DE2746814C2 - - Google Patents

Info

Publication number
DE2746814C2
DE2746814C2 DE2746814A DE2746814A DE2746814C2 DE 2746814 C2 DE2746814 C2 DE 2746814C2 DE 2746814 A DE2746814 A DE 2746814A DE 2746814 A DE2746814 A DE 2746814A DE 2746814 C2 DE2746814 C2 DE 2746814C2
Authority
DE
Germany
Prior art keywords
workpiece
signals
arrangement
chip
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2746814A
Other languages
German (de)
English (en)
Other versions
DE2746814A1 (de
Inventor
Virge Ward Richardson Tex. Us Mcclure
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE2746814A1 publication Critical patent/DE2746814A1/de
Application granted granted Critical
Publication of DE2746814C2 publication Critical patent/DE2746814C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting programme, configuration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37572—Camera, tv, vision
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Analysis (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19772746814 1976-10-18 1977-10-18 Anordnung zur automatischen ausfuehrung einer folge von arbeitsgaengen an einem werkstueck Granted DE2746814A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73350176A 1976-10-18 1976-10-18

Publications (2)

Publication Number Publication Date
DE2746814A1 DE2746814A1 (de) 1978-04-20
DE2746814C2 true DE2746814C2 (enExample) 1987-08-20

Family

ID=24947871

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772746814 Granted DE2746814A1 (de) 1976-10-18 1977-10-18 Anordnung zur automatischen ausfuehrung einer folge von arbeitsgaengen an einem werkstueck

Country Status (4)

Country Link
JP (1) JPS5350673A (enExample)
DE (1) DE2746814A1 (enExample)
FR (1) FR2368073A1 (enExample)
GB (1) GB1592368A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
GB2151350A (en) * 1983-11-25 1985-07-17 Vs Eng Ltd Sensing arrangement
CN115437327B (zh) * 2022-09-15 2024-10-11 中国核动力研究设计院 一种智能化核安全级dcs设计与验证方法、系统及存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633011A (en) * 1968-08-29 1972-01-04 Ibm Method and apparatus for precisely contouring a workpiece imprecisely positioned on a supporting fixture
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine
US3746447A (en) * 1971-07-07 1973-07-17 California Computer Products Marker enlarger
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US4017721A (en) * 1974-05-16 1977-04-12 The Bendix Corporation Method and apparatus for determining the position of a body
US3986007A (en) * 1975-08-20 1976-10-12 The Bendix Corporation Method and apparatus for calibrating mechanical-visual part manipulating system

Also Published As

Publication number Publication date
GB1592368A (en) 1981-07-08
JPS6240852B2 (enExample) 1987-08-31
JPS5350673A (en) 1978-05-09
FR2368073A1 (fr) 1978-05-12
FR2368073B1 (enExample) 1983-10-28
DE2746814A1 (de) 1978-04-20

Similar Documents

Publication Publication Date Title
DE69418837T2 (de) Drahtverbindungseinrichtung
DE3850840T2 (de) Vorrichtung und Verfahren zur Fehlerinspektion in befestigten Bauteilen, unter Verwendung eines Lichtschlitzes.
DE69206928T2 (de) Apparat zum Bestimmen der Schweissnahtgüte
DE68925901T2 (de) Substrat-prüfungsvorrichtung
DE2620599C2 (de) Verfahren zum Betrieb einer Chip-Bond-Vorrichtung
DE69723799T2 (de) Vorrichtung zur Bildaufnahme und Bildverarbeitung
DE69632228T2 (de) Bildsensor mit einem Trägergehäuse
DE69422351T2 (de) Teilchenanalyse von gekerbten Scheiben
CH643959A5 (de) Verfahren und vorrichtung zur automatischen lageerkennung von halbleiterchips.
DE2643810C2 (de) Verfahren zum Einjustieren
EP3507035B1 (de) Biegemaschine mit einer arbeitsbereich-bilderfassungsvorrichtung und verfahren zur darstellung eines arbeitsbereichs
DE102008045716A1 (de) Höhenpositionsdetektor für ein auf einem Einspanntisch gehaltenes Werkstück
DE4222804A1 (de) Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
DE112007001964T5 (de) Verfahren zur Bestätigung von dreidimensionalen Modelldaten und Vorrichtung zur Bestätigung von dreidimensionalen Modelldaten
DE2643809B2 (de) Verfahren zum Einjustieren eines Körpers
DE2951943C2 (de) Verfahren zum Erzielen der Ausrichtung zwischen Gegenständen
DE102008046386A1 (de) Höhenpositionsdetektor für ein auf einem Einspanntisch gehaltenes Werkstück
DE102016107709A1 (de) Laserbearbeitungsvorrichtung
DE10296416T5 (de) Verfahren und Vorrichtung zur Registrierungssteuerung in der Produktion durch Belichten
DE1941057A1 (de) Einrichtung zur Lageeinstellung eines Gegenstandes relativ zu einem Bezugspunkt
DE3342491A1 (de) Automatische vorrichtung zum herstellen oder pruefen von geraeten
DE68927532T2 (de) Gerät zur Inspektion von gedruckten Schaltungen mit Bauteilen, die auf der Oberfläche montiert sind.
DE2746814C2 (enExample)
DE68919268T2 (de) Leiterplatte und Verfahren zum Erkennen der Position von oberflächenmontierten Bauteilen.
DE69318872T2 (de) Verfahren und Vorrichtung zur Kontrolle eines lötfreien Verbinders durch Bildbearbeitung

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: PRINZ, E., DIPL.-ING. LEISER, G., DIPL.-ING., PAT.

D2 Grant after examination
8364 No opposition during term of opposition