IT1063008B - SEMICONDUCTIVE DEVICE - Google Patents

SEMICONDUCTIVE DEVICE

Info

Publication number
IT1063008B
IT1063008B IT22734/76A IT2273476A IT1063008B IT 1063008 B IT1063008 B IT 1063008B IT 22734/76 A IT22734/76 A IT 22734/76A IT 2273476 A IT2273476 A IT 2273476A IT 1063008 B IT1063008 B IT 1063008B
Authority
IT
Italy
Prior art keywords
semiconductive device
semiconductive
Prior art date
Application number
IT22734/76A
Other languages
Italian (it)
Original Assignee
Ncr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ncr Co filed Critical Ncr Co
Application granted granted Critical
Publication of IT1063008B publication Critical patent/IT1063008B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
IT22734/76A 1975-04-28 1976-04-27 SEMICONDUCTIVE DEVICE IT1063008B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57257675A 1975-04-28 1975-04-28

Publications (1)

Publication Number Publication Date
IT1063008B true IT1063008B (en) 1985-02-11

Family

ID=24288458

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22734/76A IT1063008B (en) 1975-04-28 1976-04-27 SEMICONDUCTIVE DEVICE

Country Status (5)

Country Link
JP (1) JPS51136283A (en)
DE (1) DE2618026A1 (en)
FR (1) FR2309979A1 (en)
IT (1) IT1063008B (en)
NL (1) NL7604289A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
US4486945A (en) * 1981-04-21 1984-12-11 Seiichiro Aigoo Method of manufacturing semiconductor device with plated bump
JPS6320845A (en) * 1986-07-14 1988-01-28 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit
JPH0499383A (en) * 1990-08-17 1992-03-31 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
FR2309979A1 (en) 1976-11-26
DE2618026A1 (en) 1976-11-04
JPS51136283A (en) 1976-11-25
NL7604289A (en) 1976-11-01

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