JPS53145178A - Method of scaling off compound lap of solid substance - Google Patents

Method of scaling off compound lap of solid substance

Info

Publication number
JPS53145178A
JPS53145178A JP5899378A JP5899378A JPS53145178A JP S53145178 A JPS53145178 A JP S53145178A JP 5899378 A JP5899378 A JP 5899378A JP 5899378 A JP5899378 A JP 5899378A JP S53145178 A JPS53145178 A JP S53145178A
Authority
JP
Japan
Prior art keywords
scaling
solid substance
lap
compound
compound lap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5899378A
Other languages
English (en)
Japanese (ja)
Inventor
Reguraa Deiitaa
Jirutoru Eaharuto
Moritsutsu Arufureeto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of JPS53145178A publication Critical patent/JPS53145178A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP5899378A 1977-05-20 1978-05-19 Method of scaling off compound lap of solid substance Pending JPS53145178A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2722782A DE2722782C2 (de) 1977-05-20 1977-05-20 Verfahren zum multiplen Läpptrennen von Feststoffen

Publications (1)

Publication Number Publication Date
JPS53145178A true JPS53145178A (en) 1978-12-18

Family

ID=6009445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5899378A Pending JPS53145178A (en) 1977-05-20 1978-05-19 Method of scaling off compound lap of solid substance

Country Status (9)

Country Link
US (1) US4187827A (cg-RX-API-DMAC7.html)
JP (1) JPS53145178A (cg-RX-API-DMAC7.html)
BE (1) BE867202A (cg-RX-API-DMAC7.html)
DE (1) DE2722782C2 (cg-RX-API-DMAC7.html)
DK (1) DK222878A (cg-RX-API-DMAC7.html)
FR (1) FR2391052A1 (cg-RX-API-DMAC7.html)
GB (1) GB1597927A (cg-RX-API-DMAC7.html)
IT (1) IT1103284B (cg-RX-API-DMAC7.html)
NL (1) NL7804612A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646710A (en) * 1982-09-22 1987-03-03 Crystal Systems, Inc. Multi-wafer slicing with a fixed abrasive
US4727852A (en) * 1983-05-05 1988-03-01 Crystal Systems Inc. Multi-wafer slicing with a fixed abrasive
JP2891187B2 (ja) * 1995-06-22 1999-05-17 信越半導体株式会社 ワイヤーソー装置及び切断方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50121879A (cg-RX-API-DMAC7.html) * 1974-03-13 1975-09-25

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH133412A (fr) * 1928-04-16 1929-06-15 Magnenat Palmyr Appareil à scies multiples pour le sciage des pierres fines.
US2830573A (en) * 1954-12-14 1958-04-15 Wallin Sven Method and device for sawing of stone blocks
US3032026A (en) * 1959-07-18 1962-05-01 Bosch Gmbh Robert Device for slicing semiconductor crystals and the like
US3079908A (en) * 1960-11-22 1963-03-05 Norton Co Multiple blade power hacksaw
US3889699A (en) * 1970-10-12 1975-06-17 Louis F Ranieri Self-contained multi-blade package and assembly utilizing same
FR2234753A5 (cg-RX-API-DMAC7.html) * 1973-06-25 1975-01-17 Labo Electronique Physique
DE2537088C3 (de) * 1975-08-20 1979-02-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zum Zerteilen von hartsprödem Material, insbesondere Halbleitermaterial

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50121879A (cg-RX-API-DMAC7.html) * 1974-03-13 1975-09-25

Also Published As

Publication number Publication date
DE2722782A1 (de) 1978-11-30
DE2722782C2 (de) 1985-02-14
IT1103284B (it) 1985-10-14
BE867202A (fr) 1978-11-20
FR2391052A1 (fr) 1978-12-15
DK222878A (da) 1978-11-21
NL7804612A (nl) 1978-11-22
IT7849430A0 (it) 1978-05-18
GB1597927A (en) 1981-09-16
US4187827A (en) 1980-02-12
FR2391052B1 (cg-RX-API-DMAC7.html) 1982-07-23

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