 U DE 29504352U DE 29504352 U1 DE29504352 U1 DE 29504352U1
Authority
DE
Germany
Prior art keywords
disk
clamping device
shaped power
power semiconductor
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29504352U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUPEC GmbH
Original Assignee
EUPEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUPEC GmbH filed Critical EUPEC GmbH
Priority to DE29504352U priority Critical patent/DE29504352U1/de
Publication of DE29504352U1 publication Critical patent/DE29504352U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074Stacked arrangements of non-apertured devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
DE29504352U 1995-03-14 1995-03-14 Halbleiteranordnung mit Spannvorrichtung für scheibenförmige Leistungs-Halbleiterbauelemente Expired - Lifetime DE29504352U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29504352U DE29504352U1 (de) 1995-03-14 1995-03-14 Halbleiteranordnung mit Spannvorrichtung für scheibenförmige Leistungs-Halbleiterbauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29504352U DE29504352U1 (de) 1995-03-14 1995-03-14 Halbleiteranordnung mit Spannvorrichtung für scheibenförmige Leistungs-Halbleiterbauelemente

Publications (1)

Publication Number Publication Date
DE29504352U1 true DE29504352U1 (de) 1995-08-03

Family

ID=8005330

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29504352U Expired - Lifetime DE29504352U1 (de) 1995-03-14 1995-03-14 Halbleiteranordnung mit Spannvorrichtung für scheibenförmige Leistungs-Halbleiterbauelemente

Country Status (1)

Country Link
DE (1) DE29504352U1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0886315A1 (de) * 1997-06-19 1998-12-23 Alcatel Elektronsicherer Leistungsmodul und Leistungsgerät damit
FR3074011A1 (fr) * 2017-11-21 2019-05-24 Safran Electronics & Defense Module electrique de puissance

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0886315A1 (de) * 1997-06-19 1998-12-23 Alcatel Elektronsicherer Leistungsmodul und Leistungsgerät damit
FR2765067A1 (fr) * 1997-06-19 1998-12-24 Alsthom Cge Alcatel Module d'electronique de puissance et un dispositif d'electronique de puissance pourvu de tels modules
US6084771A (en) * 1997-06-19 2000-07-04 Alcatel Power electronic module and power electronic device including such modules
FR3074011A1 (fr) * 2017-11-21 2019-05-24 Safran Electronics & Defense Module electrique de puissance
WO2019101634A1 (fr) * 2017-11-21 2019-05-31 Safran Electronics & Defense Module électrique de puissance
CN111373850A (zh) * 2017-11-21 2020-07-03 赛峰电子与防务公司 电力模块
US11444543B2 (en) 2017-11-21 2022-09-13 Safran Electronics & Defense Electrical power module

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19950914

R150 Term of protection extended to 6 years

Effective date: 19980709

R151 Term of protection extended to 8 years

Effective date: 20010713

R152 Term of protection extended to 10 years

Effective date: 20030605

R071 Expiry of right