GB1597927A - Process for the multiple lap cutting of solid materials - Google Patents
Process for the multiple lap cutting of solid materials Download PDFInfo
- Publication number
- GB1597927A GB1597927A GB19262/78A GB1926278A GB1597927A GB 1597927 A GB1597927 A GB 1597927A GB 19262/78 A GB19262/78 A GB 19262/78A GB 1926278 A GB1926278 A GB 1926278A GB 1597927 A GB1597927 A GB 1597927A
- Authority
- GB
- United Kingdom
- Prior art keywords
- range
- blades
- cutting
- blade
- lap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 38
- 239000011343 solid material Substances 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims description 24
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000000725 suspension Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 11
- 239000002245 particle Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000010432 diamond Substances 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 239000002480 mineral oil Substances 0.000 description 3
- 235000010446 mineral oil Nutrition 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 2
- 239000010979 ruby Substances 0.000 description 2
- 229910001750 ruby Inorganic materials 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2722782A DE2722782C2 (de) | 1977-05-20 | 1977-05-20 | Verfahren zum multiplen Läpptrennen von Feststoffen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1597927A true GB1597927A (en) | 1981-09-16 |
Family
ID=6009445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB19262/78A Expired GB1597927A (en) | 1977-05-20 | 1978-05-12 | Process for the multiple lap cutting of solid materials |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4187827A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS53145178A (cg-RX-API-DMAC7.html) |
| BE (1) | BE867202A (cg-RX-API-DMAC7.html) |
| DE (1) | DE2722782C2 (cg-RX-API-DMAC7.html) |
| DK (1) | DK222878A (cg-RX-API-DMAC7.html) |
| FR (1) | FR2391052A1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1597927A (cg-RX-API-DMAC7.html) |
| IT (1) | IT1103284B (cg-RX-API-DMAC7.html) |
| NL (1) | NL7804612A (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4646710A (en) * | 1982-09-22 | 1987-03-03 | Crystal Systems, Inc. | Multi-wafer slicing with a fixed abrasive |
| US4727852A (en) * | 1983-05-05 | 1988-03-01 | Crystal Systems Inc. | Multi-wafer slicing with a fixed abrasive |
| JP2891187B2 (ja) * | 1995-06-22 | 1999-05-17 | 信越半導体株式会社 | ワイヤーソー装置及び切断方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH133412A (fr) * | 1928-04-16 | 1929-06-15 | Magnenat Palmyr | Appareil à scies multiples pour le sciage des pierres fines. |
| US2830573A (en) * | 1954-12-14 | 1958-04-15 | Wallin Sven | Method and device for sawing of stone blocks |
| US3032026A (en) * | 1959-07-18 | 1962-05-01 | Bosch Gmbh Robert | Device for slicing semiconductor crystals and the like |
| US3079908A (en) * | 1960-11-22 | 1963-03-05 | Norton Co | Multiple blade power hacksaw |
| US3889699A (en) * | 1970-10-12 | 1975-06-17 | Louis F Ranieri | Self-contained multi-blade package and assembly utilizing same |
| FR2234753A5 (cg-RX-API-DMAC7.html) * | 1973-06-25 | 1975-01-17 | Labo Electronique Physique | |
| JPS5334024B2 (cg-RX-API-DMAC7.html) * | 1974-03-13 | 1978-09-18 | ||
| DE2537088C3 (de) * | 1975-08-20 | 1979-02-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Anordnung zum Zerteilen von hartsprödem Material, insbesondere Halbleitermaterial |
-
1977
- 1977-05-20 DE DE2722782A patent/DE2722782C2/de not_active Expired
-
1978
- 1978-04-28 NL NL7804612A patent/NL7804612A/xx not_active Application Discontinuation
- 1978-05-03 US US05/902,514 patent/US4187827A/en not_active Expired - Lifetime
- 1978-05-12 GB GB19262/78A patent/GB1597927A/en not_active Expired
- 1978-05-18 BE BE187800A patent/BE867202A/xx not_active IP Right Cessation
- 1978-05-18 IT IT49430/78A patent/IT1103284B/it active
- 1978-05-19 JP JP5899378A patent/JPS53145178A/ja active Pending
- 1978-05-19 FR FR7814874A patent/FR2391052A1/fr active Granted
- 1978-05-19 DK DK222878A patent/DK222878A/da not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE2722782A1 (de) | 1978-11-30 |
| JPS53145178A (en) | 1978-12-18 |
| DE2722782C2 (de) | 1985-02-14 |
| IT1103284B (it) | 1985-10-14 |
| BE867202A (fr) | 1978-11-20 |
| FR2391052A1 (fr) | 1978-12-15 |
| DK222878A (da) | 1978-11-21 |
| NL7804612A (nl) | 1978-11-22 |
| IT7849430A0 (it) | 1978-05-18 |
| US4187827A (en) | 1980-02-12 |
| FR2391052B1 (cg-RX-API-DMAC7.html) | 1982-07-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |