DE2616521A1 - Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes - Google Patents

Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes

Info

Publication number
DE2616521A1
DE2616521A1 DE19762616521 DE2616521A DE2616521A1 DE 2616521 A1 DE2616521 A1 DE 2616521A1 DE 19762616521 DE19762616521 DE 19762616521 DE 2616521 A DE2616521 A DE 2616521A DE 2616521 A1 DE2616521 A1 DE 2616521A1
Authority
DE
Germany
Prior art keywords
wire
guide
tape
soldering
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762616521
Other languages
German (de)
English (en)
Inventor
Klaus Dr Brill
Guenter Schmid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BRILL, KLAUS, DR., 7015 KORNTAL, DE SCHMID, GUENTH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19762616521 priority Critical patent/DE2616521A1/de
Priority to US05/776,737 priority patent/US4099663A/en
Priority to FR7708530A priority patent/FR2348003A1/fr
Priority to JP4128477A priority patent/JPS52126587A/ja
Priority to GB15248/77A priority patent/GB1555614A/en
Publication of DE2616521A1 publication Critical patent/DE2616521A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D23/00—Machines or devices for shearing or cutting profiled stock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Processing (AREA)
DE19762616521 1976-04-14 1976-04-14 Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes Withdrawn DE2616521A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19762616521 DE2616521A1 (de) 1976-04-14 1976-04-14 Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes
US05/776,737 US4099663A (en) 1976-04-14 1977-03-11 Severing wire or ribbon material adjacent an attachment point, such as a solder, bond or weld connection, particularly in semiconductor and thin film structures
FR7708530A FR2348003A1 (fr) 1976-04-14 1977-03-22 Procede et dispositif pour le tronconnage d'un fil ou d'un feuillard
JP4128477A JPS52126587A (en) 1976-04-14 1977-04-11 Cutting method of strand or strip member and apparatus therefor
GB15248/77A GB1555614A (en) 1976-04-14 1977-04-13 Method and device for severing a wire tape or strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762616521 DE2616521A1 (de) 1976-04-14 1976-04-14 Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes

Publications (1)

Publication Number Publication Date
DE2616521A1 true DE2616521A1 (de) 1977-11-03

Family

ID=5975419

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762616521 Withdrawn DE2616521A1 (de) 1976-04-14 1976-04-14 Verfahren und vorrichtung zum abtrennen eines drahtes oder eines bandes

Country Status (5)

Country Link
US (1) US4099663A (enExample)
JP (1) JPS52126587A (enExample)
DE (1) DE2616521A1 (enExample)
FR (1) FR2348003A1 (enExample)
GB (1) GB1555614A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147658A (ja) * 1984-08-14 1986-03-08 Nec Kansai Ltd 半導体装置の製造方法
US4757606A (en) * 1984-09-04 1988-07-19 Mts Vektronics Corporation Method and apparatus for terminal insertion
US4658503A (en) * 1984-09-04 1987-04-21 Mts Vektronics Corporation Method and apparatus for terminal insertion
US4750666A (en) * 1986-04-17 1988-06-14 General Electric Company Method of fabricating gold bumps on IC's and power chips
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
JP3422937B2 (ja) * 1998-07-27 2003-07-07 株式会社新川 ワイヤボンディングにおけるボール形成方法
US6471116B2 (en) * 2001-01-19 2002-10-29 Orthodyne Electronics Corporation Wire bonding spool system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3747198A (en) * 1971-08-19 1973-07-24 Gen Electric Tailless wedge bonding of gold wire to palladium-silver cermets
AR204599A1 (es) * 1975-08-21 1976-02-12 Ims Ltd Novedosa herramienta de mano para la rotura manual o digital de ampolletas de vidrio selladas

Also Published As

Publication number Publication date
GB1555614A (en) 1979-11-14
FR2348003A1 (fr) 1977-11-10
US4099663A (en) 1978-07-11
FR2348003B3 (enExample) 1980-01-11
JPS52126587A (en) 1977-10-24

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Legal Events

Date Code Title Description
8120 Willingness to grant licences paragraph 23
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: BRILL, KLAUS, DR., 7015 KORNTAL, DE SCHMID, GUENTH

8139 Disposal/non-payment of the annual fee