JPS5412459A - Substrate device for electronic apparatus and method of manufacturing same - Google Patents
Substrate device for electronic apparatus and method of manufacturing sameInfo
- Publication number
- JPS5412459A JPS5412459A JP7834577A JP7834577A JPS5412459A JP S5412459 A JPS5412459 A JP S5412459A JP 7834577 A JP7834577 A JP 7834577A JP 7834577 A JP7834577 A JP 7834577A JP S5412459 A JPS5412459 A JP S5412459A
- Authority
- JP
- Japan
- Prior art keywords
- electronic apparatus
- manufacturing same
- substrate device
- substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7834577A JPS5412459A (en) | 1977-06-30 | 1977-06-30 | Substrate device for electronic apparatus and method of manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7834577A JPS5412459A (en) | 1977-06-30 | 1977-06-30 | Substrate device for electronic apparatus and method of manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5412459A true JPS5412459A (en) | 1979-01-30 |
Family
ID=13659391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7834577A Pending JPS5412459A (en) | 1977-06-30 | 1977-06-30 | Substrate device for electronic apparatus and method of manufacturing same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5412459A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63284888A (en) * | 1987-05-18 | 1988-11-22 | Furukawa Electric Co Ltd:The | Manufacture of circuit molded form |
JPH01105593A (en) * | 1987-10-19 | 1989-04-24 | Toshiba Corp | Semiconductor circuit device |
JPH0712111B2 (en) * | 1985-09-04 | 1995-02-08 | ユーエフイー・インコーポレイテッド | Electric circuit embedding method and plastic products |
WO2012049898A1 (en) * | 2010-10-15 | 2012-04-19 | 日本電気株式会社 | Module with built-in component, electronic device comprising same, and method for manufacturing module with built-in component |
WO2012137962A1 (en) * | 2011-04-07 | 2012-10-11 | 日本電気株式会社 | Component-containing module and method for producing component-containing module |
-
1977
- 1977-06-30 JP JP7834577A patent/JPS5412459A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0712111B2 (en) * | 1985-09-04 | 1995-02-08 | ユーエフイー・インコーポレイテッド | Electric circuit embedding method and plastic products |
JPS63284888A (en) * | 1987-05-18 | 1988-11-22 | Furukawa Electric Co Ltd:The | Manufacture of circuit molded form |
JPH01105593A (en) * | 1987-10-19 | 1989-04-24 | Toshiba Corp | Semiconductor circuit device |
WO2012049898A1 (en) * | 2010-10-15 | 2012-04-19 | 日本電気株式会社 | Module with built-in component, electronic device comprising same, and method for manufacturing module with built-in component |
US9036359B2 (en) | 2010-10-15 | 2015-05-19 | Leonovo Innovations Limited (Hong Kong) | Component built-in module, electronic device including same, and method for manufacturing component built-in module |
WO2012137962A1 (en) * | 2011-04-07 | 2012-10-11 | 日本電気株式会社 | Component-containing module and method for producing component-containing module |
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