DE2620600C2 - Positionierungsvorrichtung zur Positionierung eines Werkstücks relativ zu einem Bondkopf - Google Patents

Positionierungsvorrichtung zur Positionierung eines Werkstücks relativ zu einem Bondkopf

Info

Publication number
DE2620600C2
DE2620600C2 DE2620600A DE2620600A DE2620600C2 DE 2620600 C2 DE2620600 C2 DE 2620600C2 DE 2620600 A DE2620600 A DE 2620600A DE 2620600 A DE2620600 A DE 2620600A DE 2620600 C2 DE2620600 C2 DE 2620600C2
Authority
DE
Germany
Prior art keywords
workpiece
conductor pattern
bondhead
positioning
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2620600A
Other languages
German (de)
English (en)
Other versions
DE2620600A1 (de
Inventor
Hideya Yokohama Kanagawa Nishioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE2620600A1 publication Critical patent/DE2620600A1/de
Application granted granted Critical
Publication of DE2620600C2 publication Critical patent/DE2620600C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
DE2620600A 1975-05-10 1976-05-10 Positionierungsvorrichtung zur Positionierung eines Werkstücks relativ zu einem Bondkopf Expired DE2620600C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50056620A JPS51131273A (en) 1975-05-10 1975-05-10 Wire bonding process

Publications (2)

Publication Number Publication Date
DE2620600A1 DE2620600A1 (de) 1976-11-25
DE2620600C2 true DE2620600C2 (de) 1983-10-20

Family

ID=13032311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2620600A Expired DE2620600C2 (de) 1975-05-10 1976-05-10 Positionierungsvorrichtung zur Positionierung eines Werkstücks relativ zu einem Bondkopf

Country Status (7)

Country Link
US (1) US4054824A (OSRAM)
JP (1) JPS51131273A (OSRAM)
DE (1) DE2620600C2 (OSRAM)
FR (1) FR2311350A1 (OSRAM)
GB (1) GB1556172A (OSRAM)
IT (1) IT1063009B (OSRAM)
NL (1) NL173800C (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3712064A1 (de) * 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350428U (OSRAM) * 1976-10-01 1978-04-28
US4255056A (en) * 1979-03-30 1981-03-10 Hardinge Brothers, Inc. Pre-setter for positioning tooling on turrets
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
US4544889A (en) * 1983-09-12 1985-10-01 International Business Machines Corporation Robot precision probe positioner with guidance optics
US4627151A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Automatic assembly of integrated circuits
US11880178B1 (en) 2010-11-16 2024-01-23 Ectoscan Systems, Llc Surface data, acquisition, storage, and assessment system
US9599461B2 (en) * 2010-11-16 2017-03-21 Ectoscan Systems, Llc Surface data acquisition, storage, and assessment system
US11544852B2 (en) 2017-12-06 2023-01-03 Ectoscan Systems, Llc Performance scanning system and method for improving athletic performance
WO2025029902A1 (en) 2023-07-31 2025-02-06 L'oreal Cosmetic securement device with universal cosmetic holder for stabilization of cosmetic applicator configured for users with limited mobility

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3038369A (en) * 1958-12-22 1962-06-12 Bell Telephone Labor Inc Positioning a transistor by use of the optical reflectance characteristics of the electrode stripes
GB1312663A (en) * 1970-05-28 1973-04-04 Ti Group Services Ltd Optical control means
US3955072A (en) * 1971-03-22 1976-05-04 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask
GB1366369A (en) * 1971-11-30 1974-09-11 Ferranti Ltd Detection of faults on surfaces
US3731098A (en) * 1972-03-06 1973-05-01 Spectrotherm Corp Image scanner drive system
US3805073A (en) * 1973-08-22 1974-04-16 Western Electric Co Method and apparatus for obtaining a stereoscopic thermal image of internal and surface portions of an article
DE2352113B2 (de) * 1973-10-17 1975-08-14 Eggert 8035 Gauting Herrmann Maschine zum automatischen Befestigen von Verbindungsdrähten an den Anschlußstellen eines Halbleiterkristalls

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3712064A1 (de) * 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung

Also Published As

Publication number Publication date
NL173800B (nl) 1983-10-03
NL7604900A (nl) 1976-11-12
JPS51131273A (en) 1976-11-15
NL173800C (nl) 1984-03-01
DE2620600A1 (de) 1976-11-25
FR2311350B1 (OSRAM) 1980-06-06
FR2311350A1 (fr) 1976-12-10
GB1556172A (en) 1979-11-21
JPS5423795B2 (OSRAM) 1979-08-16
IT1063009B (it) 1985-02-11
US4054824A (en) 1977-10-18

Similar Documents

Publication Publication Date Title
DE2620599C2 (de) Verfahren zum Betrieb einer Chip-Bond-Vorrichtung
DE2361155C2 (de) Vorrichtung zum Positionieren eines ersten Gegenstandes in bezug auf einen zweiten Gegenstand
DE10193737B4 (de) Laserbearbeitungsvorrichtung
DE2725959C3 (de) Elektronenstrahl-Bearbeitungseinrichtung
DE69605512T2 (de) Verfahren zur Positionierung einer Maske bezüglich eines Werkstücks und Projektionsbelichtungsapparat zur Durchführung des Verfahrens
DE2246152A1 (de) Verfahren und vorrichtung zum optischen ausrichten von gegenstaenden
DE2557675A1 (de) Verfahren zur ausrichtung zweier planarer werkstuecke, z.b. einer maske zu einem wafer oder umgekehrt
DE69724331T2 (de) Verfahren zur Herstellung eines Düsenkörpers und Arbeitsgerät
DE2620600C2 (de) Positionierungsvorrichtung zur Positionierung eines Werkstücks relativ zu einem Bondkopf
DE2222665A1 (de) Verfahren und Vorrichtung zum Ausrichten von Elektronenprojektionssystemen
DE69105167T2 (de) Laserbearbeitungsvorrichtung.
DE102015224575A1 (de) Laserbearbeitungsvorrichtung
DE102016218268A1 (de) Laserbearbeitungsvorrichtung
DE112017000543T5 (de) Laserstrahl-bestrahlungsvorrichtung
DE102018217940A1 (de) Verfahren und Bearbeitungsmaschine zum Bearbeiten eines Werkstücks
DE102020215369A1 (de) Laserstrahlanpassungssystem und laserbearbeitungsvorrichtung
DE3441621A1 (de) Ausfluchtvorrichtung
DE112021000658T5 (de) Laserbearbeitungsgerät und Laserbearbeitungsverfahren
DE102020212721A1 (de) Waferbearbeitungsverfahren
DE102020212094A1 (de) Laserbearbeitungsvorrichtung
DE69127479T2 (de) Belichtungssystem
EP0080651B1 (de) Verfahren zum Justieren des Bezugssystems eines im Riesenimpulsbetrieb arbeitenden Lasergerätes
WO1980001721A1 (fr) Procede et agencement pour ajuster la surface image et/ou la surface objet dans des installations de copie optique
DE69018556T2 (de) Belichtungsvorrichtung.
EP0482240A1 (de) Verfahren zur massgenauen Bearbeitung von flachen oder leicht gewölbten Werkstücken

Legal Events

Date Code Title Description
8125 Change of the main classification

Ipc: H01L 21/68

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee