DE2511059A1 - Verfahren und vorrichtung zur uebertragung von halbleiterplaettchen von einer traegerscheibe auf ein substrat - Google Patents
Verfahren und vorrichtung zur uebertragung von halbleiterplaettchen von einer traegerscheibe auf ein substratInfo
- Publication number
- DE2511059A1 DE2511059A1 DE19752511059 DE2511059A DE2511059A1 DE 2511059 A1 DE2511059 A1 DE 2511059A1 DE 19752511059 DE19752511059 DE 19752511059 DE 2511059 A DE2511059 A DE 2511059A DE 2511059 A1 DE2511059 A1 DE 2511059A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- sleeve
- negative pressure
- pipeline
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 11
- 235000012431 wafers Nutrition 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 description 14
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000010871 livestock manure Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US450599A US3883945A (en) | 1974-03-13 | 1974-03-13 | Method for transferring and joining beam leaded chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2511059A1 true DE2511059A1 (de) | 1975-09-25 |
Family
ID=23788751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752511059 Withdrawn DE2511059A1 (de) | 1974-03-13 | 1975-03-13 | Verfahren und vorrichtung zur uebertragung von halbleiterplaettchen von einer traegerscheibe auf ein substrat |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3883945A (enExample) |
| JP (1) | JPS50123271A (enExample) |
| CA (1) | CA1020289A (enExample) |
| DE (1) | DE2511059A1 (enExample) |
| FR (1) | FR2264395B3 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727144Y2 (enExample) * | 1976-09-10 | 1982-06-14 | ||
| DE3319339A1 (de) * | 1982-05-31 | 1983-12-29 | Sharp K.K., Osaka | Treiberanordnung fuer eine x-y-elektrodenmatrix |
| US4828162A (en) * | 1988-02-29 | 1989-05-09 | Hughes Aircraft Company | Moving jaw reflow soldering head |
| US4835847A (en) * | 1988-04-20 | 1989-06-06 | International Business Machines Corp. | Method and apparatus for mounting a flexible film electronic device carrier on a substrate |
| US5113581A (en) * | 1989-12-19 | 1992-05-19 | Matsushita Electric Industrial Co., Ltd. | Outer lead bonding head and method of bonding outer lead |
| JP3013480B2 (ja) * | 1991-03-12 | 2000-02-28 | 安藤電気株式会社 | Ｉｃソケットのｉｃコンタクト機構 |
| US5249450A (en) * | 1992-06-15 | 1993-10-05 | Micron Technology, Inc. | Probehead for ultrasonic forging |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3486223A (en) * | 1967-04-27 | 1969-12-30 | Philco Ford Corp | Solder bonding |
| US3575333A (en) * | 1968-11-21 | 1971-04-20 | Kulicke & Soffa Ind Inc | Beam-lead bonding apparatus |
| US3617682A (en) * | 1969-06-23 | 1971-11-02 | Gen Electric | Semiconductor chip bonder |
| US3695501A (en) * | 1970-05-21 | 1972-10-03 | Automated Equipment Corp | Die bonder apparatus |
| US3699640A (en) * | 1970-12-01 | 1972-10-24 | Western Electric Co | Compliant bonding |
| US3742181A (en) * | 1971-02-25 | 1973-06-26 | Argus Eng Co | Method and apparatus for heatbonding in a local area using combined heating techniques |
-
1974
- 1974-03-13 US US450599A patent/US3883945A/en not_active Expired - Lifetime
-
1975
- 1975-02-10 CA CA219,683A patent/CA1020289A/en not_active Expired
- 1975-03-06 JP JP50027582A patent/JPS50123271A/ja active Pending
- 1975-03-07 FR FR7507214A patent/FR2264395B3/fr not_active Expired
- 1975-03-13 DE DE19752511059 patent/DE2511059A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US3883945A (en) | 1975-05-20 |
| JPS50123271A (enExample) | 1975-09-27 |
| CA1020289A (en) | 1977-11-01 |
| FR2264395A1 (enExample) | 1975-10-10 |
| FR2264395B3 (enExample) | 1978-07-21 |
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| Noth | ALBRECHT ALT | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8141 | Disposal/no request for examination |