JPS51136283A - Method and apparatus for protecting ultra small electronic devices - Google Patents

Method and apparatus for protecting ultra small electronic devices

Info

Publication number
JPS51136283A
JPS51136283A JP51047586A JP4758676A JPS51136283A JP S51136283 A JPS51136283 A JP S51136283A JP 51047586 A JP51047586 A JP 51047586A JP 4758676 A JP4758676 A JP 4758676A JP S51136283 A JPS51136283 A JP S51136283A
Authority
JP
Japan
Prior art keywords
electronic devices
small electronic
ultra small
protecting
protecting ultra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51047586A
Other languages
Japanese (ja)
Inventor
Kai Koo Chiyuu
Jiyosefu Antoine Banbe Aamando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR Voyix Corp
Original Assignee
NCR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR Corp filed Critical NCR Corp
Publication of JPS51136283A publication Critical patent/JPS51136283A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP51047586A 1975-04-28 1976-04-26 Method and apparatus for protecting ultra small electronic devices Pending JPS51136283A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57257675A 1975-04-28 1975-04-28

Publications (1)

Publication Number Publication Date
JPS51136283A true JPS51136283A (en) 1976-11-25

Family

ID=24288458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51047586A Pending JPS51136283A (en) 1975-04-28 1976-04-26 Method and apparatus for protecting ultra small electronic devices

Country Status (5)

Country Link
JP (1) JPS51136283A (en)
DE (1) DE2618026A1 (en)
FR (1) FR2309979A1 (en)
IT (1) IT1063008B (en)
NL (1) NL7604289A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device
JPS6320845A (en) * 1986-07-14 1988-01-28 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit
JPH0499383A (en) * 1990-08-17 1992-03-31 Mitsubishi Electric Corp Semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
US4486945A (en) * 1981-04-21 1984-12-11 Seiichiro Aigoo Method of manufacturing semiconductor device with plated bump

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device
JPS6320845A (en) * 1986-07-14 1988-01-28 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit
JPH0499383A (en) * 1990-08-17 1992-03-31 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
FR2309979A1 (en) 1976-11-26
IT1063008B (en) 1985-02-11
DE2618026A1 (en) 1976-11-04
NL7604289A (en) 1976-11-01

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