DE2334007A1 - Ausstreifloesung und deren verwendung - Google Patents

Ausstreifloesung und deren verwendung

Info

Publication number
DE2334007A1
DE2334007A1 DE19732334007 DE2334007A DE2334007A1 DE 2334007 A1 DE2334007 A1 DE 2334007A1 DE 19732334007 DE19732334007 DE 19732334007 DE 2334007 A DE2334007 A DE 2334007A DE 2334007 A1 DE2334007 A1 DE 2334007A1
Authority
DE
Germany
Prior art keywords
acid
nitric acid
stripping
water
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19732334007
Other languages
German (de)
English (en)
Inventor
Jun George Jay Kelly
Kenneth Harry Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Allied Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Chemical Corp filed Critical Allied Chemical Corp
Publication of DE2334007A1 publication Critical patent/DE2334007A1/de
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338Etching
    • C04B41/5353Wet etching, e.g. with etchants dissolved in organic solvents
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/423Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H01B19/04Treating the surfaces, e.g. applying coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE19732334007 1972-07-10 1973-07-04 Ausstreifloesung und deren verwendung Ceased DE2334007A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27012572A 1972-07-10 1972-07-10

Publications (1)

Publication Number Publication Date
DE2334007A1 true DE2334007A1 (de) 1974-01-24

Family

ID=23030010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732334007 Ceased DE2334007A1 (de) 1972-07-10 1973-07-04 Ausstreifloesung und deren verwendung

Country Status (4)

Country Link
JP (1) JPS5832494B2 (enrdf_load_html_response)
CA (1) CA950339A (enrdf_load_html_response)
DE (1) DE2334007A1 (enrdf_load_html_response)
GB (2) GB1370875A (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5244386A (en) * 1975-10-03 1977-04-07 Yukimasa Okuni Sequential control device
JPH05223961A (ja) * 1992-06-15 1993-09-03 Seiko Epson Corp アラーム状態表示方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4937637A (enrdf_load_html_response) * 1972-08-09 1974-04-08

Also Published As

Publication number Publication date
JPS5832494B2 (ja) 1983-07-13
CA950339A (en) 1974-07-02
GB1409474A (en) 1975-10-08
JPS4946680A (enrdf_load_html_response) 1974-05-04
GB1370875A (en) 1974-10-16

Similar Documents

Publication Publication Date Title
DE2447225C2 (de) Verfahren zum Ablösen von positiven Photolack
EP0000702B1 (de) Verfahren zur Herstellung einer fliessbeständigen Resistmaske aus strahlungsempfindlichem Resistmaterial
DE102004053336B4 (de) Wässrige Ätzmittellösung für Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium sowie Verwendung zur Herstellung von Leiterplatten
DE2501187C2 (de) Entschichtungsmittel und dessen Verwendung
DE2457377C2 (enrdf_load_html_response)
DE3708894A1 (de) Waessriges sol von antimon enthaltender kristalliner fester zinnoxidloesung sowie verfahren zu dessen herstellung
CH639294A5 (de) Verfahren zur herstellung einer durchsichtigen, leitenden schicht auf einem substrat.
DE2264407B2 (de) Flüssigkristall-Anzeigeeinrichtung und Verfahren zu ihrer Herstellung Ausscheidung aus: 2238429
CH661742A5 (de) Loetmittel-entfernungsloesung.
DE69731731T2 (de) Passivierungszusammensetzung und verfahren zum beschichten
DE2949141A1 (de) Verfahren zum verhindern des auslaugens von verunreinigungen aus festen oberflaechen
DE3831574C2 (de) Entfernerlösung für Resists
DE1026874B (de) Selengleichrichter mit Kunststoff-Zwischenschicht zwischen Selen und Gegenelektrode
US3787239A (en) Chemical strippers and method of using
DE3631632C2 (enrdf_load_html_response)
DE2550371A1 (de) Verfahren zum thermischen oxydieren von silicium
EP0675173B1 (de) Pigmentzubereitung für Korrosionsschutzanstrichstoffe
DE2334007A1 (de) Ausstreifloesung und deren verwendung
EP0067984B1 (de) Verfahren zum Ätzen von Chrom und Ätzmittelmischungen zur Durchführung des Verfahrens
DE60001008T2 (de) Zusammensetzung zur Entschichtung von Photolack in der Herstellung von integrierten Schaltungen
DE2632949A1 (de) Ausstreifloesung zur entfernung polymerer organischer substanzen von einem anorganischen substrat
DE1447024C3 (de) Verfahren zur Herstellung eines lichtempfindlichen Aufzeichnungsmaterials und dessen Verwendung
DE2049945C2 (de) Lösungsmittel zum Entfernen von Photolack
DE2001548A1 (de) Verfahren zum Erhoehen der Haftung von Polymeren auf Metallen
DE2410880A1 (de) Verfahren zum herstellen eines maskierenden musters aus photolack

Legal Events

Date Code Title Description
OD Request for examination
8127 New person/name/address of the applicant

Owner name: ALLIED CORP., MORRIS TOWNSHIP, N.J., US

8128 New person/name/address of the agent

Representative=s name: WEBER, D., DIPL.-CHEM. DR.RER.NAT. SEIFFERT, K., D

AF Is addition to no.

Ref country code: DE

Ref document number: 2049945

Format of ref document f/p: P

8131 Rejection