DE2760435C2 - - Google Patents

Info

Publication number
DE2760435C2
DE2760435C2 DE19772760435 DE2760435A DE2760435C2 DE 2760435 C2 DE2760435 C2 DE 2760435C2 DE 19772760435 DE19772760435 DE 19772760435 DE 2760435 A DE2760435 A DE 2760435A DE 2760435 C2 DE2760435 C2 DE 2760435C2
Authority
DE
Germany
Prior art keywords
carrier
strips
opening
conductor strips
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19772760435
Other languages
German (de)
English (en)
Inventor
Manabu Bonkohara
Hisao Tokio/Tokyo Jp Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to DE19772760435 priority Critical patent/DE2760435C2/de
Priority claimed from DE19772725260 external-priority patent/DE2725260A1/de
Application granted granted Critical
Publication of DE2760435C2 publication Critical patent/DE2760435C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19772760435 1977-06-03 1977-06-03 Expired DE2760435C2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772760435 DE2760435C2 (enrdf_load_stackoverflow) 1977-06-03 1977-06-03

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19772725260 DE2725260A1 (de) 1977-06-03 1977-06-03 Rahmen- und leiter-anordnung fuer ein halbleiterbauelement
DE19772760435 DE2760435C2 (enrdf_load_stackoverflow) 1977-06-03 1977-06-03

Publications (1)

Publication Number Publication Date
DE2760435C2 true DE2760435C2 (enrdf_load_stackoverflow) 1989-01-26

Family

ID=25772103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772760435 Expired DE2760435C2 (enrdf_load_stackoverflow) 1977-06-03 1977-06-03

Country Status (1)

Country Link
DE (1) DE2760435C2 (enrdf_load_stackoverflow)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
GB1197751A (en) * 1966-07-29 1970-07-08 Texas Instruments Inc Process for Packaging Multilead Semiconductor Devices and Resulting Product.
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente
DE1790305B2 (de) * 1966-11-09 1977-02-24 Ausscheidung aus: 15 89 480 Advalloy, Inc., Palo Alto, Calif. (V.St.A.) Verfahren zum versteifen von aus metallblech bestehenden, in streifenform miteinander verbundenen kontaktierungsrahmen fuer halbleiter-bauelemente, insbesondere integrierte schaltkreise
DE2444418B2 (de) * 1974-09-17 1977-03-24 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
GB1197751A (en) * 1966-07-29 1970-07-08 Texas Instruments Inc Process for Packaging Multilead Semiconductor Devices and Resulting Product.
DE1790305B2 (de) * 1966-11-09 1977-02-24 Ausscheidung aus: 15 89 480 Advalloy, Inc., Palo Alto, Calif. (V.St.A.) Verfahren zum versteifen von aus metallblech bestehenden, in streifenform miteinander verbundenen kontaktierungsrahmen fuer halbleiter-bauelemente, insbesondere integrierte schaltkreise
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente
DE2444418B2 (de) * 1974-09-17 1977-03-24 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement

Similar Documents

Publication Publication Date Title
DE3319311C2 (de) Verfahren zur Herstellung eines elektroakustischen Wandlers mit feststehender Elektrode und dieser gegenüberstehender Membran
DE1514827C2 (de) Verfahren zur serienmäßigen Herstellung von Halbleiterbauelementen
DE2603383C2 (enrdf_load_stackoverflow)
DE68910385T3 (de) Herstellungsverfahren einer elektronischen Speicherkarte und elektronische Speicherkarte, die nach diesem Verfahren hergestellt ist.
DE68908808T2 (de) Verfahren zum Montieren elektronischer Mikrokomponenten auf einer Unterlage und Zwischenprodukt.
DE1948925C3 (de) Verbindungsanordnung für Druckschaltungskarten
DE4000089C2 (enrdf_load_stackoverflow)
DE2240781B2 (de) FlussigkristallzeUe
DE112009001287T5 (de) Widerstand
DE19927948A1 (de) Chipthermistoren und Verfahren zum Herstellen derselben
DE2225825B2 (de) Verfahren zum Herstellen einer Anzahl plättchenförmiger Festkörper-Elektrolytkondensatoren
DE2817480C2 (de) Hybridschaltung, die mit einer Halbleiterschaltung versehen ist
DE19953162A1 (de) Verfahren zum Herstellen von Thermistor-Chips
DE4133008C2 (de) Kapazitive Drucksensoren und Herstellungsverfahren hierzu
DE2103064A1 (de) Vorrichtung zur Herstellung von Modulelementen
DE2315711A1 (de) Verfahren zum kontaktieren von in einem halbleiterkoerper untergebrachten integrierten schaltungen mit hilfe eines ersten kontaktierungsrahmens
DE2045214C3 (de) Piezoelektrische Kristallanordnung
DE69837636T2 (de) Herstellungsverfahren von elektronischen Komponenten
DE2515044A1 (de) Vorrichtung zur elektrischen verbindung einer vielzahl von mit abstand voneinander angeordneten elektrischen leitern
DE112020001355T5 (de) Chip-widerstand
DE19729785C2 (de) Kondensatoranordnung und ihr Herstellungsverfahren
DE1909480C2 (de) Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips
DE2725260C2 (enrdf_load_stackoverflow)
DE2760435C2 (enrdf_load_stackoverflow)
WO2017144691A1 (de) Optoelektronisches bauteil mit einem leiterrahmenabschnitt

Legal Events

Date Code Title Description
Q172 Divided out of (supplement):

Ref country code: DE

Ref document number: 2725260

8110 Request for examination paragraph 44
AC Divided out of

Ref country code: DE

Ref document number: 2725260

Format of ref document f/p: P

AC Divided out of

Ref country code: DE

Ref document number: 2725260

Format of ref document f/p: P

D2 Grant after examination
8364 No opposition during term of opposition