DE2611871A1 - Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung - Google Patents

Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung

Info

Publication number
DE2611871A1
DE2611871A1 DE19762611871 DE2611871A DE2611871A1 DE 2611871 A1 DE2611871 A1 DE 2611871A1 DE 19762611871 DE19762611871 DE 19762611871 DE 2611871 A DE2611871 A DE 2611871A DE 2611871 A1 DE2611871 A1 DE 2611871A1
Authority
DE
Germany
Prior art keywords
conductor
lines
circuit assembly
layer
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19762611871
Other languages
German (de)
English (en)
Inventor
Fred M Chitwood
Paul F Rollins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull HN Information Systems Italia SpA
Original Assignee
Honeywell Information Systems Italia SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Information Systems Italia SpA filed Critical Honeywell Information Systems Italia SpA
Publication of DE2611871A1 publication Critical patent/DE2611871A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE19762611871 1975-03-26 1976-03-20 Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung Pending DE2611871A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56232875A 1975-03-26 1975-03-26

Publications (1)

Publication Number Publication Date
DE2611871A1 true DE2611871A1 (de) 1976-10-07

Family

ID=24245832

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762611871 Pending DE2611871A1 (de) 1975-03-26 1976-03-20 Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung

Country Status (5)

Country Link
JP (1) JPS51120669A (fr)
BE (1) BE840018A (fr)
DE (1) DE2611871A1 (fr)
FR (1) FR2305914A1 (fr)
GB (1) GB1504097A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3810486A1 (de) * 1988-03-28 1989-10-19 Kaleto Ag Verfahren zum herstellen kundenspezifischer elektrischer schaltungen, insbesondere gedruckter schaltungen

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4799128A (en) * 1985-12-20 1989-01-17 Ncr Corporation Multilayer printed circuit board with domain partitioning
FR2640457B1 (fr) * 1988-12-09 1991-01-25 Thomson Csf Dispositif de raccordement de composants et module fonctionnel l'utilisant
US5410107A (en) 1993-03-01 1995-04-25 The Board Of Trustees Of The University Of Arkansas Multichip module
FR3105084B1 (fr) * 2019-12-19 2021-12-31 Saint Gobain Vitrage feuilleté à couche chauffante au même niveau de la structure feuilletée que le masque des amenées de courant électrique de la couche chauffante

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3491197A (en) * 1966-12-30 1970-01-20 Texas Instruments Inc Universal printed circuit board
JPS4876059A (fr) * 1972-01-14 1973-10-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3810486A1 (de) * 1988-03-28 1989-10-19 Kaleto Ag Verfahren zum herstellen kundenspezifischer elektrischer schaltungen, insbesondere gedruckter schaltungen

Also Published As

Publication number Publication date
JPS51120669A (en) 1976-10-22
FR2305914A1 (fr) 1976-10-22
GB1504097A (en) 1978-03-15
FR2305914B1 (fr) 1979-03-23
BE840018A (fr) 1976-07-16

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