DE3688551T2 - Halterungsbalken fuer die vorbehandlung von wafern. - Google Patents

Halterungsbalken fuer die vorbehandlung von wafern.

Info

Publication number
DE3688551T2
DE3688551T2 DE86116076T DE3688551T DE3688551T2 DE 3688551 T2 DE3688551 T2 DE 3688551T2 DE 86116076 T DE86116076 T DE 86116076T DE 3688551 T DE3688551 T DE 3688551T DE 3688551 T2 DE3688551 T2 DE 3688551T2
Authority
DE
Germany
Prior art keywords
wafers
bracket
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE86116076T
Other languages
English (en)
Other versions
DE3688551D1 (de
Inventor
Richard T Girard
John R Mclaughlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PQ Corp
Original Assignee
PQ Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PQ Corp filed Critical PQ Corp
Application granted granted Critical
Publication of DE3688551D1 publication Critical patent/DE3688551D1/de
Publication of DE3688551T2 publication Critical patent/DE3688551T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE86116076T 1985-11-21 1986-11-20 Halterungsbalken fuer die vorbehandlung von wafern. Expired - Fee Related DE3688551T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/800,189 US4667650A (en) 1985-11-21 1985-11-21 Mounting beam for preparing wafers

Publications (2)

Publication Number Publication Date
DE3688551D1 DE3688551D1 (de) 1993-07-15
DE3688551T2 true DE3688551T2 (de) 1993-11-04

Family

ID=25177707

Family Applications (1)

Application Number Title Priority Date Filing Date
DE86116076T Expired - Fee Related DE3688551T2 (de) 1985-11-21 1986-11-20 Halterungsbalken fuer die vorbehandlung von wafern.

Country Status (5)

Country Link
US (1) US4667650A (de)
EP (1) EP0223249B1 (de)
JP (1) JPS62124872A (de)
CA (1) CA1263812A (de)
DE (1) DE3688551T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819387A (en) * 1987-12-16 1989-04-11 Motorola, Inc. Method of slicing semiconductor crystal
US5024207A (en) * 1989-10-30 1991-06-18 Motorola, Inc. Heating apparatus and method for semiconductor material slicing process
GB2258235B (en) * 1991-07-30 1995-10-11 Filon Products Ltd Improvements in or relating to fibre-reinforced plastics compositions
US5234590A (en) * 1992-03-25 1993-08-10 E. I. Du Pont De Nemours And Company High strength and light tubesheets for hollow fiber membrane permeators
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
JPH11188626A (ja) * 1997-12-26 1999-07-13 Narumi China Corp セラミックスドレス基板
US6106365A (en) * 1998-11-06 2000-08-22 Seh America, Inc. Method and apparatus to control mounting pressure of semiconductor crystals
ATE384500T1 (de) * 2001-02-04 2008-02-15 Warsaw Orthopedic Inc Instrumentarium zum einführen und positionieren eines expandierbaren zwischenwirbel- fusionsimplantates
JP4852892B2 (ja) * 2005-05-31 2012-01-11 三菱マテリアル株式会社 ツルーイング工具および研削砥石のツルーイング方法
JP2011512036A (ja) * 2008-02-11 2011-04-14 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド インゴットをワイヤーソーによりスライスしてウェハとする際に使用される、カーボンナノチューブで強化されたワイヤーソー梁部
JP5123795B2 (ja) * 2008-09-09 2013-01-23 太陽インダストリー株式会社 インゴットスライス台用組成物及びそれを用いたインゴットスライス台

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2806772A (en) * 1954-09-15 1957-09-17 Electro Refractories & Abrasiv Abrasive bodies
NL213347A (de) * 1955-12-30
GB896910A (en) * 1958-02-21 1962-05-23 Carborundum Co Bonded abrasive articles
US3615972A (en) * 1967-04-28 1971-10-26 Dow Chemical Co Expansible thermoplastic polymer particles containing volatile fluid foaming agent and method of foaming the same
DE2359096C3 (de) * 1973-11-27 1982-01-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Sägen von Halbleiterscheiben geringer Durchbiegung
DE2700037A1 (de) * 1977-01-03 1978-07-06 Richard Hahn Diamantwerkzeuge Saegeblatt
US4138304A (en) * 1977-11-03 1979-02-06 General Electric Company Wafer sawing technique
FR2469259A1 (fr) * 1979-08-08 1981-05-22 Radiotechnique Compelec Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede
GB2102445A (en) * 1981-06-20 1983-02-02 Abrafract Manufacturing Limite Abrasive material and method of making it
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
US4543106A (en) * 1984-06-25 1985-09-24 Carborundum Abrasives Company Coated abrasive product containing hollow microspheres beneath the abrasive grain
JPS62743A (ja) * 1985-06-25 1987-01-06 Mitsubishi Electric Corp 加湿器

Also Published As

Publication number Publication date
EP0223249A2 (de) 1987-05-27
DE3688551D1 (de) 1993-07-15
US4667650A (en) 1987-05-26
JPS62124872A (ja) 1987-06-06
EP0223249B1 (de) 1993-06-09
CA1263812A (en) 1989-12-12
EP0223249A3 (en) 1989-08-09

Similar Documents

Publication Publication Date Title
DE3684557D1 (de) Waferintegrierte halbleiteranordnung.
DE3683316D1 (de) Halbleiteranordnung.
NL191241C (nl) Kleefvel voor halfgeleiders.
DE3679108D1 (de) Halbleiteranordnungen.
DE3675937D1 (de) Klebstoffauftragsverfahren.
DE3786070D1 (de) Umhuellte halbleiteranordnung.
DE3667879D1 (de) Halbleiteranordnung.
DE3680774D1 (de) Integriertes halbleiterbauelement.
FI864156A0 (fi) Uppvindningsmaskin foer uppvindning av en laengsdelad bana.
FI865020A (fi) Anordning foer spetsdragning av pappersbana.
IT8620783A0 (it) Dispositivo di avanzamento.
DE3686490D1 (de) Halbleiterstruktur.
DE3688551D1 (de) Halterungsbalken fuer die vorbehandlung von wafern.
NO904629D0 (no) Fremgangsmaate for dimerisering av etylen.
DE3677360D1 (de) Verzweigte copolyaetherketone.
FI864387A (fi) Uppvindningsmaskin foer uppvindning av en laengsdelad bana.
IT8619464A0 (it) Dispositivo di spalmatura.
DE3686944D1 (de) Halbleiteranordnung.
DE3683037D1 (de) Halbleiteranordnung.
DE3680129D1 (de) Beschichtungsverfahren.
FI861982A (fi) Sjoeankare anordnat foer nedsaenkning laengs en lutande bana.
NO864437D0 (no) Baereanordning.
DE3672360D1 (de) Verbindungshalbleiterbauelement.
FI860911A0 (fi) Anordning foer reglering av roekgasernas utloppshastighet i en skorsten.
DE3678326D1 (de) Lichtzuendbarer thyristor.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee