IT1103284B - Procedimento per il taglio multiplo a lappatura di materiali solidi - Google Patents

Procedimento per il taglio multiplo a lappatura di materiali solidi

Info

Publication number
IT1103284B
IT1103284B IT49430/78A IT4943078A IT1103284B IT 1103284 B IT1103284 B IT 1103284B IT 49430/78 A IT49430/78 A IT 49430/78A IT 4943078 A IT4943078 A IT 4943078A IT 1103284 B IT1103284 B IT 1103284B
Authority
IT
Italy
Prior art keywords
lapping
procedure
solid materials
multiple cutting
cutting
Prior art date
Application number
IT49430/78A
Other languages
English (en)
Italian (it)
Other versions
IT7849430A0 (it
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of IT7849430A0 publication Critical patent/IT7849430A0/it
Application granted granted Critical
Publication of IT1103284B publication Critical patent/IT1103284B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IT49430/78A 1977-05-20 1978-05-18 Procedimento per il taglio multiplo a lappatura di materiali solidi IT1103284B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2722782A DE2722782C2 (de) 1977-05-20 1977-05-20 Verfahren zum multiplen Läpptrennen von Feststoffen

Publications (2)

Publication Number Publication Date
IT7849430A0 IT7849430A0 (it) 1978-05-18
IT1103284B true IT1103284B (it) 1985-10-14

Family

ID=6009445

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49430/78A IT1103284B (it) 1977-05-20 1978-05-18 Procedimento per il taglio multiplo a lappatura di materiali solidi

Country Status (9)

Country Link
US (1) US4187827A (cg-RX-API-DMAC7.html)
JP (1) JPS53145178A (cg-RX-API-DMAC7.html)
BE (1) BE867202A (cg-RX-API-DMAC7.html)
DE (1) DE2722782C2 (cg-RX-API-DMAC7.html)
DK (1) DK222878A (cg-RX-API-DMAC7.html)
FR (1) FR2391052A1 (cg-RX-API-DMAC7.html)
GB (1) GB1597927A (cg-RX-API-DMAC7.html)
IT (1) IT1103284B (cg-RX-API-DMAC7.html)
NL (1) NL7804612A (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646710A (en) * 1982-09-22 1987-03-03 Crystal Systems, Inc. Multi-wafer slicing with a fixed abrasive
US4727852A (en) * 1983-05-05 1988-03-01 Crystal Systems Inc. Multi-wafer slicing with a fixed abrasive
JP2891187B2 (ja) * 1995-06-22 1999-05-17 信越半導体株式会社 ワイヤーソー装置及び切断方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH133412A (fr) * 1928-04-16 1929-06-15 Magnenat Palmyr Appareil à scies multiples pour le sciage des pierres fines.
US2830573A (en) * 1954-12-14 1958-04-15 Wallin Sven Method and device for sawing of stone blocks
US3032026A (en) * 1959-07-18 1962-05-01 Bosch Gmbh Robert Device for slicing semiconductor crystals and the like
US3079908A (en) * 1960-11-22 1963-03-05 Norton Co Multiple blade power hacksaw
US3889699A (en) * 1970-10-12 1975-06-17 Louis F Ranieri Self-contained multi-blade package and assembly utilizing same
FR2234753A5 (cg-RX-API-DMAC7.html) * 1973-06-25 1975-01-17 Labo Electronique Physique
JPS5334024B2 (cg-RX-API-DMAC7.html) * 1974-03-13 1978-09-18
DE2537088C3 (de) * 1975-08-20 1979-02-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zum Zerteilen von hartsprödem Material, insbesondere Halbleitermaterial

Also Published As

Publication number Publication date
DE2722782A1 (de) 1978-11-30
JPS53145178A (en) 1978-12-18
DE2722782C2 (de) 1985-02-14
BE867202A (fr) 1978-11-20
FR2391052A1 (fr) 1978-12-15
DK222878A (da) 1978-11-21
NL7804612A (nl) 1978-11-22
IT7849430A0 (it) 1978-05-18
GB1597927A (en) 1981-09-16
US4187827A (en) 1980-02-12
FR2391052B1 (cg-RX-API-DMAC7.html) 1982-07-23

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