DE2614917A1 - Fuellkoerper - Google Patents

Fuellkoerper

Info

Publication number
DE2614917A1
DE2614917A1 DE19762614917 DE2614917A DE2614917A1 DE 2614917 A1 DE2614917 A1 DE 2614917A1 DE 19762614917 DE19762614917 DE 19762614917 DE 2614917 A DE2614917 A DE 2614917A DE 2614917 A1 DE2614917 A1 DE 2614917A1
Authority
DE
Germany
Prior art keywords
switching elements
packing
heat sink
circuit board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762614917
Other languages
German (de)
English (en)
Inventor
Edward William Neumann
Jun Edward John Rabenda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2614917A1 publication Critical patent/DE2614917A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19762614917 1975-04-10 1976-04-07 Fuellkoerper Withdrawn DE2614917A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/566,853 US4029999A (en) 1975-04-10 1975-04-10 Thermally conducting elastomeric device

Publications (1)

Publication Number Publication Date
DE2614917A1 true DE2614917A1 (de) 1976-10-21

Family

ID=24264665

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762614917 Withdrawn DE2614917A1 (de) 1975-04-10 1976-04-07 Fuellkoerper

Country Status (5)

Country Link
US (1) US4029999A (cg-RX-API-DMAC7.html)
JP (1) JPS51118068A (cg-RX-API-DMAC7.html)
DE (1) DE2614917A1 (cg-RX-API-DMAC7.html)
FR (1) FR2307441A1 (cg-RX-API-DMAC7.html)
GB (1) GB1492285A (cg-RX-API-DMAC7.html)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2800080A1 (de) * 1977-01-03 1978-07-13 Sperry Rand Corp Kuehlplattenanordnung fuer gedruckte schaltungsplatten
DE3003373A1 (de) * 1980-01-31 1981-08-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrische baueinheit mit einer leiterplatte
DE3320575A1 (de) * 1982-06-14 1983-12-15 Mitsubishi Denki K.K., Tokyo Leistungssteuervorrichtung fuer eine schweissmaschine
DE3402538A1 (de) * 1984-01-26 1985-08-01 Robert Bosch Gmbh, 7000 Stuttgart Waermeableitende befestigung
DE4009289A1 (de) * 1990-03-22 1991-09-26 Siemens Ag Elektronisches einschubteil zum einschieben in den rahmen eines schaltschrankes
DE4339786A1 (de) * 1993-11-18 1995-05-24 Emi Tec Elektronische Material Anordnung zur Wärmeableitung und Verfahren zu deren Herstellung
DE102007041419A1 (de) * 2007-08-31 2009-03-12 Sew-Eurodrive Gmbh & Co. Kg Vorrichtung, insbesondere Elektrogerät, und Verfahren
EP2442630A1 (de) * 2010-10-18 2012-04-18 Siemens Aktiengesellschaft Wärmeleitpad
DE102012001917A1 (de) 2011-02-04 2012-08-09 Sew-Eurodrive Gmbh & Co. Kg Elektrisches Gerät
DE102014004798A1 (de) 2014-04-03 2015-10-08 Sew-Eurodrive Gmbh & Co Kg Elektrisches Gerät
DE102005039764B4 (de) * 2005-08-23 2018-10-25 Robert Bosch Gmbh Verfahren zur Herstellung einer thermischen Kopplung
DE102021209640A1 (de) 2021-09-01 2023-03-02 Continental Automotive Technologies GmbH Kühlvorrichtung, Kühlanordnung, Steuereinrichtung sowie Racksystem
US11770914B2 (en) 2020-08-13 2023-09-26 Aptiv Technologies Limited Cooling device and method of manufacturing the same
US11778775B2 (en) 2020-06-12 2023-10-03 Aptiv Technologies Limited Cooling device and method of manufacturing the same
US12069795B2 (en) 2021-09-17 2024-08-20 Aptiv Technologies AG Methods for and apparatuses of a circuit board cooling device
US12082368B2 (en) 2021-01-04 2024-09-03 Aptiv Technologies AG Cooling device and method of manufacturing the same

Families Citing this family (55)

