DE2860255D1 - Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby - Google Patents

Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby

Info

Publication number
DE2860255D1
DE2860255D1 DE7878300100T DE2860255T DE2860255D1 DE 2860255 D1 DE2860255 D1 DE 2860255D1 DE 7878300100 T DE7878300100 T DE 7878300100T DE 2860255 T DE2860255 T DE 2860255T DE 2860255 D1 DE2860255 D1 DE 2860255D1
Authority
DE
Germany
Prior art keywords
solder
substrates
reflowing
plated
substrates formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7878300100T
Other languages
English (en)
Inventor
Hans Hugo Ammann
Michael Ackman Oien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of DE2860255D1 publication Critical patent/DE2860255D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
DE7878300100T 1977-07-01 1978-06-29 Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby Expired DE2860255D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/812,230 US4115601A (en) 1977-07-01 1977-07-01 Flexible circuit reflow soldering process and machine

Publications (1)

Publication Number Publication Date
DE2860255D1 true DE2860255D1 (en) 1981-01-29

Family

ID=25208932

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7878300100T Expired DE2860255D1 (en) 1977-07-01 1978-06-29 Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby

Country Status (8)

Country Link
US (1) US4115601A (de)
EP (1) EP0000284B1 (de)
JP (1) JPS5826194B2 (de)
CA (1) CA1081550A (de)
DE (1) DE2860255D1 (de)
ES (1) ES471324A1 (de)
IE (1) IE46960B1 (de)
IT (1) IT1096957B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique
US4321031A (en) * 1979-07-09 1982-03-23 Woodgate Ralph W Method and apparatus for condensation heating
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system
JPS58197A (ja) * 1981-06-25 1983-01-05 日本メクトロン株式会社 フレキシブル回路基板のハンダ処理法および装置
JPS5822768U (ja) * 1981-08-04 1983-02-12 上村工業株式会社 プリント基板用リフロ−処理装置
US4558524A (en) * 1982-10-12 1985-12-17 Usm Corporation Single vapor system for soldering, fusing or brazing
FR2556083B1 (fr) * 1983-10-11 1986-04-25 Piezo Ceram Electronique Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci
FR2553186B1 (fr) * 1983-10-11 1988-10-14 Piezo Ceram Electronique Perfectionnements aux machines de chauffage d'articles ou produits par condensation de vapeur sur ceux-ci
US4697730A (en) * 1984-05-25 1987-10-06 The Htc Corporation Continuous solder system
US4685605A (en) * 1984-05-25 1987-08-11 The Htc Corporation Continuous solder system
DE3673880D1 (de) * 1985-06-08 1990-10-11 Nippon Dennetsu Keiki Kk Dampfphasenloetvorrichtung.
JPS6224859A (ja) * 1985-07-24 1987-02-02 Kenji Kondo はんだ付け装置
US4766677A (en) * 1986-05-27 1988-08-30 Detrex Chemical Industries, Inc. Method and apparatus for vapor phase soldering
US4805828A (en) * 1987-01-23 1989-02-21 Rockwell International Corporation Thermally durable surface mounted device printed wiring assemblies and apparatus and method for manufacture and repair
US4801069A (en) * 1987-03-30 1989-01-31 Westinghouse Electric Corp. Method and apparatus for solder deposition
US4762264A (en) * 1987-09-10 1988-08-09 Dynapert-Htc Corporation Vapor phase soldering system
US4782991A (en) * 1987-11-24 1988-11-08 Unisys Corporation Hot liquid solder reflow machine
US5030805A (en) * 1990-02-20 1991-07-09 Minnesota Mining And Manufacturing Company Condensation heating apparatus
US5452401A (en) 1992-03-31 1995-09-19 Seiko Epson Corporation Selective power-down for high performance CPU/system
US5542596A (en) * 1994-12-20 1996-08-06 United Technologies Corp. Vapor phase soldering machine having a tertiary cooling vapor
DE19826520C1 (de) * 1998-06-15 1999-12-02 Helmut Walter Leicht Verfahren zum Steuern der Wärmeübertragung auf ein Werkstück beim Dampfphasenlöten
JP2000244108A (ja) * 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置
US20100308103A1 (en) * 2009-06-08 2010-12-09 Tyco Electronics Corporation System and method for vapor phase reflow of a conductive coating
US9930789B2 (en) 2010-04-12 2018-03-27 Seagate Technology Llc Flexible printed circuit cable with multi-layer interconnection and method of forming the same
ITUB20152805A1 (it) * 2015-08-03 2017-02-03 Piaggio & C Spa Dispositivo ad alberi rotanti

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3067056A (en) * 1959-10-15 1962-12-04 Robert K Remer Improvements in printing with ink composition having volatile solvents
US3346413A (en) * 1964-10-12 1967-10-10 Hooker Chemical Corp Method and apparatus for coating wire and solvent recovery
DE1546009B2 (de) * 1966-09-03 1971-04-29 GT Schjeldahl Co , Northfield, Minn (V St A) Verfahren zur herstellung gedruckter schaltungen
US3704165A (en) * 1967-07-06 1972-11-28 Brown Eng Co Inc Solder leveling method
US3707762A (en) * 1970-10-29 1973-01-02 North American Rockwell Methods of using fluxes in joining metal surfaces
BE787366A (fr) * 1971-08-09 1973-02-09 Dow Chemical Co Methode de modification de l'etat de surface de matieres plastiques
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
SE424518B (sv) * 1973-09-07 1982-07-26 Western Electric Co Forfarande och anordning for mjuklodning, smeltning eller hardlodning
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
US4032033A (en) * 1976-03-18 1977-06-28 Western Electric Company, Inc. Methods and apparatus for heating articles

Also Published As

Publication number Publication date
JPS5418070A (en) 1979-02-09
US4115601A (en) 1978-09-19
IT1096957B (it) 1985-08-26
IE46960B1 (en) 1983-11-16
EP0000284A1 (de) 1979-01-10
EP0000284B1 (de) 1980-10-29
IE781327L (en) 1979-01-01
IT7825259A0 (it) 1978-06-30
JPS5826194B2 (ja) 1983-06-01
CA1081550A (en) 1980-07-15
ES471324A1 (es) 1979-02-01

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee