GB1592368A - Automated manipulative operation system - Google Patents

Automated manipulative operation system Download PDF

Info

Publication number
GB1592368A
GB1592368A GB41618/77A GB4161877A GB1592368A GB 1592368 A GB1592368 A GB 1592368A GB 41618/77 A GB41618/77 A GB 41618/77A GB 4161877 A GB4161877 A GB 4161877A GB 1592368 A GB1592368 A GB 1592368A
Authority
GB
United Kingdom
Prior art keywords
signals
workpiece
digital
chip
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB41618/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB1592368A publication Critical patent/GB1592368A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/408—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by data handling or data format, e.g. reading, buffering or conversion of data
    • G05B19/4083—Adapting program, configuration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37572—Camera, tv, vision
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Analysis (AREA)
  • Control Of Position Or Direction (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB41618/77A 1976-10-18 1977-10-06 Automated manipulative operation system Expired GB1592368A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73350176A 1976-10-18 1976-10-18

Publications (1)

Publication Number Publication Date
GB1592368A true GB1592368A (en) 1981-07-08

Family

ID=24947871

Family Applications (1)

Application Number Title Priority Date Filing Date
GB41618/77A Expired GB1592368A (en) 1976-10-18 1977-10-06 Automated manipulative operation system

Country Status (4)

Country Link
JP (1) JPS5350673A (enExample)
DE (1) DE2746814A1 (enExample)
FR (1) FR2368073A1 (enExample)
GB (1) GB1592368A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
GB2151350A (en) * 1983-11-25 1985-07-17 Vs Eng Ltd Sensing arrangement
CN115437327B (zh) * 2022-09-15 2024-10-11 中国核动力研究设计院 一种智能化核安全级dcs设计与验证方法、系统及存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633011A (en) * 1968-08-29 1972-01-04 Ibm Method and apparatus for precisely contouring a workpiece imprecisely positioned on a supporting fixture
US3641660A (en) * 1969-06-30 1972-02-15 Texas Instruments Inc The method of ball bonding with an automatic semiconductor bonding machine
US3746447A (en) * 1971-07-07 1973-07-17 California Computer Products Marker enlarger
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US4017721A (en) * 1974-05-16 1977-04-12 The Bendix Corporation Method and apparatus for determining the position of a body
US3986007A (en) * 1975-08-20 1976-10-12 The Bendix Corporation Method and apparatus for calibrating mechanical-visual part manipulating system

Also Published As

Publication number Publication date
DE2746814A1 (de) 1978-04-20
DE2746814C2 (enExample) 1987-08-20
FR2368073A1 (fr) 1978-05-12
JPS5350673A (en) 1978-05-09
FR2368073B1 (enExample) 1983-10-28
JPS6240852B2 (enExample) 1987-08-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19971005