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US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
US4408255A (en) * 1981-01-12 1983-10-04 Harold Adkins Absorptive electromagnetic shielding for high speed computer applications
US4475145A (en) * 1982-07-12 1984-10-02 Rockwell International Corporation Circuit board heatsink assembly and technique
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
US4660124A (en) * 1985-04-22 1987-04-21 Chrysler Motors Corporation Electrical circuit with high thermal dissipation
US4799128A (en) * 1985-12-20 1989-01-17 Ncr Corporation Multilayer printed circuit board with domain partitioning
GB2190795B (en) * 1986-05-09 1990-01-10 Hella Kg Hueck & Co Circuit arrangement
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US4852646A (en) * 1987-06-16 1989-08-01 Raychem Corporation Thermally conductive gel materials
US4902234A (en) * 1988-11-03 1990-02-20 International Business Machines Corporation Electrical connector assembly including pressure exertion member
US4916807A (en) * 1989-01-05 1990-04-17 Wiese Paul H Method and apparatus for assembling circuits having surface mounted components
FR2654890B1 (fr) * 1989-11-17 1996-08-02 Matra Sep Imagerie Inf Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5166862A (en) * 1990-09-28 1992-11-24 Square D Company Panel for mounting electronics
US5059129A (en) * 1991-03-25 1991-10-22 International Business Machines Corporation Connector assembly including bilayered elastomeric member
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5138523A (en) * 1991-10-18 1992-08-11 International Business Machines Corporation Digitizer tablet having cooling apparatus with base and integrated heat sink
WO1993023825A1 (fr) * 1992-05-20 1993-11-25 Seiko Epson Corporation Cartouche destinee a un appareil electronique
US5237486A (en) * 1992-06-05 1993-08-17 Apple Computer, Inc. Structural frame for portable computer
US6403226B1 (en) 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
JP2885736B2 (ja) 1996-11-22 1999-04-26 宮城日本電気株式会社 電子装置の冷却構造
US6128194A (en) * 1997-08-05 2000-10-03 3Com Corporation PC card with electromagnetic and thermal management
US6317324B1 (en) * 2000-02-01 2001-11-13 Shiaw-Jong Steve Chen Encapsulated power supply with a high thermal conductivity molded insert
WO2001073933A1 (en) * 2000-03-27 2001-10-04 Mitsubishi Denki Kabushiki Kaisha Single-phase converter, converter and refrigeration cycle device
US6400565B1 (en) 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
JP4096711B2 (ja) * 2002-11-20 2008-06-04 松下電器産業株式会社 回路基板の製造方法
US7133286B2 (en) * 2004-05-10 2006-11-07 International Business Machines Corporation Method and apparatus for sealing a liquid cooled electronic device
US20070177356A1 (en) * 2006-02-01 2007-08-02 Jeffrey Panek Three-dimensional cold plate and method of manufacturing same
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
US8879263B2 (en) * 2009-08-17 2014-11-04 Seagate Technology Llc Conducting heat away from a printed circuit board assembly in an enclosure
US9125297B2 (en) * 2012-08-16 2015-09-01 Otter Products, Llc Protective enclosure for an electronic device
EP3092541B1 (en) 2014-01-07 2019-07-31 Otter Products, LLC Protective enclosure for an electronic device
US9560789B2 (en) * 2014-06-24 2017-01-31 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US11744041B2 (en) 2014-06-24 2023-08-29 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US11191186B2 (en) 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US9654605B2 (en) 2015-03-04 2017-05-16 Otter Products, Llc Accessory for use with electronic device and cover
US9986805B2 (en) 2015-03-30 2018-06-05 Otter Products, Llc Protective enclosure for an electronic device
US9814289B2 (en) 2015-04-08 2017-11-14 Otter Products, Llc Protective folio case for an electronic device
US10058155B2 (en) 2015-07-19 2018-08-28 Otter Products, Llc Protective case system
US9807211B2 (en) 2015-07-19 2017-10-31 Otter Products, Llc Protective modular case for electronic device
US10485312B2 (en) 2016-08-30 2019-11-26 Otter Products, Llc Protective case system with stand
US10623043B2 (en) 2018-01-23 2020-04-14 Otter Products, Llc Protective case for electronic device
US10750844B2 (en) 2018-03-15 2020-08-25 Otter Products, Llc Protective case for use with device grip
US10694835B2 (en) 2018-03-15 2020-06-30 Otter Products, Llc Protective case for use with device grip
DE102018120118A1 (de) * 2018-08-17 2020-02-20 Carl Freudenberg Kg Vorrichtung
US11068030B2 (en) 2018-12-19 2021-07-20 Otter Products, Llc Stand for use with electronic device
USD897329S1 (en) 2019-07-02 2020-09-29 Otter Products, Llc Case for a smartphone
US11745670B2 (en) 2020-05-06 2023-09-05 Otter Products, Llc Protective case system for use with electronic device
US11633025B2 (en) 2020-06-26 2023-04-25 Otter Products, Llc Carrying case with stand
US11357130B2 (en) * 2020-06-29 2022-06-07 Microsoft Technology Licensing, Llc Scalable thermal ride-through for immersion-cooled server systems
US12433391B2 (en) 2021-03-29 2025-10-07 Otter Products, Llc Collapsible and extendable device grip
US12575654B2 (en) 2022-11-09 2026-03-17 Otter Products, Llc Protective case with grip and stand
US12684054B2 (en) 2023-07-25 2026-07-14 Otter Products, Llc Protective case with attachment interface

