DE2722782C2 - Verfahren zum multiplen Läpptrennen von Feststoffen - Google Patents
Verfahren zum multiplen Läpptrennen von FeststoffenInfo
- Publication number
- DE2722782C2 DE2722782C2 DE2722782A DE2722782A DE2722782C2 DE 2722782 C2 DE2722782 C2 DE 2722782C2 DE 2722782 A DE2722782 A DE 2722782A DE 2722782 A DE2722782 A DE 2722782A DE 2722782 C2 DE2722782 C2 DE 2722782C2
- Authority
- DE
- Germany
- Prior art keywords
- blades
- blade
- metal
- welding temperature
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000007787 solid Substances 0.000 title claims description 8
- 238000000926 separation method Methods 0.000 title claims description 3
- 239000002002 slurry Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract 4
- 238000003466 welding Methods 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 abstract 2
- 239000002131 composite material Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 230000007704 transition Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000002480 mineral oil Substances 0.000 description 5
- 235000010446 mineral oil Nutrition 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000010979 ruby Substances 0.000 description 2
- 229910001750 ruby Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2722782A DE2722782C2 (de) | 1977-05-20 | 1977-05-20 | Verfahren zum multiplen Läpptrennen von Feststoffen |
| NL7804612A NL7804612A (nl) | 1977-05-20 | 1978-04-28 | Werkwijze voor het meervoudig scheiden van vaste stof- fen door middel van leppen. |
| US05/902,514 US4187827A (en) | 1977-05-20 | 1978-05-03 | Process for multiple lap cutting of solid materials |
| GB19262/78A GB1597927A (en) | 1977-05-20 | 1978-05-12 | Process for the multiple lap cutting of solid materials |
| IT49430/78A IT1103284B (it) | 1977-05-20 | 1978-05-18 | Procedimento per il taglio multiplo a lappatura di materiali solidi |
| BE187800A BE867202A (fr) | 1977-05-20 | 1978-05-18 | Procede de tronconnage multiple de substances solides par rodage |
| FR7814874A FR2391052A1 (fr) | 1977-05-20 | 1978-05-19 | Procede de tronconnage multiple de substances solides par rodage |
| DK222878A DK222878A (da) | 1977-05-20 | 1978-05-19 | Fremgangsmaade til mangedobbelt lapadskillelse af faste stoffer |
| JP5899378A JPS53145178A (en) | 1977-05-20 | 1978-05-19 | Method of scaling off compound lap of solid substance |
| CH551178A CH629997A5 (en) | 1977-05-20 | 1978-05-22 | Multiple lapping cut-off method for solid substances |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2722782A DE2722782C2 (de) | 1977-05-20 | 1977-05-20 | Verfahren zum multiplen Läpptrennen von Feststoffen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2722782A1 DE2722782A1 (de) | 1978-11-30 |
| DE2722782C2 true DE2722782C2 (de) | 1985-02-14 |
Family
ID=6009445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2722782A Expired DE2722782C2 (de) | 1977-05-20 | 1977-05-20 | Verfahren zum multiplen Läpptrennen von Feststoffen |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4187827A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS53145178A (cg-RX-API-DMAC7.html) |
| BE (1) | BE867202A (cg-RX-API-DMAC7.html) |
| DE (1) | DE2722782C2 (cg-RX-API-DMAC7.html) |
| DK (1) | DK222878A (cg-RX-API-DMAC7.html) |
| FR (1) | FR2391052A1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1597927A (cg-RX-API-DMAC7.html) |
| IT (1) | IT1103284B (cg-RX-API-DMAC7.html) |
| NL (1) | NL7804612A (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4646710A (en) * | 1982-09-22 | 1987-03-03 | Crystal Systems, Inc. | Multi-wafer slicing with a fixed abrasive |
| US4727852A (en) * | 1983-05-05 | 1988-03-01 | Crystal Systems Inc. | Multi-wafer slicing with a fixed abrasive |
| JP2891187B2 (ja) * | 1995-06-22 | 1999-05-17 | 信越半導体株式会社 | ワイヤーソー装置及び切断方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH133412A (fr) * | 1928-04-16 | 1929-06-15 | Magnenat Palmyr | Appareil à scies multiples pour le sciage des pierres fines. |
| US2830573A (en) * | 1954-12-14 | 1958-04-15 | Wallin Sven | Method and device for sawing of stone blocks |
| US3032026A (en) * | 1959-07-18 | 1962-05-01 | Bosch Gmbh Robert | Device for slicing semiconductor crystals and the like |
| US3079908A (en) * | 1960-11-22 | 1963-03-05 | Norton Co | Multiple blade power hacksaw |
| US3889699A (en) * | 1970-10-12 | 1975-06-17 | Louis F Ranieri | Self-contained multi-blade package and assembly utilizing same |
| FR2234753A5 (cg-RX-API-DMAC7.html) * | 1973-06-25 | 1975-01-17 | Labo Electronique Physique | |
| JPS5334024B2 (cg-RX-API-DMAC7.html) * | 1974-03-13 | 1978-09-18 | ||
| DE2537088C3 (de) * | 1975-08-20 | 1979-02-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anordnung zum Zerteilen von hartsprödem Material, insbesondere Halbleitermaterial |
-
1977
- 1977-05-20 DE DE2722782A patent/DE2722782C2/de not_active Expired
-
1978
- 1978-04-28 NL NL7804612A patent/NL7804612A/xx not_active Application Discontinuation
- 1978-05-03 US US05/902,514 patent/US4187827A/en not_active Expired - Lifetime
- 1978-05-12 GB GB19262/78A patent/GB1597927A/en not_active Expired
- 1978-05-18 BE BE187800A patent/BE867202A/xx not_active IP Right Cessation
- 1978-05-18 IT IT49430/78A patent/IT1103284B/it active
- 1978-05-19 JP JP5899378A patent/JPS53145178A/ja active Pending
- 1978-05-19 FR FR7814874A patent/FR2391052A1/fr active Granted
- 1978-05-19 DK DK222878A patent/DK222878A/da not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE2722782A1 (de) | 1978-11-30 |
| JPS53145178A (en) | 1978-12-18 |
| IT1103284B (it) | 1985-10-14 |
| BE867202A (fr) | 1978-11-20 |
| FR2391052A1 (fr) | 1978-12-15 |
| DK222878A (da) | 1978-11-21 |
| NL7804612A (nl) | 1978-11-22 |
| IT7849430A0 (it) | 1978-05-18 |
| GB1597927A (en) | 1981-09-16 |
| US4187827A (en) | 1980-02-12 |
| FR2391052B1 (cg-RX-API-DMAC7.html) | 1982-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102014208187A1 (de) | Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben mit besonders gleichmäßiger Dicke von einem Werkstück | |
| DE19959414A1 (de) | Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück | |
| DE102012201938A1 (de) | Vorrichtung und Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück | |
| DE102012209974B4 (de) | Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück | |
| DE112005003549B4 (de) | Verfahren zur Herstellung von Siliziumblöcken und Siliziumwafern | |
| DE60307588T2 (de) | Drahtsägevorrichtung | |
| DE102006032432B3 (de) | Sägeleiste sowie Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück unter Verwendung der Sägeleiste | |
| EP0433956A1 (de) | Drahtsäge zum Abtrennen von Scheiben von stab- oder blockförmigen Werkstücken und ihre Verwendung | |
| DE2722782C2 (de) | Verfahren zum multiplen Läpptrennen von Feststoffen | |
| DE2722780C2 (cg-RX-API-DMAC7.html) | ||
| DE3688551T2 (de) | Halterungsbalken fuer die vorbehandlung von wafern. | |
| EP0293941B1 (de) | Verfahren zum Schärfen von Trennwerkzeugen für das Abtrennen von Scheiben von stab- oder blockförmigen Werkstücken und Trennverfahren | |
| DE102010007459B4 (de) | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial | |
| EP0432637B1 (de) | Vorrichtung zum Nachschärfen der Schneidkante von Trennwerkzeugen beim Abtrennen von Scheiben von stab- oder blockförmigen Werkstücken, insbesondere aus Halbleitermaterial, ihre Verwendung und Sägeverfahren | |
| US2896605A (en) | Tools | |
| EP0232920A2 (de) | Mehrblattinnenlochsäge für das Zersägen von Kristallstäben sowie vermittels dieser Säge durchgeführte Trennverfahren | |
| DE3419046A1 (de) | Verfahren und vorrichtung zum multiplen laepptrennen von feststoffen | |
| DE3724913C2 (cg-RX-API-DMAC7.html) | ||
| DE1207636B (de) | Verfahren zum Herstellen von Scheiben aus einkristallinem Silizium und/oder Germanium fuer Halbleiterbauelemente | |
| DE2722779C2 (de) | Läpptrennklingen | |
| CH629997A5 (en) | Multiple lapping cut-off method for solid substances | |
| DE10064066A1 (de) | Verfahren und Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück | |
| DE2739257A1 (de) | Vorrichtung und verfahren zum abtragenden bearbeiten von werkstuecken | |
| DE102018221900A1 (de) | Verfahren zur Herstellung von Halbleiterscheiben von einem zylinderförmigen Werkstück durch Bearbeiten des Werkstücks mittels einer Drahtsäge | |
| DE102011018359A1 (de) | Verfahren zum Drahtsägen im Pendelmodus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OD | Request for examination | ||
| AF | Is addition to no. |
Ref country code: DE Ref document number: 2722779 Format of ref document f/p: P |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| AF | Is addition to no. |
Ref country code: DE Ref document number: 2722779 Format of ref document f/p: P |
|
| 8339 | Ceased/non-payment of the annual fee |