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2881364A (en) * 1954-11-12 1959-04-07 Ibm Electrical assembly housing
FR1159309A (fr) * 1956-10-12 1958-06-26 Perfectionnements aux équipements électriques solidifiés
US3087982A (en) * 1959-12-01 1963-04-30 Northrop Corp Vacuum tube mounts
AT303218B (de) * 1968-04-08 1972-11-10 Siemens Ag Baueinheit für Geräte der Fernmeldetechnik
DE1913679B2 (de) * 1969-03-18 1971-03-25 Waermeleitvorrichtung fuer elektrische baugruppen
US3579821A (en) * 1969-08-21 1971-05-25 Us Navy Method of making conformal blocks for evaporatively cooling circuit assemblies
US3616533A (en) * 1969-10-28 1971-11-02 North American Rockwell Method of protecting articles in high temperature environment

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2800080A1 (de) * 1977-01-03 1978-07-13 Sperry Rand Corp Kuehlplattenanordnung fuer gedruckte schaltungsplatten
DE3003373A1 (de) * 1980-01-31 1981-08-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrische baueinheit mit einer leiterplatte
DE3320575A1 (de) * 1982-06-14 1983-12-15 Mitsubishi Denki K.K., Tokyo Leistungssteuervorrichtung fuer eine schweissmaschine
DE3402538A1 (de) * 1984-01-26 1985-08-01 Robert Bosch Gmbh, 7000 Stuttgart Waermeableitende befestigung
DE4009289A1 (de) * 1990-03-22 1991-09-26 Siemens Ag Elektronisches einschubteil zum einschieben in den rahmen eines schaltschrankes
DE4339786A1 (de) * 1993-11-18 1995-05-24 Emi Tec Elektronische Material Anordnung zur Wärmeableitung und Verfahren zu deren Herstellung
US5518758A (en) * 1993-11-18 1996-05-21 Emi-Tec Elektronische Materialien Gmbh Arrangement for the conduction away of heat and a process for the production thereof
DE4339786C5 (de) * 1993-11-18 2004-02-05 Emi-Tec Elektronische Materialien Gmbh Verfahren zur Herstellung einer Anordung zur Wärmeableitung
DE102005039764B4 (de) * 2005-08-23 2018-10-25 Robert Bosch Gmbh Verfahren zur Herstellung einer thermischen Kopplung
DE102007041419A1 (de) * 2007-08-31 2009-03-12 Sew-Eurodrive Gmbh & Co. Kg Vorrichtung, insbesondere Elektrogerät, und Verfahren
DE102007041419B4 (de) 2007-08-31 2022-03-31 Sew-Eurodrive Gmbh & Co Kg Anordnung zum Kühlen von elektrischen Bauelementen sowie Umrichter und Kompaktantrieb damit
EP2442630A1 (de) * 2010-10-18 2012-04-18 Siemens Aktiengesellschaft Wärmeleitpad
US9237679B2 (en) 2011-02-04 2016-01-12 Sew-Eurodrive Gmbh & Co. Kg Electrical device
US9930809B2 (en) 2011-02-04 2018-03-27 Sew-Eurodrive Gmbh & Co. Kg Electrical device
DE102012001917A1 (de) 2011-02-04 2012-08-09 Sew-Eurodrive Gmbh & Co. Kg Elektrisches Gerät
DE102012001917B4 (de) 2011-02-04 2026-07-30 Sew-Eurodrive Gmbh & Co Kg Elektrisches Gerät und Verfahren zum Herstellen eines elektrischen Geräts
DE102014004798B4 (de) * 2014-04-03 2017-08-10 Sew-Eurodrive Gmbh & Co Kg Elektrisches Gerät
DE102014004798A1 (de) 2014-04-03 2015-10-08 Sew-Eurodrive Gmbh & Co Kg Elektrisches Gerät
US11778775B2 (en) 2020-06-12 2023-10-03 Aptiv Technologies Limited Cooling device and method of manufacturing the same
US11770914B2 (en) 2020-08-13 2023-09-26 Aptiv Technologies Limited Cooling device and method of manufacturing the same
US12082368B2 (en) 2021-01-04 2024-09-03 Aptiv Technologies AG Cooling device and method of manufacturing the same
DE102021209640A1 (de) 2021-09-01 2023-03-02 Continental Automotive Technologies GmbH Kühlvorrichtung, Kühlanordnung, Steuereinrichtung sowie Racksystem
WO2023030588A1 (de) * 2021-09-01 2023-03-09 Continental Automotive Technologies GmbH Kühlvorrichtung, kühlanordnung, steuereinrichtung sowie racksystem
US12069795B2 (en) 2021-09-17 2024-08-20 Aptiv Technologies AG Methods for and apparatuses of a circuit board cooling device

Also Published As

Publication number Publication date
US4029999A (en) 1977-06-14
GB1492285A (en) 1977-11-16
FR2307441B1 (cg-RX-API-DMAC7.html) 1979-08-24
JPS5548478B2 (cg-RX-API-DMAC7.html) 1980-12-05
JPS51118068A (en) 1976-10-16
FR2307441A1 (fr) 1976-11-05

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Legal Events

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8139 Disposal/non-payment of the annual fee